1. KRISHNAN VIRACHAMI
2, Lorong Mutiara Jaya 3,
Taman Mutiara Jaya,
14000 Bukit Mertajam.
Penang, Malaysia.
Tell: 6 012 4598540
waja9073@hotmail.com, krishnankvs01@live.com, krishnan.virachami@osram-
os.com
OBJECTIVE
Short Term Goal (<5 years):
To hold a technical and management position in a rapidly growing and fast paced OEM or
EMS environment which would enables me to grow whilst utilize my skills and
capabilities.
Medium Term Goal (>5 Years):
Lead a Department as Director position in a fast and rapidly growing OEM or EMS
environment to lead, share and guide the entire team to high performance and achieve
target set by Company Management Board.
Long Term Goal (>10 Years):
To lead an organization/corporation/company as the MD where set target for higher growth
and further expansion of the company business and also profitability for long term sustaining
of the organization/corporation/company.
PROFESSIONAL EXPERIENCE
Apr 2012
–Present
Specialist Process Integration Engineer – Defect & Yield
OSRAM Opto Semiconductor (M) Sdn. Bhd.
Bayan Lepas FIZ Phase 1, Penang Malaysia.
Current Salary : To Be Provided during interview.
Major Tasks include:
1. Start-up of inline defect inspection methodology by installing Rudolph AXi-940
inspection tool and also Yield Management Software - Discover (From Rudolph
Technologies) in OSRAM Opto Semiconductor in Penang for LED Wafer
Fabrications.
2. Strategies and Implement inline inspection steps on existing and new products
transfer from mother fab in Regensburg at critical process step to identify yield
impact created by defects or process deviations from this critical step.
3. Data analysis by correlating defect to sort failure from electrical testing and
visual inspection to identify accurately total yield loss caused by specific defect
type from specific process by using Discover YMS for existing and new product
to further improve Product Yield.
4. Implement automated deviation management system using existing software
and applications for fast detection of defect and also process deviations.

2. Major Achievements in OSRAM :
• Development of ADC Library for all Products - Reduce manual defect
classification and analysis by 90% using TrueADC from Rudolph Technology.
• Development of SPR (Spatial Pattern Recognition) using Process Sentinel
Software by Rudolph Technologies for all LED Products – Pattern recognition
correlation to Tool and Process which reduces Yield Loss impact by 90% due
to early detection of fault. Estimated saving of RM1 million per annum.
• Implement inline inspection steps on overall 6 Products running in OSRAM
Penang at critical process step identified together with Product Owner.
• Set-up of monthly Defect Density to Yield Correlation - Establish baseline
Defect to Yield Trend for all Products in OSRAM Penang for continuous Yield
Improvement as well as better Yield Management.
• Identify and Lead Yield Improvement - Identify using Discover YMS the top
3 Yield Impacting Defects by Process Layer and Lead Yield Improvement
Team to reduce defect and increase Yield by improving critical process.
• Improved 6 Product Yield so far by average 5% each which results in total
cost saving of RM 5 Million using Discover YMS Software data analysis
whereby easily identify accurately the process causing high Yield Loss during
LED Wafer Fabrication Processes.
• Implement automated deviation management using SPACE SPC software to
fast detection of defect deviation from baseline trends. Managed to show the
benefit thru identified critical DOI which shows high kill rate correlating to
yield loss during sort data testing.
Nov 2005
–Apr 2012
Defect Density Engineer 2 & Formally Operation Engineer 2
Infineon Technologies (Kulim) Sdn. Bhd.
Kulim High Tech Park, Kulim, Malaysia.
Current Salary : RM 4773.00 + Allowance RM 360
Major Tasks include:
1. Part of Infineon Power Fab Start-up Team for Defect Density Operation, Defect
Density Monitoring and Line Block Stability (LBS) Team.
2. Mold and train start-up Operations Engineer and new hire Defect Density
Engineer to fulfill overall Department KPI’s.
3. Establish training material and train Operation Engineers, Line Experts, Defect
Density Assistance Engineer and Defect Density Engineer on daily task which
includes operating and set-up creation on Defect Density Monitoring
equipments like KLA2135, KLA2139, KLA2351, KLA2364, PUMA 9150, ORBOT
WF736, LEICA INS3000, SEMVision, SEMFib G2 and software like Fabcockpit,
Knight Yield Manager (KYM), Quality Monitoring Protocol (QMP), Miniprogram,
Special Inking Editor, Cerberus and etc.
4. Establish and maintain SPC data for Defect Density Monitoring for Automotive
Technology Devices using Western Electrical Rules in Infineon own SPC
Software “SPACE Monitoring”.
5. Core Team member for New Technology Transfer from Europe Mother Fab for
all device which includes Power, ChipCard and Automotive Devices (Specialist
on Defect Density Topic).
6. Capacity planning for Defect Density Scanning Equipment including suitable
equipment selection, technical review of new equipment type, equipment set-
up and production qualify-buyoff owner.

