Set of two reports highlighting new designs and processes from the first two MEMS microphones suppliers In this version of Apple iPhone, Knowles succeeds in integrating two MEMS microphones out of the three present in the phone. The third microphone is from AAC Technologies which was also already present in the previous iPhone version. Apple thus uses the same MEMS microphones suppliers for the iPhone 5S, but each of them modified the design and the manufacturing process of their components to improve them by making them more robust. Compared to the microphone used in the iPhone 5, Knowles major changes include the number of transducers of the MEMS die (impacting directly the die size) and the thickness of the backplate. On its side, AAC Technologies also modified the design of the MEMS die (still supplied by Infineon) and the thickness of key layers. Discover in this set of two reports the latest evolutions from the two MEMS microphone leaders. More information on that report atMore information on that report at http://www.i-micronews.com/reports/iPhone-5S-MEMS-Microphones-Knowles-AAC-Technologies/1/421/

1. iPhone 5 MEMS Microphones© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 1

2. iPhone 5 MEMS Microphones© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 2
Glossary
1. Overview / Introduction 4
– Executive Summary
– Reverse Costing Methodology
2. Company Profile 7
– Knowles Electronics
3. iPhone 5S Teardown 10
4. Physical Analysis 15
– Synthesis of the Physical Analysis
– Physical Analysis Methodology
– Package 18
– Package Views & Dimensions
– Package Opening
– Package Cross-Section
– ASIC Die 32
– View & Dimensions
– Marking
– Process
– Cross-Section
– Process Characteristics
– MEMS Die 43
– View & Dimensions
– Marking
– Dicing
– Bond Pads
– Diaphragm & Backplate
– Cross-Sections
5. Manufacturing Process Flow 91
– Global Overview
– ASIC Front-End Process
– ASIC Wafer Fabrication Unit
– MEMS Process Flow
– MEMS Wafer Fabrication Unit
– Packaging Process Flow
– Package Assembly Unit
6. Cost Analysis 105
– Synthesis of the cost analysis
– Main steps of economic analysis
– Yields Hypotheses
– ASIC Front-End Cost
– ASIC Back-End 0 : Probe Test & Dicing
– ASIC Wafer Cost
– ASIC Die Cost
– MEMS Front-End Cost
– MEMS Back-End 0 : Probe Test & Dicing
– MEMS Front-End Cost per process steps
– MEMS Front-End: Equipment Cost per Family
– MEMS Front-End: Material Cost per Family
– MEMS Wafer Cost
– MEMS Die Cost
– Back-End : Packaging Cost
– Back-End : Packaging Cost per Process Steps
– Back-End : Final Test Cost
– Microphone Component Cost & Price
Contact 127

3. iPhone 5 MEMS Microphones© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 3

4. iPhone 5 MEMS Microphones© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 4
The reverse costing analysis is conducted in 3 phases:
Teardown
analysis
• Package is analyzed and measured
• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin
out, die marking
• Setup of the manufacturing process.
Costing
analysis
• Setup of the manufacturing environment
• Cost simulation of the process steps
Selling price
analysis
• Supply chain analysis
• Analysis of the selling price

5. iPhone 5 MEMS Microphones© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 5

6. iPhone 5 MEMS Microphones© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 6

7. iPhone 5 MEMS Microphones© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 7

8. iPhone 5 MEMS Microphones© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 8

9. iPhone 5 MEMS Microphones© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 9

10. iPhone 5 MEMS Microphones© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 10

11. iPhone 5 MEMS Microphones© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 11

12. iPhone 5 MEMS Microphones© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 12
Reverse costing analysis represents the best cost/price evaluation given the publically
available data, and estimates completed by industry experts.
Given the hypothesis presented in this analysis, the major sources of correction would lead to
a +/- 10% correction on the manufacturing cost (if all parameters are cumulated)
These results are open for discussion. We can reevaluate this circuit with your information.
Please contact us:
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Email: onozawa@yole.fr
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jourdan@yole.fr
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- Fax: (82) 2 2010 8899 – Email: yang@yole.fr