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Recent Advances in the Reliability of OTFTs




Patrick Too, Herve Vandekerckhove, Guillaume Fichet, M. James Harding, Michael J. Banach


SPIE – 13th August 2012
San Diego
Outline

  • Plastic Logic company introduction


  • Reliability of OTFTs


  • Challenges on the way from Lab to Fab


  • Applications of Plastic Logic technology and
    partnerships




                      SPIE 2012           August 13th 2012   2
The Leader in Plastic Electronics
            Developed lightest, most durable display
            technology available today

            Demonstrated scalability in the first and
            largest production facility

            1-2 year lead over the competition for
            flexible backplane technology

            A single display has 2.8M uniform and
            reliable plastic transistors




                   SPIE 2012               August 13th 2012   3
Company History
                               Display technology Development




10+ transistors         100+ transistors      1.2 M transistors       Colour EPD             2.8 M transistors




                  Research, Process Development & Manufacturing




                                       2000: Cambridge Technology      2008: Dresden Display Factory
     Cambridge University               Center translating research   First plastic electronics factory in
     Cavendish Laboratory                      into products                       the world
     Research in organic electronics


                                                 SPIE 2012                           August 13th 2012        4
R&D and Production Set-Up

                         Technology

                          Transfer
   Cambridge R&D
  Prototype Line (14”)


             Cambridge R&D Prototype Line
                                      Proof of concepts
                                      Highly configurable process
                                      New designs in < 1 month
                                      1” Chips to A4 displays




                           SPIE 2012                August 13th 2012   5
Production Set-Up

                 Technology

                    Transfer

                                  Dresden Factory (Gen 3.5)


           Dresden Gen. 3.5 Factory
                             Backplane Manufacturing
                             Qualified volume process
                             Production equipment
                             Fully Automated Handling
                             Process, Equipment, Integration
                              Engineers
                             Thousands of backplane display
                              modules/week

                    SPIE 2012                 August 13th 2012   6
Electrophoretic Plastic Display




                   SPIE 2012      August 13th 2012   7
Reliability of OTFTs


               SPIE 2012   August 13th 2012   8
Stress Test System Setup




Stress card module

                                 • Fully Automated electrical test
                                   system
                                 • Flexibility in the electrical test and
                                   stress test profiles
                                 • Ability to test in different
                                   environmental conditions
                                 • Capability to test more than 1800
                                   TFTs per day in Cambridge


                     SPIE 2012                  August 13th 2012   9
Stress Test Waveform

                                                 etc              Gate
                                                                  Source




              1 Waveform




Large range of stress test waveforms available to mimic OLED and EPD displays driving
                                    SPIE 2012                 August 13th 2012   10
OTFTs under video rate (60Hz) stress test
             600C annealing                             1200C annealing




  Video rate stressing was done at ambient controlled atmosphere
  Threshold voltage shift is observed under video rate stress test for low
   annealing temperature (600C) of the OTFTs
  The OTFTs show an improvement in the threshold voltage stability after a
   1200C annealing


                                  SPIE 2012                  August 13th 2012   11
Effect of solvents on OTFT stability
             O-Xylene (B.P=1370C)                              Mesitylene (B.P= 1650C)




              Tetralin (B.P=2050C)                          Phenylcyclohexane (2380C)




All samples are annealed in air and stress tested at ambient controlled temperature
                                         SPIE 2012                      August 13th 2012   12
Reliability testing

         Name                Test                             Purpose
      Thermo cycling         TST       Mechanical robustness & CTE mismatch
 High Temperature Storage    HTS       Storage of transport conditions
Advance Humidity Storage     AHS       Stability against Moisture ingress
 Low Temperature Storage     LTS       Storage of transport conditions
    Real World Usage         RWU       Display use in non accelerated mode
Advance Humidity Operation   AHO       Accelerated operation at high humidity
Low Temperature Operation    LTO       Accelerated operation at low temperature
    Ambient Operation        AO        Accelerated operation at ambient conditions
      Solar storage          SOR       Solar robustness
       Altitude test         ALT       Pressure sensitivity




