Advanced Packaging Monitor Q2 2021 - Sample

From Technologies to Markets
© 2021
Advanced
Packaging
Quarterly Market
Monitor
Sample
Advanced Packaging
Service 2021

2
• Stefan CHITORAGA
• Analyst
Semiconductor Packaging
› Experience
7+ years in electronics package development and design
› AtYole
Packaging, assembly and substrates
› Education
M.Sc of Engineering in Electroncis and Computer
Science
SEMICONDUCTOR PACKAGING TEAM
Santosh KUMAR
Principal Analyst
› Experience
15+ years in semiconductor industry
› AtYole
Package, assembly and substrates and Manufacturing
› Education
M.Sc in Materials Science and Engineering, Electronics
Packaging
Favier SHOO
Team Lead Analyst
› Experience
8+ years in technology, packaging and manufacturing
› AtYole
› Education
Bachelor in Materials Engineering (Hons)
Minor in Entrepreneurship
VaibhavTRIVEDI
Senior Analyst
› Experience
12+ in electronics business
› AtYole
› Education
M.Sc in Materials Science and Engineering
Advanced Packaging Quarterly Market Monitor | Sample | www.yole.fr | ©2021

Advanced Packaging Quarterly Market Monitor | Sample | www.yole.fr | ©2021 3
ADVANCED PACKAGING MONITOR - EVOLUTION
Advanced Packaging Monitor
Fan out Package Monitor
(Wafer & Panel Level)
WLCSP / Fan-In Package
Monitor
2.5D/3D Stacked
Package
FCBGA Package
FCCSP Package
System In Package (SiP)
Module I
Module III
Module IV
2019 Q4 released
2020 Q1 released
2021 Q1 released
Publication Date
Module II
2020 Q3 released
2020 Q4 released
ModuleV
ModuleVI 2021 Q3

4
ADVANCED PACKAGING MONITOR SCOPE
The main objectives of this monitor are the following:
• Near-term market dynamics on quarterly basis
• Long-term market dynamics for 2020-2026
• CapEx & Capacity per major players
• Market share of major OSAT/Foundry players
• Package ASP per given market/platform
• Device/application adoption for advanced packaging technologies
The Fan-Out,WLCSP / Fan-In, 3D Stacked, FCBGA, and FCCSP markets are studied from the following angles:
• Supply and demand
• End-user applications and key growth drivers/areas
• Process technologies
• Device application Mix
• Production, CapEx, Revenue and Package ASP
• **WLCSP components used in RF-SiP packages are NOT included in theWLCSP category –This will be provided in future
update to the monitor
• 3D stacked package include Logic & DRAM wafers (NEW): 3D Stacked package includes HBM, 3DS DRAM, 3D NAND, 3D
SoC/SoIC, 3D stacked CMOS Image Sensors
• FC package family will be added in future update of the Advanced Packaging Monitor
• Revenue & ASP reflect packaging service only. FinalTest is NOT included.

5
ADVANCED PACKAGING MONITOR METHODOLOGY
Mobile/Consumer etc.
Markets
End systems/
Phones/
Wearables
Device such as
PMIC/ SoC etc.
PackageType
# of Die,
components,
Package
Construction
# of Wafers
OSAT/Foundry
Suppliers
Supplier
market share
per package
Top-down approach
Bottom-up approach
MONITOR
Consumer Automotive
Medical
Industrial
Telecom &
Infrastructure
Mobile

6
© 2019 | www.yole.fr | CS Market Monitor | Q4 2019
KEY TERMS & DEFINITIONS AS USED IN THIS MONITOR
IDM Revenue:
• IDMs such as Intel, Samsung, SK Hynix,TI, and Micron have “in-house” packaging capabilities for internal consumption.
• IDM revenue figures are based on SystemPlus cost models and interviews and cover “packaging services” valuation for internal IDM consumption.
• IDM revenues are estimated figures based on cost models and expert interviews and are NOT from any financial reports.
FCCSP:
• Defined as a package that is processed as strip based typically ranging from 5 x 5 to 13 x 13
• Typical BOM (Bill of Materials) include substrate, mold, solder balls, and in some cases underfill
• FCCSP substrate typically are 2L or 4L substrate and with some ETS based
• FCCSP revenue is defined as services that include wafer backgrinding, die singulation and fc assembly on the substrate and also include bill of materials such as
substrate and assembly materials such as mold.
• FCCSP wafer bumping is separately reported in terms of wafer volume & revenue & supplier market share
FCBGA:
• Defined as a singulated package (Not Strip based processing for assembly)
• Typically larger than 15 x 15 and can go as high as 60 x 60 in high end applications
• Typically includes Lid andTIM 1 (Thermal Interface Material) for cooling purposes
• BOM (Bill of Materials) also include HDI (High Density Interconnect) substrate
• FCBGA revenue is defined as die prep that includes backgrinding, die singulation and fc assembly on the substrate
• FCBGA wafer bumping is separately reported in terms of wafer volume & revenue & supplier market share
WLP:
• Defined as a wafer level package that is processed based on wafer level manufacturing process
• WLP package can have the same package size as the starting die dimensions such as in the case of WLCSP
• WLP package can have increased package size than the die size as seen in many FO (Fan-out) packages.
• WLP package BOM does NOT include any substrate.
• However,WLP BOM can include assembly materials such as backside lamination, mold compound in the case of fan-out package

