Lithography and Bonding equipment for More than Moore 2021 - Sample

From Technologies to Markets
© 2021
Lithography and
Bonding equipment
for More than
Moore 2021
Market and Technology
Report 2021
Sample

2
• Glossary and definition 2
• Table of contents 4
• Report objectives 6
• Report scope 7
• Who should read this report? 10
• Report methodology 11
• About the authors 12
• Companies cited in this report 13
• What we got right, what we got wrong 14
• Disclaimer 15
• Three-page summary 16
• Executive summary 20
o Three-page summary 21
o Lithography 28
o Permanent bonding 42
o Temporary bonding 53
• Context 63
o More than Moore devices 64
o More than Moore equipment 73
o Players 80
o Market movements 104
o Geopolitical factors 111
TABLE OF CONTENTS
Part 1/2
• Lithography equipment 117
o Lithography adoption in MtM devices 123
o Lithography equipment benchmark 124
o Maskless lithography 140
o MEMS and sensors lithography 148
o Trends and requirements
o Substrate material and size
o Market assumptions and forecast
o Power devices lithography 165
o RF devices lithography 179
o CMOS Image Sensor lithography 195
o Advanced packaging lithography 209
o Focus on panel level packaging
o Focus on panel level packaging
o Lithography equipment market forecast 258
Lithography and Bonding Equipment for More than Moore 2021 | Report | www.yole.fr | ©2021

3
TABLE OF CONTENTS
Part 2/2
• Permanent bonding equipment 270
o Scope of this report 271
o Wafer-to-wafer vs die-to-wafer 272
o Permanent bonding technologies 285
o Permanent bonding adoption in MtM devices 287
o Permanent bonding equipment benchmark 291
o Emerging permanent bonding technologies 294
o MEMS and sensors permanent bonding 297
o 3D stacking and integration permanent bonding 315
o Hybrid bonding definition and adoption
o CIS permanent bonding 327
o SOI and engineered substrates permanent bonding 342
o Permanent bonding equipment market forecast 348
• Temporary bonding equipment 360
• Temporary bonding adoption in MtM devices 361
• Temporary bonding technology and equipment 369
• Emerging temporary bonding technologies 382
• Temporary bonding equipment market forecast 385
• Temporary bonding carrier and adhesive 397
• Summary and outlooks 405
• Yole Group related reports 409
• How to use our data? 412
• Appendix 413
• Yole Corporate presentation 423
Lithography and Bonding Equipment for More than Moore 2021 | Report | www.yole.fr | ©2021

4
This is a subsequent update of the report byYole Développement on Equipment for Lithography and Bonding processes for
More than Moore devices, including MEMS and Sensors, RF, Power, CIS as well as some aspects of Advanced Packaging.
Objectives of this report:
1. To provide the overview on lithography and bonding equipment available on the market for MtM devices
as well as associated processes and their applications.
o State-of-the-art manufacturing processes and dedicated equipment, their challenges and potential
o Emerging manufacturing processes, their roadmap and dedicated equipment adaptation
2. To provide in-depth understanding of the MtM lithography and bonding ecosystem & players.
o Equipment Manufacturers landscape and technology segmentation
o Equipment Manufacturers market presence and market share
with respect to the technology and applications
1. To provide 2020-2026 forecast on the changing MtM lithography and bonding
equipment market
o Equipment technical adaptation,THP and ASP variation
o Market size and equipment adoption forecast in terms of units shipped and revenue
o Market size in terms of overall market presence and detailed 2020 market share
Lithography and Bonding equipment for More than Moore 2021 | Sample | www.yole.fr | ©2021
REPORT OBJECTIVES
Yours needs are
out of the report’
scope?
Contact us for a custom:

5
TaguhiYEGHOYAN
TaguhiYeghoyan PhD., is aTechnology & Market Analyst, Semiconductor Manufacturing at Yole Développement (Yole), within the
Semiconductor, Memory & Computing division.
Taguhi’s mission is to follow daily the semiconductor industry and its evolution. Based on her expertise in this field, especially on the
semiconductor supply chain (processes, materials, equipment and related applications),Taguhi performs technology & market reports
and is engaged in dedicated custom projects.
Prior toYole, she worked in world-class European research centers and laboratories, including imec (Belgium), LMI (Lyon, France) and
LTM at CEA Leti (Grenoble, France).All along her past experiences,Taguhi has authored or co-authored a patent and more than ten
papers.
She has graduated fromWroclaw University of Technology (Poland) and University of Lyon (France).Taguhi also completed her PhD. in
Material Science from the University of Lyon (France).
taguhi.yeghoyan@yole.fr
ABOUT THE AUTHORS
Biographies & contacts