                                    SPIE 2012                    August 13th 2012    13
Challenges on the way from Lab to Fab



               SPIE 2012    August 13th 2012   14
The Manufacturing Challenge
It is one thing to show a single display at a tradeshow…




...quite another to develop a high yield manufacturing process

                          SPIE 2012           August 13th 2012   15
Process learning & Development
       Printing process
                                                                       2008
Thickness mean




                                                                                2009


                                    Thickness mean




       Deposition process
                                                                      2008
Thickness mean




                                                                              2009
                                                     Thickness mean




                            SPIE 2012                                          August 13th 2012
                                                                                             16   16
Progress in Plastic Logic display
            2008                                 2009
        Defects driven
                                           High Quality Display




  Equipment / Process driven




                               SPIE 2012             August 13th 2012   17
Colour Flexible Displays: Now Available

      Display size          1” - 10.7”
  Backplane Grey Levels       4 – 16
       Pixel pitch         up to 225ppi
     Contrast Ratio            12:1
       Thickness          thin as 130 µm
         Weight            down to 11g
         Colour              Available
         NTSC                  2-5%


 Paper-like finish
 Excellent readability
 Colour gamut high enough to
  enable distinguishability
 Bistable enables long battery life




                                                   1280 x 960 Colour Display

                                       SPIE 2012               August 13th 2012   18
Colour Flexible Display




                 SPIE 2012   August 13th 2012   19
Other Plastic Logic Technologies
   Transmissive display                    Thin displays




                          Small displays




                          SPIE 2012               August 13th 2012   20
Plastic Logic Technology in Action
1.                           3.




2.
                              1. The world‘s first plastic organic
                                 electronics factory

                              2. The most robust display on the market

                              3. Plastic Logic display at video rate



              www.youtube.com/plasticlogic
                         SPIE 2012                 August 13th 2012    21
Partnerships

We are looking for further professional partners to enable future applications
and products


Partner areas
• Potential users of Plastic Logic display components
• Technology providers for sensors
• End users for flexible logics
• Materials and equipment suppliers to further progress the technology




                                   SPIE 2012              August 13th 2012   22
Plastic Logic Ltd
  34, Cambridge Science Park
       Cambridge, CB18DG
                 UK
        Tel.: 01223706038
Email: patrick.too@plasticlogic.com
       www.plasticlogic.com




        SPIE 2012                     August 13th 2012   23

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Plastic Logic - Reliability of OTFTs

