1. Global Supply ManagementGlobal Supply Management
Members: Samantha Caves, Nicole Clark, Michael Jones,
Michael Keller, Hali MacMillan, Nicholas Schulte
Alternative Supply Line Design for Intel’s
Assembly Test Factory Network

2. Global Supply Management
Intel’s Vision
“If it is smart and connected, it is best with
Intel.”

3. Global Supply Management
Intel’s Mission
“Utilize the power of Moore’s
Law to bring smart, connected
devices to every person on
Earth.”

4. Global Supply Management
Executing Moore’s Law
“Enabling new devices with higher functionality
and complexity while controlling power, cost,
and size”

5. Global Supply Management
Introduction
● Computers and processors are vital to Intel and nearly
all of our daily lives
o Keeping these in proper working order is critical
● What are heat spreaders?
● Sustainable options

6. Global Supply Management
Problem Details
● Heat spreaders manufactured from C101 Copper Alloy
● Goal:
o Determine alternative material
 Meets mechanical properties and cost effective
o Determine supplier selection and sourcing
● Necessary to understand the specs and manufacturing
process

7. Global Supply Management
C101 Copper
● Electrically refined copper alloy
o Contains less than .001 % oxygen
● High thermal conductivity and coefficient of thermal
expansion (CTE)
o 390 - 400 W/mK and 16 - 17 ppm/C
● Worldwide availability
● Stamping makes it cost effective to manufacture
● Commonly used in electronics

8. Global Supply Management
Project Scope
● Separated the project into two parts:
o Material research and selection
o Material sourcing, supplier selection, manufacturing process
● Focus on increasing heat efficiency of Integrated Heat
Spreader (IHS) and lowering cost

9. Global Supply Management
Material Specific Criteria
● Thermal conductivity (W/mK)
● Coefficient of thermal expansion, CTE (ppm/C)
● Dimensions (32mm x 34mm)
● Surface finish (nickel plating/alternative technique)
● Material manufacturing (conflict free)
o Conflict Minerals- Minerals that come from the Democratic Republic of Congo
(DRC), where the profits of these minerals fund violence committed by the
rebel groups
● Cost
● Availability of material

10. Global Supply Management
Initial Material Research
● CuB-42MBD4(120/140)(70/80)
● CuMo
● Aluminum Nitride
● Copper-Tungsten Alloy
● Tungsten Carbide
● Al-Diamond
● CarbAl
● Cubic Boron Arsenide
● Silicon Carbide
● Dymalloy
● Silver Diamond
● Cubic Boron Arsenide
● Copper Graphite
● Natural Graphite
● Aluminum Graphite
● Aluminum Silicon Carbide
Thermal
conductivity
and
dimensions
Research Criteria:

11. Global Supply Management
Short List
● CarbAl
● Copper Graphite
● Aluminum Graphite
● CuB - 42MBD4
(120/140)(70/80)
● Silicon Carbide (C6H)
● Aluminum Diamond
Research Criteria:
Minimum
dimensions,
surface finish,
location and
availability of
material, cost

12. Global Supply Management
Copper Graphite
Material
Name
Thermal
Conductivity
(W/mK)
CTE (ppm/C) Minimum
Material
Dimensions
(32 mm by 34
mm)
Surface
Plating
Material
Production
(location)
Cost/Yield Notes:
C101 Copper 390-400 16-17 Yes Nickel Plated South East
Asia
Cheap/High
Yield
Current material
for heat
spreader
Copper
Graphite
(GR-CU)
265-300 4-7 No Nickel Plated North America Expensive/Low
Yield
Adding graphite
makes the
manufacturing
process more
intense

13. Global Supply Management
CuB-42MBD4(120/140)(70/80)
Material
Name
Thermal
Conductivity
(W/mK)
CTE (ppm/C) Minimum
Material
Dimensions
(32 mm by 34
mm)
Surface
Plating
Material
Production
(location)
Cost/Yield Notes:
C101 Copper 390-400 16-17 Yes Nickel Plated South East
Asia
Cheap/High
Yield
Current material
for heat
spreader
CuB- 42MBD4
(120/140)(70/80)
520-598 10.1/12.4 N/A N/A Dresden,
Germany
Expensive/ Low
Yield
Due to this
material
containing
synthetic
diamonds it is
very expensive