6
GLOSSARY AND DEFINITIONS (1/2)
• ADB Atomic Diffusion Bonding • FEOL Front-End-of-Line
• AiP Antenna in Package • FOWLP Fan-Out Wafer Level Packaging
• ASP Average Selling Price • FOPLP Fan-Out Panel Level Packaging
• AR Augmented Reality • FSI Front-Side Illumination
• VR Virtual Reality • GaAs Gallium Arsenide
• ASIC Application-Specific Integrated Circuit • GaP Gallium phosphide
• BAW Bulk Acoustic Wave • HBT Heterojunction Bipolar Transistor
• BGA Ball Grid Array • HEMT High Electron Mobility Transistor
• BEOL Back-end Of Line • HVM High Volume Manufacturing
• Bi-CMOS Bipolar and CMOS process technology • IC Integrated Circuit
• BSI CIS Back-side illumination CMOS Image Sensor • ICB Impulse Current Bonding
• C2W Chip -to-Wafer (permanent bonding) • IDM Integrated Device Manufacturer
• CIS CMOS Image Sensors • IGBT Insulated Gate Bipolar Transistor
• CMP Chemical Chemical Polishing • IO Inputs/Outputs
• CoO Cost Of Ownership • IP Intellectual Property
• CSP Chip Scale Package • LAB Laser Assisted Annealing
• D2D Die-to-Die (permanent bonding) • LCD Liquid crystal display
• (co) D2W (collective) Die-to-Wafer (permanent bonding) • LNA Low Noise Amplifier
• FBAR Film-Bulk Acoustic Resonator • LTE Long-Term Evolution
• FC Flip-Chip • MtM More than Moore (devices)
• eWLB embedded Wafer Level BGA • MEMS Micro-Electro-Mechanical System

7
Bonding and Lithography Equipment market for More than Moore Devices | Sample | www.yole.fr | ©2021
GLOSSARY AND DEFINITIONS (2/2)
• Mm-wave Millimeter Wave • TC-SAW Temperature-Controlled Surface Acoustic Wave
• MOL Middle-of-Line • TCB Thermo-Compression Bonding
• MUT Micromachined Ultrasonic Transducer • THP Throughput (Wafers-per-hour)
• OEM Original Equipment Manufacturer • TLP Transient Liquid Phase Bonding
• OSAT Outsource Semiconductor Assembly and Test • TTV Total Thickness Variation
• PA Power Amplifier • W2W Wafer-to-Wafer
• PMU Power Management Unit • WLC Wafer Level Cap(ping)
• PCB Printed Circuit Board • WLCSP Wafer Level Chip Scale Package
• PoP Package on Package • WLP Wafer Level Packaging
• RDL Redistribution Layers • WoW Wafer-on-Wafer
• RF Radio Frequency
• RCP Redistributed Chip Package
• Rx Receiver/Receive/Reception
• SAB Surface Activated Bonding
• SAW Surface Acoustic Wave
• SiP System-in-Package
• SoC System-on-Chip
• SOI Silicon-On-Insulator
• SMR-BAW Solid Mounted Resonator Bulk Acoustic Wave

8
3M, AlphaTools,Applied Microengineering (AML),Advanced SystemTechnology
(ast),Adtec Engineering, Amkor, ASE Group, ASML, ASM PacificTechnologies,
Advanced SystemTechnology (ast), Ayumi Industry, Applied Materials,
Broadcom/Avago, BondTech, Brewer Science, Canon, Cello Technology, Circuit
Fabology Microelectronics Equipmnet (CFMEE), Deca, Delphi Laser, Dynatech, EO
Technics, ERS electronic, Eshylon Scientific, EV Group, Hakuto, Heidelberg Instruments,
Intel, Kingyoup Optronics, KLATencor/Orbotech, Kulicke & Soffa (Liteq), Japan Science
Engineering, Micron, Mitsubishi Heavy Industries, Nepes, Nidec, Nikon, Onto
Innovation, Orbotech, ORC Manufacturing, Patrow Technologies, Samsung, SCREEN, SK
Hynix, Silicon Light Machines, ST Microelectronics, SÜSS MicroTec , Shanghai Micro
Electronics Equipment Co (SMEE), SY&SE,Takatori,TAZMO,Tecnisco,Tokyo Electron
Limited (TEL),Tokyo Ohka Kogyo (TOK),TSMC, Ushio,Veeco,Via Mechanics,
and many more…
COMPANIES CITED IN THIS REPORT
Non-exhaustive list

