• Detailed Photos • Precise Measurements • Material Analysis • Complete Bill of Material • Component Pricing • Image Sensor Detailed Analysis • Manufacturing Process Flow • Supply Chain Evaluation • Manufacturing Cost Analysis • Selling Price Estimation

1. ZF-TRW S-Cam 3
21 rue la Noue Bras de Fer
44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
Continental MFC430TA
Generic Sample for:SP17324 - Bosch - MPC2
SP17323 - TRW S-Cam 3
SP17329 - Continental - MFC400
Bosch – MPC2
This generic sample displays elements from three reports. Each report contains the complete and
detailed analysis of one system only.
A complementary comparison report will be sent everyone who buys reports on these three
cameras in a bundle.

2. Table of Contents
Overview / Introduction 4
o Executive Summary
o Reverse Costing Methodology
Company Profile 6
o Continental
Physical Analysis 8
o Views and Dimensions of the System
o System Opening
o Camera Module
o Image Sensor Board
 Top Side – Global view
 Top Side – High definition photo
 Top Side – Main components identification
 Bottom Side – High definition photo
o Electronic Board
 Top Side – Global view
 Top Side – High definition photo
 Top Side – Main components markings
 Top Side – Main components identification
 Top Side – Other components markings
 Top Side – Other components identification
 Bottom Side – High definition photo
 Bottom Side – Components identification
o CMOS Image Sensor
 Package View and Dimensions
 Package Disassembly
 CIS – Die View
 CIS – Cross-Section
Cost Analysis 46
o Accessing the BOM
o PCB Cost
o CIS Process Characteristics
o Cost Estimation of the ON Semiconductor CIS
o BOM Cost – Electronic Board
o BOM Cost – Image Sensor Board
o Housing Parts – Estimation
o BOM Cost - Housing
o Material Cost Breakdown by Sub-Assembly
o Material Cost Breakdown by Component Category
o Accessing the Added Value (AV) cost
o Details of Electronic Board AV Cost
o Details of Image Sensor Board AV Cost
o Details of the System Assembly AV Cost
o Manufacturing Cost Breakdown
Estimated Price Analysis 77
o Estimation of the Manufacturing Price
Company services 80

3. Overview / Introduction
o Executive Summary
o Reverse Costing
Methodology
Company Profile
Physical Analysis
Cost Analysis
Manufacturing Price
About System Plus
The reverse costing analysis is conducted in several phases:
Reverse Costing Methodology
• The initialization of the analysis
Pictures of the elements to be studied.
Identification of the components.
• Description of the material in the “SYScost+” software
Creation of an “estimation project” of the studied board with SYScost+ software.
Construction of the Bill of Material (BOM).
• Assessing the material
Searching for the price of each reference among distributors and manufacturers.
Assessing the cost of the PCB and of the unaccounted references (unknown by distributors)
The BOM is valued with SYScost+ : price simulation according to the requested quantities.
• Assessing the assembling and test phases
Assembly and test lines are modeled with the SYScost+ software.
The assembly and tests costs are estimated.
• Production cost & selling price
Estimation of the production cost & selling price.
• Report
A report is edited.
SYS.cost+©, is a software tool developed by SYSTEM PLUS CONSULTING to calculate the cost of electronic boards. More information on the
software can be found at www.systemplus.fr.

4. Overview / Introduction
Company Profile
Physical Analysis
o Views & Dimensions
o System Opening
o Image Sensor Board
o Electronic Board
o CMOS Image Sensor
Cost Analysis
Manufacturing Price
About System Plus
Views and Dimensions

5. Overview / Introduction
Company Profile
Physical Analysis
o Views & Dimensions
o System Opening
o Image Sensor Board
o Electronic Board
o CMOS Image Sensor
Cost Analysis
Manufacturing Price
About System Plus
System Opening

6. Overview / Introduction
Company Profile
Physical Analysis
o Views & Dimensions
o System Opening
o Image Sensor Board
o Electronic Board
o CMOS Image Sensor
Cost Analysis
Manufacturing Price
About System Plus
Camera Module

7. Overview / Introduction
Company Profile
Physical Analysis
o Views & Dimensions
o System Opening
o Image Sensor Board
o Electronic Board
o CMOS Image Sensor
Cost Analysis
Manufacturing Price
About System Plus
CIS Die View

8. Overview / Introduction
Company Profile
Physical Analysis
o Views & Dimensions
o System Opening
o Image Sensor Board
o Electronic Board
o CMOS Image Sensor
Cost Analysis
Manufacturing Price
About System Plus
CIS Cross-Section - Overview