TABLE OF CONTENTS
▪ KEY METRICS AT A GLANCE 12
▪ Revenue (WLP,WLCSP, FO, 3D, FCBGA, FCCSP)
▪ Shipments (WLP,WLCSP, FO, 3D, FCBGA, FCCSP)
▪ Market Share (WLP,WLCSP, FO, 3D, FCBGA, FCCSP)
▪ Summary of WLCSP, FOWLP & FO-PLP, 3D, FCBGA, FCCSP
market dynamics
▪ SYSTEM DEMAND 36
▪ WLCSP PACKAGE DEMAND 40
▪ FO PACKAGE DEMAND 41
▪ 3D STACKED PACKAGE DEMAND 42
▪ FCBGA PACKAGE DEMAND (NEW) 43
▪ FCCSP PACKAGE DEMAND (NEW) 44
▪ FCCSP PKG MARKET DYNAMICS 46
▪ FCCSP Package Market dynamics – summary
▪ Revenue – historical & forecast
▪ Shipments – historical & forecast
▪ Supplier Market shares (OSAT/FOUNDRY/IDM)/
▪ Long term/Near term dynamics & FC CapEx
▪ FCBGA PKG MARKET DYNAMICS 65
FCBGA Package Market dynamics – summary
▪ Supplier Market shares (OSAT/FOUNDRY/IDM)
▪ Long term/Near term dynamics
▪ 3D STACKED PKG MARKET DYNAMICS 83
▪ 3D STACKED Market dynamics – summary
▪ Supplier Market shares (OSAT/FOUNDRY/IDM)
▪ Long term/Near term dynamics

TABLE OF CONTENTS
▪ WLCSP MARKET DYNAMICS – SUMMARY 99
▪ Supplier Market shares (OSAT/FOUNDRY)
▪ WLCSP ASP per markets & size
▪ Near-term shipment & pricing outlook
▪ Capex & Capacity
▪ FOWLP & FOPLP MARKET DYNAMICS 117
▪ FOWLP/FOPLP Market dynamics – summary
▪ Supplier Market shares (OSAT/FOUNDRY)
▪ FOWLP ASP per markets & size
▪ Near-term shipment & pricing outlook
▪ Capex & Capacity

TABLE OF CONTENTS
▪ PLAYER/MANUFACTURER DETAILS 144
Foundry
▪ TSMC
▪ UMC
IDM
▪ INTEL
▪ SONY
▪ SAMSUNG
▪ TI
▪ MICRON
▪ SK HYNIX
▪ YMTC
OSATs/Substrate Suppliers
▪ SEMCO
▪ ASE w/SPIL
▪ JCET
▪ AMKOR
▪ PTI
▪ TFME
▪ NEPES LAWEH/DECA
▪ CHINAWLCSP
▪ HUATIAN

10
WHO SHOULD BE INTERESTED IN THIS MONITOR
Equipment & material suppliers:
o To identify new business opportunities and prospects
o To understand the differentiated value of your products and technologies
o To identify technology trends, challenges and precise requirements
o To evaluate your Advanced Packaging technologies’ market potential
o To position your company in the market
o To monitor and benchmark your competitors
OSATs, IDMs & Foundries:
o To understand technology trends related to Advanced Packaging platforms
o To spot new opportunities and define diversification strategies
o To understand the overall Advanced Packaging market
o To monitor and benchmark potential competitors
o To understand the supply chains involved in Advanced Packaging
R&D organizations:
o To evaluate the potential of future technologies and products
o Identify market needs for new applications
o To understand the bottle necks of the Advanced Packaging technology and
direct their resources to solve the technical issues
o To identify the best candidates for technology transfers
o To identify the partners for consortia
Financial & Strategic investors:
To identify new business opportunities and prospects
To understand the market potential of Advanced Packaging
To understand which players will benefit from Advanced Packaging adoption
To understand the players that are investing in the Advanced Packaging
business
OEMs & Integrators:
To understand technology trends in Advanced Packaging platforms
To spot new opportunities and define diversification strategies
To understand the overall Advanced Packaging market
To monitor and benchmark potential competitors
To understand the supply chains including the equipment / material suppliers