3. 7. Daily Defect Density Equipment Set-Up creation expert on excursion lot’s (non-
Standard Monitoring Scanning) which is part of process equipment breakdown
releasing criteria.
8. Support Production for smooth running of Defect Density Equipment in order to
meet overall production KPI’s by running daily programmed test wafer to make
sure all equipment is in good productive condition and less deviation or drift in
equipment operating condition.
Major Achievements in Infineon :
• Achieved cost saving of USD 100K per quarter on SMART6 Screening Step
Inking Reduction via DD Reduction Project by Implementation of Nanospray
Cleaning instead of Fine sonic Cleaning after Etching Process.
• Implementation of Screening using PUMA SL8 Pixel instead of ORBOT 5X
Objective for Automotive Technology has helped to reduce overall Scan time
per wafer from 9 minutes to 2 minutes which leads to saving of 2 new
ORBOT WF736 Scan tool from capacity model. Overall Cost Saving USD
500K.
• Implementation of alternative scan tool concept for high loading technology
whereby total saving of 2 new KLA2135 by qualifying 4 existing technology
to fully run in KLA2351 with same detection capabilities (Total Scan time
reduce from 10 minutes per wafer to 4 minutes per wafer). Total Cost
Saving USD 500K.
June 2004
to
Nov 2005
Manufacturing Engineer
Quantum Technology (M) Sdn. Bhd.
Bayan Lepas FIZ Phase 1, Penang Malaysia.
Last Drawn Salary : RM 2880.00 + Allowance RM 240
Major Tasks include:
1. Responsible for front end processes like flex circuit attach, plasma cleaning,
wire bonding (Wedge Bonding with Aluminium wire using KNS8060 bonder),
open short testing, manual encapsulation and curing process for tape head
manufacturing process.
2. Team lead for continuous improvement in product quality and process
improvement to reduce manufacturing lead time, rework rate and scraps. This
include in designing new jigs for flex attaching process on tape heads, simplify
jig design for wire bonding and also new design on wire bonding pedestal,
automate encapsulation process from manual to automatic dispensing and
curing and finally improving ESD grounding in testing machines to eliminate
scraps caused by ESD.
3. 8D team member for customer return tape head product whereby in-charge for
root cause analysis and writing a detailed analysis report plus coming out with
a containment action to be submitted to customer.
Major Achievements in Quantum Technology :
 USD 3K per quarter improvement for redesign and implementation of new
wire bonding equipment pedestal design to eliminate flex circuit town due to
stuck to pedestal during wire bonding process.
 Another USD 1.5K per quarter improvement for designing and successfully
implementation of new jig for flex circuit attaching process to the tape head
module which helps to reduce head damage and flex circuit damage by 90%.

