About -Accomplished High Tech Semiconductor Executive.
-International experience: USA, Europe, ASIA.
-Sales Representation, Business Development
SIP (System In a Package) integration: Sensors + Digital Logic + RF + Antenna for IoT, Wearables, M2M
IC and Electronic Systems RE (reverse engineering) services for patent protection and licencing, competitive analysis
Ultrasecure Digital Secutity token, Bitcoin wallet (h/w + s/w)
NVMe IP Core for high performance SSD storage
IC full turnkey Design Services (RTL, Verification, Arm subsystems, Production management)
PUF (Physical Unclonable Function) IP
Security Core IP (Crypto, digital sensor, ...)