11
GLOSSARY
Abbreviation Meaning
APE Application Processor Engine
ASIC Application-Specific Integrated Circuit
BEOL Back-end Of Line
BGA Ball Grid Array
CSP Chip Scale Package
DSP Digital Signal Processor
ECD Electro-Chemical Deposition
EMC Epoxy Mold Compound
ePLP embedded Package-level-Packaging
ePoP embedded Package-on-Package
eWLB embedded wafer-level BGA
F2F Face to face
FC Flip-Chip
FCIP Flip-Chip In Package
FO Fan-Out
FOWLP Fan-Out Wafer-level Packaging
FPGA Field-Programmable Gate Array
HDI High Density Interconnect
HPC High Processing Computer
HVM High Volume Manufacturing
HD FO High Density Fan-Out
IC Integrated Circuits
IDM Integrated Device Manufacturers
IO Inputs/Outputs
IP Intellectual Property
Abbreviation Meaning
IPD Integrated Passive Devices
L/S Line/Space
LVM Low Volume Manufacturing
MCM Multi Chip Module
MCP Multi Chip Package
OEM Original Equipment Manufacturer
OSAT Outsource Semiconductor Assembly and Test
PCB Printed Circuit Board
PMIC Power Management Integrated Circuit
PMU Power Management Unit
PoP Package on Package
PVD Physical Vapor Deposition
PWB Printed Wiring Board
QFN Quad flat No lead package
RCC Resin Coated Copper
RCP Redistributed Chip Package
RDL Redistribution Layer
SiP System in Package
SoC System on Chip
TMV Through-Mold-Via
TPV Through-Package-Via
TSV Through-Silicon-Via
UBM Under Bump Metalization
WLCSP Wafer-Level Chip Scale Package
WLFO Wafer-Level Fan Out

OSAT INDUSTRY
DYNAMICS HIGHLIGHTS
(CURRENT MARKET DRIVERS
& CHALLENGES)

13
A RECORDYEAR FOR THE ADVANCED PACKAGING PLAYERS (PACKAGING REVENUE)
• Top Advanced Packaging players saw 15-20% increase in 2020 revenue compared to 2019 and 2021 is
expected to shape up as a “BannerYear” for OSATs.
9 415
5 051
3 951
3 600
2 679
1 623
1 282
1 019
809
784
702
517
507
487
461
437
413
370
358
341
340
314
304
292
226
192
ASE (rev w/SPIL)
Amkor
JCET Group
TSMC
Powertech Technology
Tongfu Microelectronics
Tianshui Huatian Microelectronics
King Yuan Electronics
ChipMOS Technologies
Chipbond Technology
UTAC
Greatek Elec
SFA semicon
Orient Semiconductor Electronics
Hana Micron (Rev w/o Hana Materials)
Sigurd Microelectronics
Carsem
AOI Electronics
Tong Hsing
Formosa Advanced Technologies
Ardentec
Unisem Berhad
Nepes Corporation
Inari Amertron Berhad
Walton Advanced Engineering
Lingsen Precision Industries
TOP 25 Advanced Packaging players ranking by 2020 revenue [M$]
©Yole Développement – July 2021

14
Intel
33%
TSMC
27%
ASE
19%
Samsung
14%
Amkor
7%
ESTIMATED 2021 PACKAGING CAPEX SHARE
2021 CAPEX HIGHLIGHTS FOR ADVANCED PACKAGING PLAYERS
• 2021 is playing out to be a BannerYear for the Advanced Packaging players and they are cranking on
full cylinders with investment in equipment and factory operations with total $10B capex for
packaging infrastructure for FY 2021.
$11 B
$3 500
$2 800
$2 000
$1 500
$700
$500
Intel
TSMC
ASE
Samsung
Amkor
JCET
Estimated 2021 CapEx Spending byTop
Players [M$]

15
TOTAL FC &WL PACKAGING MARKET DYNAMICS - UNITS
-
20 000
40 000
60 000
80 000
2019 2020 2021 2022 2023 2024 2025 2026 2020 - 2026
CAGR
Million
$
FO WLCSP FCBGA FCCSP 3D Stacked
• Overall Advanced Packaging form factors are expected to grow at 6.7% CAGR (2020-2026) with
fcCSP andWLCSP leading in terms of total number of units.