4.  Successful implementation and process qualification of automated dispensing
of wire bonding wires encapsulation and UV curing process for all running
products. Total Cost Saving USD 35K.
 Successfully qualified 2 New Product from R&D Phase until reached mass
production stage which includes designing new jigs, creating new wire
bonding programs, collecting data on wire bonding pull and sheer test using
DOE method, creating new SPC monitoring system for wire bonding and
running reliability test like humidity and temperature cycling test.
June 2002
to
June 2004
R&D Engineer (PBGA Division)
SMCi Globetronics Sdn. Bhd.
Bayan Lepas FIZ, Penang, Malaysia
Last Drawn Salary : RM 2200.00 + Allowance RM 200
Major Tasks include:
1. In charge to do fine pattern where we are on a mission to achieve Line Spacing
(L/S 35/35). In order to achieve it we have to study a few parameters which
might influence our fine pattern final results like material expansion and thru-hole
misalignment.
2. Also in charge of optimizing the etching tool parameters in order to achieve the
Line Spacing L/S of 35/35 um and managed to prove that the tool is already
optimized and need new method to further reduce the L/S beyond 35/35.
3. In charge of further developing a new method to further reduce the etching line
spacing to as low as 20/20um. This is done using a new etch back method using
newly developed photo resist and also with reversed plating process.
4. In charge of customer sample analysis whereby I need to compare the sample
provided by customer from other supplier with the sample we produce and submit
to customer. With this we manage to come to the conclusion of where the
company stood compared to its competitor.
5. A part of team for other R&D and improvement projects like :-
- 1-2-1 Build up layer.
- Organic surface protection layer for PBGA ball pad which the main reason is to
change the ball pad from gold to just with bare copper.
- Study the new tool of laser drilling using CO2 technology with vendor Hitachi
in order to reduce the thru hole size from 100um to as low as 60um.
Also study the feasibility study of thru hole filling using copper paste instead of
using conventional process of plating for thru hole size less than 100um.
Major Achievements in SMCi Globetronics :
 Manage to optimize etching process to meet initial target of Line Spacing (L/S
35/35 um) by implementation of new spray nozzle type and improvement of
etching process parameters like etching time and temperature.
 Successfully run lab test to achieve reversed plating process and etch back
process using test design for Line Spacing 20/20um and lower. Managed to
create sample for cross SEM to prove the reversed plating and etch back
method is indeed possible to be done without any new investment on high
tech equipment.
 Successfully evaluated and submit first qualification sample to 3 different
customers on organic surface protection PBGA boards.

5. EDUCATION AND QUALIFICATION
1999-
2002
B.Eng (Hons) Degree in Mechanical Engineering,
University Sains Malaysia (USM)
CGPA Achieved : 3.09 / 4.00 (2nd
Class Upper)
ADDITIONAL SKILLS
Computing Highly competent in all MS Office Application, YMS Software (Knights Yield
Manager from Magma, Discover from Rudolph Technologies & Klarity from
KLA Tencor) and Minitab Data Analysis Software
Project Able to take project through the planning stage to full implementation,
including working on continuous improvement of process and product quality
Language Excellent verbal and written English, Bahasa Malaysia & Tamil
INTEREST AND ACHIEVEMENTS
General
Description
Good communication and interpersonal skills
Honest and willingness to learn and accept responsibilities
Accustomed to working under pressure and long hours.
Systematic, committed, decisive, independent, cooperative and
result oriented.
Affiliations
External
Trainings/Seminar
KLA Tencor’s PUMA 91XX Equipment Application Training
REFEREES
Name: Sritharan
H/P: 012-4778574
Position: Staff Engineer
Company: Benchmark Electronics
Relationship: Former Mentor in Quantum Technology
Name: Ong Chin Seong
H/P: 012-4633210
Position: Staff Engineer
Company: Silterra Semiconductor
Relationship: Former Supervisor in Infineon Technology

6. AVAILABILITY
2 months from Signing of Job Offer Letter
Willingness to Travel Overseas
Yes
Expected Salary
RM 9500.00 (Can be negotiated)

7. AVAILABILITY
2 months from Signing of Job Offer Letter
Willingness to Travel Overseas
Yes
Expected Salary
RM 9500.00 (Can be negotiated)