9
REPORT SCOPE
Detailed Equipment and their More than Moore applications
PROCESS STEP APPLICATIONS
EQUIPMENT TECHNOLOGY
Exposure/
lithography
process
Mask aligner
Projection Lithography
(Stepper, Scanner)
Maskless Lithography/
Laser Direct Imaging
Photo-
lithography
Laser process
MEMS &
Sensors
Power
devices
CIS
Advanced
Packaging
Permanent
bonding
W2W
Fusion
bonding
Bonding
process
Temporary
bonding &
debonding
Anodic Bonding
Mechanical debonding
Thermal Slide-off
Laser debonding
Insulating bonding
Metal bonding
Direct
bonding
Intermediate
bonding
Lift-off process
Slide-off process
CIS
Advanced
Packaging:
Advanced
Packaging
FO WLP
3D TSV,
3D memory
MEMS &
Sensors
Power
devices
MEMS &
Sensors
RF
RF
RF
CIS
Surface Activated
/Covalent Bonding
RF
Power
devices
Oxide
Hybrid
Advanced
Packaging
3D TSV,
3D memory
RF

10
2020-2026 EQUIPMENT MARKET FOR MORETHAN MOORE DEVICES
Total Lithography,W2W permanent bonding, temporary bonding & debonding equipment market *
Permanent bonding (W2W and co-D2W)
Lithography
Temporary bonding & Debonding
~$ 1.7B
CAGR 9%
~$160M
CAGR 7 %
~$ 535M
CAGR 13%
~ $ 2.4 B
~$1B
~$259M
>$106M
~ $1.38 B
2020
2026
*New Brand Equipment
**CAGR: Compound Annual Growth Rate
**CAGR2020-2026: 10%

11
HVM EQUIPMENT MAKERS POSITIONING BY PROCESS STEP
Permanent bonding
Temporary bonding
& debonding
Lithography

12
LITHOGRAPHY AND BONDING TOOLSVENDORS REVENUE EVOLUTION
2017 vs 2020 Estimated Revenue for MtM applications
$210M
$360M
CAGR +20%
$254M
CAGR +28%
$1.38B
CAGR + 28%
$661M
2017
2020
$207M
CAGR +47%
$65M
CAGR 3%
$97M
$65M
$122M
$143M
CAGR 14%
$95M
CAGR +103%
$11.4M
$77M
CAGR +27%
$38M
$60M
$34M
$52M
CAGR +15%
$44M
CAGR +58%
$11M
$21M
CAGR +38%
$8M
$8M
CAGR +12%
$6M
$16M
CAGR +59%
$4M
$42.5M
Others

13
2017 2018 2019 2021
WHAT IS NEW IN THE INDUSTRY?
Lithography
(M&A)
Bonding
(M&A and
process)
Xperi announces
Invensas DBI® Ultra

14
CONSIDERED LITHOGRAPHY EQUIPMENT VENDORS LANDSCAPE
Germany
China
Japan
USA
Austria
ProjectionTools
Mask Aligner
Maskless
Lithography/LDI
Singapore
Israel
*For R&D only
*SLM actuators
*
* MasklessTool in R&D level
Non-exhaustive list

15
ANALYSIS OF LITHOGRAPHY TOOL TECHNOLOGIES AND APPLICATIONS
Breakdown on players and application
+ Focus on Maskless Lithography!