14. Global Supply Management
Aluminum Diamond
Material Name Thermal
Conductivity
(W/mK)
CTE
(ppm/C)
Minimum
Material
Dimensions
(32 mm by
34 mm)
Surface
Plating
Material
Production
(location)
Cost/Yield Notes:
C101 Copper 390-400 16-17 Yes Nickel
Plated
South East
Asia
Cheap/High
Yield
Current material for
heat spreader
Aluminum Diamond 500 6.1-7.9 Yes Nickel
Plated
Europe
North
America
Expensive/
Low Yield
Diamond is very
expensive and hard to
work with

15. Global Supply Management
Top Three Materials
● CarbAl
o Applied Nanotech, Inc.
● Aluminum Graphite
o Mersen
o Schunk Hoffman
o MMCC
o Bracalente
● Silicon Carbide (C6H)
o Genesic
o BayCarbon
o Stanford Advanced Materials
o II-VI Incorporated
o Dow Corning
o Nitride Crystals Group
o SiCrystal AG
o TanKeBlue Ltd.

16. Global Supply Management
CarbAl
Material
Name
Thermal
Conductivity
(W/mK)
CTE (ppm/C) Minimum
Material
Dimensions
Surface
Plating
Material
Production
(location)
Cost/Yield Notes:
C101 Copper 390-400 16-17 Yes Nickel Plated South East
Asia
Cheap/High
Yield
Current material
for heat spreader
CarbAl 350 2 No Nickel Plated Austin, Texas
Applied
Nanotech
Cheap/Low Yield Can be inlayed
and plated in
copper and is
currently being
looked at by
NASA for heat
sink applications

17. Global Supply Management
Aluminum Graphite
Material
Name
Thermal
Conductivity
(W/mK)
CTE (ppm/C) Minimum
Material
Dimensions
Surface
Plating
Material
Production
(location)
Cost/Yield Notes:
C101 Copper 390-400 16-17 Yes Nickel Plated South East
Asia
Cheap/High
Yield
Current material
for heat spreader
AlGrp
(Range is 10-
90% graphite)
324-783 Matched:
Parallel (16.9-
2.5)
Perpendicular
(15.2-10.1)
No Nickel Plated Worldwide
MMCC
Mersen
Expensive/Low
Yield
Further research
suggests that the
manufacturing
process is not
readily available

18. Global Supply Management
Final Material - Silicon Carbide
Material
Name
Thermal
Conductivity
(W/mK)
CTE (ppm/C) Minimum
Material
Dimensions
Surface
Plating
Material
Production
(location)
Cost/Yield Notes:
C101 Copper 390-400 16-17 Yes Nickel Plated South East
Asia
Cheap/High
Yield
Current material
for heat spreader
Silicon
Carbide
360-490 1.2-7.9 Yes Nickel Plated Worldwide
Dow Corning
Stanford
Advanced
Materials
Cheap/High
Yield
Available
worldwide and
meets all
requirements for
alternative
material

19. Silicon Carbide Process Flow - Dow Corning
Crystal Growth
Epi Polish
Stock Polish
Wafer Shaping
Wafer Slicing
Ingot Shaping Epi Growth
Clean/Package
Final Polish
Clean/Package
M
C
Metrology Steps
Cleaning Steps
M
M
M
M
M
M
M
M
C
C
C
C
C
C
Seed Surface
Prep
Seed Slicing
Seed Ingot
Shaping
M
M
M
M C
C

20. Global Supply Management
Stanford Advanced Materials
-SiC Process Flow-

21. Global Supply Management
Cost
● Stanford quoted $11 per unit
o Quantity of 50,000 pieces
● Dow Corning has no bid
o Would need a secondary company
to diamond machine
● Alternate materials meeting
performance requirements are
higher cost than stamped copper

22. Global Supply Management
Major Challenges
● Finding suppliers of high grade SiC
● Working with manufacturers
● Complex manufacturing/machining process
o Competitive cost
● Issues with procuring a sample
● Integrated package performance due to CTE of IHS
● Meeting strict design criteria

23. Global Supply Management
Conclusion
● Many materials with novel properties meeting requirement
o Continue monitoring CarbAl and AlGrp
● Silicon Carbide
o Viable option for large complex operations
o More sustainable than Copper and Gold
o Very strong, low density material
o Uniform structure, most reliable in long run
o High thermal conductivity capabilities
o Can be Nickel plated
 Same laser etching process

24. Global Supply Management
A special thanks to our Intel sponsors,
Sabina Houle and Mark Norwil!
Thank you Intel!

25. Global Supply Management