9. Overview / Introduction
Company Profile
Physical Analysis
o Views & Dimensions
o System Opening
o Image Sensor Board
o Electronic Board
o CMOS Image Sensor
Cost Analysis
Manufacturing Price
About System Plus
Electronic Board – Top Side – Main Components Markings

10. Overview / Introduction
Company Profile
Physical Analysis
o Views & Dimensions
o System Opening
o Image Sensor Board
o Electronic Board
o CMOS Image Sensor
Cost Analysis
Manufacturing Price
About System Plus
Electronic Board – Top Side – Main Components Identification

11. C O S T
ANALYSIS

12. Overview / Introduction
Company Profile
Physical Analysis
Cost Analysis
o Accessing the BOM
o PCB Cost
o CIS Cost Estimation
o BOM Cost – Electronics
o Housing Parts Estimation
o BOM Cost - Housing
o Material Cost Breakdown
o Added-Value Cost
o Manufacturing Cost
Manufacturing Price
About System Plus
PCB Cost – Electronic Board

13. Overview / Introduction
Company Profile
Physical Analysis
Cost Analysis
o Accessing the BOM
o PCB Cost
o CIS Cost Estimation
o BOM Cost – Electronics
o Housing Parts Estimation
o BOM Cost - Housing
o Material Cost Breakdown
o Added-Value Cost
o Manufacturing Cost
Manufacturing Price
About System Plus
BOM Cost – Electronic Board

14. Overview / Introduction
Company Profile
Physical Analysis
Cost Analysis
o Accessing the BOM
o PCB Cost
o CIS Cost Estimation
o BOM Cost – Electronics
o Housing Parts Estimation
o BOM Cost - Housing
o Material Cost Breakdown
o Added-Value Cost
o Manufacturing Cost
Manufacturing Price
About System Plus
Material Cost Breakdown by Component Categories

15. Overview / Introduction
Company Profile
Physical Analysis
Cost Analysis
o Accessing the BOM
o PCB Cost
o CIS Cost Estimation
o BOM Cost – Electronics
o Housing Parts Estimation
o BOM Cost - Housing
o Material Cost Breakdown
o Added-Value Cost
o Manufacturing Cost
Manufacturing Price
About System Plus
Assessing the Added-Value (AV) Cost

16. Overview / Introduction
Company Profile
Physical Analysis
Cost Analysis
o Accessing the BOM
o PCB Cost
o CIS Cost Estimation
o BOM Cost – Electronics
o Housing Parts Estimation
o BOM Cost - Housing
o Material Cost Breakdown
o Added-Value Cost
o Manufacturing Cost
Manufacturing Price
About System Plus
Manufacturing Cost Breakdown – 1M units

17. Overview / Introduction
Company Profile
Physical Analysis
Cost Analysis
Manufacturing Price
o Financial Ratios
o Manufacturing Price
About System Plus
Estimation of the Manufacturing Price

18. Overview / Introduction
Company Profile
Physical Analysis
Cost Analysis
Manufacturing Price
About System Plus
o Company services
o Feedbacks
o Contact
o Legal
MARKET AND TECHNOLOGY REPORTS - YOLE SÉVELOPPEMENT
• Imaging Technologies for Automotive 2016
• Sensors and Data Management for Autonomous Vehicles report
2015
• Camera Module Industry Report
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
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• Camera Module Industry 2015 – Mobile CCM Technology Review

19. Overview / Introduction
Company Profile
Physical Analysis
Cost Analysis
Manufacturing Price
About System Plus
o Company services
o Feedbacks
o Contact
o Legal
Contact
Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by
industry experts.
Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 30% correction on the
manufacturing cost (if all parameters are cumulated).
These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:
o Consulting and Specific Analysis
– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.
Email: laferriere@yole.fr
– Europe: Lizzie Levenez, Europe Middle East and Africa Business Development Manager, Yole
Développement
Email: levenez@yole.fr
– Japan: Takashi Onozawa, General Manager, Yole Japan & President, Yole K.K.
Email: onozawa@yole.fr
– RoW: Jean-Christophe Eloy, President & CEO, Yole Développement, Email: eloy@yole.fr
o Report business
– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.
Email: laferriere@yole.fr
– Europe: Lizzie Levenez, Europe Middle East and Africa Business Development Manager, Yole
Développement
Email: levenez@yole.fr
– Japan: Miho Ohtake, Japan Sales Manager, Yole K.K., Email: ohtake@yole.fr
– Greater China: Mavis Wang, Business Development Manager, Yole China - Wang@yole.fr
– Rest of Asia: Takashi Onozawa, President & General Manager, Yole K.K., Email: onozawa@yole.fr
o Financial services
– Jean-Christophe Eloy, CEO & President, Email: eloy@yole.fr
o General: Email: info@yole.fr