16
TOTAL FC & WL PACKAGING MARKET DYNAMICS - REVENUE
$-
$10 000
$20 000
$30 000
$40 000
$50 000
2019 2020 2021 2022 2023 2024 2025 2026 2020 - 2026
CAGR
FC & WL Package Revenue Forecast (M USD)
FO WLCSP FCBGA (Bumping) FCBGA (Assy & Sub)
FCCSP (Bumping) FCCSP (Assy & Sub) 3D Stacked
• Total Advanced Packaging Revenue is expected to grow at 8.2% CAGR (2020-2026) as 5G,
automotive infotainment/ADAS,AI, Datacenter and wearable application megatrends continue to
thrive the semiconductor eco-system

17
Amkor
10%
ASE
23%
JCET
8%
TongFu (TFME)
3%
PTI
2%
Huatian
4%
Samsung
14%
Others
36%
FCCSP Packaging Service Market Share
FCCSP PACKAGING SERVICE MARKET SHARE (2020 REVENUE)
Others**: Include Memory suppliers, smaller OSATs, direct OEM customers purchasing the substrate.
$5.6B

18
3D STACKED PACKAGE APPLICATION MIX
HBM; 0,21%
3DS; 1,09%
Si Interposer; 0,07%
Foveros; 0,02%
Co-EMIB; 0,00%
3D SoC; 0,00%
3D NAND; 0,10%
24,69%
73,82%
2019 3D Stacked Device Mix
HBM 3DS Si Interposer Foveros Co-EMIB 3D SoC 3D NAND CIS MEMS

19
Amkor
6%
ASE
20%
JCET
5%
TongFu (TFME)
4%
PTI
1%
Huatian
2%
Intel
41%
Others
21%
FCBGATOTAL (BUMPING & PACKAGING SERVICES) 2020 SUPPLIER MARKET SHARE

20
ADVANCED PACKAGING QUARTERLY MARKET MONITOR CONTENT

23

24
WLP MONITOR CONTENT: WLCSP & FO REVENUE PER PLAYER

25
MONITORS AND TRACKS COMBINATION
From module technical content to market forecast and market shares
Advanced Packaging
Quarterly Market
Monitor
Packaging Service
DRAM
& NAND
Quarterly Market
Monitor
Memory Service
Application Processor
Quarterly Market
Monitor
Computing Service
Market Monitors
byYole Développement
› Market shares evaluation
› Market and technology forecasts
TeardownTracks
by System Plus Consulting
› Design win identification
› Technology assessment
Consumer
Phone, Smart Home,Wearable,
Tablet, Computing & Gaming
Combine the expertise of
Yole Développement
and
System Plus Consulting :
with our products, get a deep
understanding on the technology,
market and trends of the
semiconductor industry
Automotive
ADAS, Infotainment, Electrification,
Telematics, Other ECUs

26
Contact our
SalesTeam
for more
information
High-End Performance Packaging:
3D/2.5D Integration 2020
Status of the Advanced Packaging
Industry 2020
Fan-OutWLP and PLP Applications
andTechnologies 2021
WLCSP/ Fan-In Packaging
Technologies and Market 2020
System-in-PackageTechnology
and Market Trends 2021
YOLE GROUP OF COMPANIES RELATED REPORTS
Yole Développement

27
Contact our
SalesTeam
for more
information
RF Front-End Module Comparison
2021 –Vol. 1 – Focus on Apple
YOLE GROUP OF COMPANIES RELATED REPORTS
System Plus Consulting
Apple iPhone 12 series mmWave 5G
Chipset and Antenna

28
Yole Group of Companies, including Yole Développement,
System Plus Consulting and PISEO, are pleased to provide
you a glimpse of our accumulated knowledge.
We invite you to share our data with your own network,
within your presentations, press releases, dedicated
articles and more, but you first need approval from Yole
Public Relations department.
If you are interested, feel free to contact us right now!
We will also be more than happy to give you updated data
and appropriate formats.
Your contact: Sandrine Leroy, Dir. Public Relations
Email: leroy@yole.fr
HOWTO USE OUR DATA?

29
CONTACTS
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+ 1 310 600 8267
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+1 919 607 9839
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Lizzie Levenez - lizzie.levenez@yole.f
+49 151 23 54 41 82
DACH (North Germany,Austria, Switzerland)
Neha CHAUDHURY - neha.chaudhury@yole.fr
+49 172 97 47 248
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+49 69 96 21 76 78
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+49 173 69 43 31
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+81 80 4371 4887
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Korea
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+82 10 4089 0233
Japan
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+81 34 4059 204
Toru Hosaka – toru.hosaka@yole.fr
+81 90 1775 3866
Japan and Singapore
Itsuyo Oshiba - itsuyo.oshiba@yole.fr
+81 80 3577 3042
FINANCIAL SERVICES
› Jean-Christophe Eloy - eloy@yole.fr
+33 4 72 83 01 80
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+1 208 850 3914
CUSTOM PROJECT SERVICES
› Jérome Azémar, Yole Développement -
jerome.azemar@yole.fr - +33 6 27 68 69 33
› Julie Coulon, System Plus Consulting -
jcoulon@systemplus.fr - +33 2 72 17 89 85
GENERAL
› Sandrine Leroy, Public Relations
sandrine.leroy@yole.fr - +33 4 72 83 01 89
› General inquiries: info@yole.fr - +33 4 72 83 01 80
REPORTS, MONITORS &TRACKS
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