16
ANALYSIS OF LITHOGRAPHY 2020 EQUIPMENT MARKET

17
DETAILED 2020-2026 FORECAST FOR MTM LITHOGRAPHY TOOLS
+ Focus on Advanced Packaging!

18
Bonding
alignment
tool only
IDENTIFIED PERMANENT BONDING EQUIPMENTVENDORS LANDSCAPE
Germany
Austria
China
Japan
USA
UK
Taiwan
Switzerland
Start-up
Research or Start-up
LVM or HVM
Non-exhaustive list
Direct bonding
Indirect bonding

19
ANALYSIS OF PERMANENT BONDING 2020 EQUIPMENT MARKET

20
DETAILED 2020-2026 FORECAST FOR MTM PERMANENT BONDING TOOLS

21
IDENTIFIEDTEMPORARY BONDING EQUIPMENTVENDORS LANDSCAPE
Germany
Austria
Japan
USA
Taiwan
Start-up
South Korea
For R&D
China
Non-exhaustive list

22
ANALYSIS OF TEMPORARY BONDING 2020 EQUIPMENT MARKET

23
DETAILED 2020-2026 FORECAST FOR MTM TEMPORARY BONDING TOOLS

24
Contact our
SalesTeam
for more
information
High-End Performance Packaging:
3D/2.5D Integration 2020
6’’ and Below: Small-Dimension
Wafer Market Trends 2020
Bonding and Lithography Equipment market for More than Moore Devices | Sample | www.yole.fr | ©2021
YOLE GROUP OF COMPANIES RELATED REPORTS
Yole Développement
Thinning Equipment Technology and Market
Trends for Semiconductor Devices 2020
Fan-OutWLP and PLP Applications
andTechnologies 2021

25
Contact our
SalesTeam
for more
information
Wafer toWafer Permanent
Bonding Comparison 2018
YOLE GROUP OF COMPANIES RELATED REPORTS
System Plus Consulting

26
Yole Group of Companies, including Yole Développement,
System Plus Consulting and PISEO, are pleased to provide
you a glimpse of our accumulated knowledge.
We invite you to share our data with your own network,
within your presentations, press releases, dedicated
articles and more, but you first need approval from Yole
Public Relations department.
If you are interested, feel free to contact us right now!
We will also be more than happy to give you updated data
and appropriate formats.
Your contact: Sandrine Leroy, Dir. Public Relations
Email: leroy@yole.fr
HOWTO USE OUR DATA?
About Yole Développement | www.yole.fr | ©2021

27
©2019 | www.yole.fr | About Yole Développement
YOLE DEVELOPPEMENT – FIELDS OF EXPERTISE WITHIN 3 MAIN DOMAINS
Semiconductor & Software
o Semiconductor Packaging and Substrates
o Semiconductor Manufacturing
o Memory
o Computing and Software
Power & Wireless
o RF Devices & Technologies
o Compound Semiconductors & Emerging
Materials
o Power Electronics
o Batteries & Energy Management
Photonics & Sensing
o Photonics
o Lighting
o Imaging
o Sensing & Actuating
o Display

28
CONTACTS
Western US & Canada
Steve Laferriere - steve.laferriere@yole.fr
+ 1 310 600 8267
Eastern US & Canada
ChrisYouman - chris.youman@yole.fr
+1 919 607 9839
Europe and RoW
Lizzie Levenez - lizzie.levenez@yole.fr
+49 15 123 544 182
Benelux, UK & Spain
Marine Wybranietz - marine.wybranietz@yole.fr
+49 69 96 21 76 78
India and RoA
Takashi Onozawa - takashi.onozawa@yole.fr
+81 80 4371 4887
Greater China
MavisWang - mavis.wang@yole.fr
+886 979 336 809 +86 136 6156 6824
Korea
Peter Ok - peter.ok@yole.fr
+82 10 4089 0233
Japan
Miho Ohtake - miho.ohtake@yole.fr
+81 34 4059 204
Japan and Singapore
Itsuyo Oshiba - itsuyo.oshiba@yole.fr
+81 80 3577 3042
Japan
Toru Hosaka – toru.hosaka@yole.fr
+81 90 1775 3866
FINANCIAL SERVICES
› Jean-Christophe Eloy - eloy@yole.fr
+33 4 72 83 01 80
› Ivan Donaldson - ivan.donaldson@yole.fr
+1 208 850 3914
CUSTOM PROJECT SERVICES
› Jérome Azémar, Yole Développement -
jerome.azemar@yole.fr - +33 6 27 68 69 33
› Julie Coulon, System Plus Consulting -
jcoulon@systemplus.fr - +33 2 72 17 89 85
GENERAL
› Sandrine Leroy, Public Relations
sandrine.leroy@yole.fr - +33 4 72 83 01 89
› General inquiries: info@yole.fr - +33 4 72 83 01 80
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