  • 1. Recent Advances in the Reliability of OTFTs Patrick Too, Herve Vandekerckhove, Guillaume Fichet, M. James Harding, Michael J. Banach SPIE – 13th August 2012 San Diego
  • 2. Outline • Plastic Logic company introduction • Reliability of OTFTs • Challenges on the way from Lab to Fab • Applications of Plastic Logic technology and partnerships SPIE 2012 August 13th 2012 2
  • 3. The Leader in Plastic Electronics  Developed lightest, most durable display technology available today  Demonstrated scalability in the first and largest production facility  1-2 year lead over the competition for flexible backplane technology  A single display has 2.8M uniform and reliable plastic transistors SPIE 2012 August 13th 2012 3
  • 4. Company History Display technology Development 10+ transistors 100+ transistors 1.2 M transistors Colour EPD 2.8 M transistors Research, Process Development & Manufacturing 2000: Cambridge Technology 2008: Dresden Display Factory Cambridge University Center translating research First plastic electronics factory in Cavendish Laboratory into products the world Research in organic electronics SPIE 2012 August 13th 2012 4
  • 5. R&D and Production Set-Up Technology Transfer Cambridge R&D Prototype Line (14”) Cambridge R&D Prototype Line  Proof of concepts  Highly configurable process  New designs in < 1 month  1” Chips to A4 displays SPIE 2012 August 13th 2012 5
  • 6. Production Set-Up Technology Transfer Dresden Factory (Gen 3.5) Dresden Gen. 3.5 Factory  Backplane Manufacturing  Qualified volume process  Production equipment  Fully Automated Handling  Process, Equipment, Integration Engineers  Thousands of backplane display modules/week SPIE 2012 August 13th 2012 6
  • 7. Electrophoretic Plastic Display SPIE 2012 August 13th 2012 7
  • 8. Reliability of OTFTs SPIE 2012 August 13th 2012 8
  • 9. Stress Test System Setup Stress card module • Fully Automated electrical test system • Flexibility in the electrical test and stress test profiles • Ability to test in different environmental conditions • Capability to test more than 1800 TFTs per day in Cambridge SPIE 2012 August 13th 2012 9
  • 10. Stress Test Waveform etc Gate Source 1 Waveform Large range of stress test waveforms available to mimic OLED and EPD displays driving SPIE 2012 August 13th 2012 10
  • 11. OTFTs under video rate (60Hz) stress test 600C annealing 1200C annealing  Video rate stressing was done at ambient controlled atmosphere  Threshold voltage shift is observed under video rate stress test for low annealing temperature (600C) of the OTFTs  The OTFTs show an improvement in the threshold voltage stability after a 1200C annealing SPIE 2012 August 13th 2012 11
  • 12. Effect of solvents on OTFT stability O-Xylene (B.P=1370C) Mesitylene (B.P= 1650C) Tetralin (B.P=2050C) Phenylcyclohexane (2380C) All samples are annealed in air and stress tested at ambient controlled temperature SPIE 2012 August 13th 2012 12
  • 13. Reliability testing Name Test Purpose Thermo cycling TST Mechanical robustness & CTE mismatch High Temperature Storage HTS Storage of transport conditions Advance Humidity Storage AHS Stability against Moisture ingress Low Temperature Storage LTS Storage of transport conditions Real World Usage RWU Display use in non accelerated mode Advance Humidity Operation AHO Accelerated operation at high humidity Low Temperature Operation LTO Accelerated operation at low temperature Ambient Operation AO Accelerated operation at ambient conditions Solar storage SOR Solar robustness Altitude test ALT Pressure sensitivity SPIE 2012 August 13th 2012 13
  • 14. Challenges on the way from Lab to Fab SPIE 2012 August 13th 2012 14
  • 15. The Manufacturing Challenge It is one thing to show a single display at a tradeshow… ...quite another to develop a high yield manufacturing process SPIE 2012 August 13th 2012 15
  • 16. Process learning & Development Printing process 2008 Thickness mean 2009 Thickness mean Deposition process 2008 Thickness mean 2009 Thickness mean SPIE 2012 August 13th 2012 16 16
  • 17. Progress in Plastic Logic display 2008 2009 Defects driven High Quality Display Equipment / Process driven SPIE 2012 August 13th 2012 17
  • 18. Colour Flexible Displays: Now Available Display size 1” - 10.7” Backplane Grey Levels 4 – 16 Pixel pitch up to 225ppi Contrast Ratio 12:1 Thickness thin as 130 µm Weight down to 11g Colour Available NTSC 2-5%  Paper-like finish  Excellent readability  Colour gamut high enough to enable distinguishability  Bistable enables long battery life 1280 x 960 Colour Display SPIE 2012 August 13th 2012 18
  • 19. Colour Flexible Display SPIE 2012 August 13th 2012 19
  • 20. Other Plastic Logic Technologies Transmissive display Thin displays Small displays SPIE 2012 August 13th 2012 20
  • 21. Plastic Logic Technology in Action 1. 3. 2. 1. The world‘s first plastic organic electronics factory 2. The most robust display on the market 3. Plastic Logic display at video rate www.youtube.com/plasticlogic SPIE 2012 August 13th 2012 21
  • 22. Partnerships We are looking for further professional partners to enable future applications and products Partner areas • Potential users of Plastic Logic display components • Technology providers for sensors • End users for flexible logics • Materials and equipment suppliers to further progress the technology SPIE 2012 August 13th 2012 22
  • 23. Plastic Logic Ltd 34, Cambridge Science Park Cambridge, CB18DG UK Tel.: 01223706038 Email: patrick.too@plasticlogic.com www.plasticlogic.com SPIE 2012 August 13th 2012 23