Lithography technology and trends for « Semiconductor frontier » Mask aligners are the fastest lithography technology Stepper technology provides the best resolution Key requirements for Advanced Packaging LED manufacturers use small diameter wafers (2”, 3”, 4” or 6”) and transition more rapidly than traditional semiconductor’s industry to larger diameters WAFER SIZE Wafer bow can reach up to 50μm for 2” wafers and 100μm for 4”, inducing pattern distortion. WAFER BOW 2” 4” 6” LED manufacturers can use different substrates, mostly sapphire or SiCwafers, which are transparent with light-diffusing features such as rough or patterned surfaces. Also, they can use metal wafers for vertical structures, so there’s large material variability.

1. July © 2016
From Technologies to Market
Lithography
technology and
trends for «
Semiconductor
frontier »
Amandine PIZZAGALLI,Technology & Market Analyst
Yole Développement
From Technologies to Market

2. 2
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OUR GLOBAL ACTIVITY

6. 6
TABLE OF CONTENTS
Lithography technology and trends for « Semiconductor frontier »
• Overview of the lithography technologies
• Lithography requirements in the Semiconductor frontier
• Lithography equipment suppliers in the Semiconductor frontier
• Conclusions

7. 7
• There are five main technologies available that could be used in Advanced Packaging, MEMS and
LED applications :
• Laser direct imaging and laser ablation could be alternative solutions to the lithography technologies
used today
Lithography technologies for Advanced Packaging,
MEMS & LEDs
Mask aligner Projection
Stepper
Scanner*
Laser direct imaging Laser ablation NanoImprint
(NIL)
OVERVIEW OF LITHOGRAPHY TECHNOLOGIES
Today,
patterning is
performed by
various
photolithogra
phy solutions
such as mask
aligners,
projection
steppers and
scanners.
In production
In production
In production
Qualification in
Fan-out wafer
level packaging
(FO WLP)
Ready for production
Disruptive technologies
Current technologies
*We consider scanners as projection systems with full field exposure: full field refers to the maximum used field size: it could either result in printing the full wafer (LEDs case) or the
largest die size (Advanced Packaging)

8. 8
WHAT IS THE PRICE/COST GAP?
From a
technical
feature
perspective,
steppers are
very
attractive but
there is a
price penalty
to pay
Price ($M)
Resolution (µm)
$1M
$2M
$3M
$4M
Mask Aligner
Wafer
Stepper
Wafer/Panel
Scanner
Wafer
Laser
ablation
Wafer/Panel
1 µm 2 µm 3 µm 4 µm
Laser Direct
Imaging
Wafer/Panel
>5 µm

9. 9
LITHOGRAPHY EQUIPMENT TECHNOLOGY
Price vs Resolution capabilities
Mask aligners
are the
fastest
lithography
technology
Stepper
technology
provides the
best
resolution
Throughput (Wafer/hour)
Resolution (µm)
20
50
80
100
Stepper
~50-60 Laser
ablation
~20 to 60
(depending on
the material
type)
1 µm 2 µm 3 µm 4 µm
Scanner*
Wafer
~75
Mask Aligner
~100
>5 µm
* Scanner: full field mask with a large DOF as provided by SUSS MicroTec
We considered ASML and Canon’s equipment lines as steppers exhibiting a higher resolution but smaller DOF

10. © 2016
Lithography requirement in
the Semiconductor Frontier

11. 11
Resolution
Wafer handling for Non-
Standard substrate shape
Die
shift
Wafer
bow
Sidewall
coverage
IR alignment
capability
Exposure
field size
Larger
depth
of focus
Overlay
accuracy
LITHOGRAPHY CONCERNS ARE DIFFERENT IN ADVANCED PACKAGING
Differentiation between Front-end and Advanced Packaging
Needs and
challenges in
packaging
lithography
are different
from front-
end
lithography
Major concerns in packaging
Key requirements which
are different from the
Front-end area

12. 12
GENERAL LITHOGRAPHY REQUIREMENTS
Value required
Key
requirements
for Advanced
Packaging
Minimum resolution: 2 µm
Overlay accuracy: 0.5 µm (layer to layer)
Exposure field size: > 35 mm²
IR alignment: < 1µm
Depth of focus: >15 µm
Wafer warpage: 10 mm
CD control/sidewall angle: <10%/80°
General Lithography
requirements for
Advanced Packaging

13. 13
MEMS & SENSORS’ LITHOGRAPHY NEEDS
Very
accurate
layer-to-layer
alignment
required
• MEMS manufacturing includes DRIE steps with thick resist so high DOF is needed for
projection systems
• As spray coating will be used, adjustable focal-length exposure tools will also be needed :
• e.g. mask aligners from SUSS MicroTec with its illumination set-up changes
• e.g. Nikon mini-steppers that enable varied topography (up to 26 µm DOF) and bow, with die-by-
die autofocus and backside alignment of ~ 0.8 µm.
• In recent years, we have therefore seen an increasing use for steppers instead of mask
aligners:
• Steppers have very accurate layer-to-layer alignment, 0.1µm, ten times better than contact
• This is critical for MEMS where misalignment of mechanical features will lower performance, for
example in gyros and micro mirrors

14. 14
REQUIREMENTS AND CHALLENGES OVERVIEW
Four main
areas
LED manufacturers use small diameter wafers (2”, 3”,
4” or 6”) and transition more rapidly than traditional
semiconductor’s industry to larger diameters
WAFER SIZE
Wafer bow can reach up to 50µm for 2” wafers and
100µm for 4”, inducing pattern distortion.
WAFER BOW
2” 4” 6”
LED manufacturers can use different substrates, mostly
sapphire or SiC wafers, which are transparent with
light-diffusing features such as rough or patterned
surfaces.Also, they can use metal wafers for vertical
structures, so there’s large material variability.
MASK ALIGNMENT / OVERLAY
Depending on the type of lithography process, die
manufacturing vs. PSS manufacturing vs. die surface
texturing, resolution can vary.
RESOLUTION
5µm 2µm
Broken

15. 15
ADVANCED PACKAGING PROJECTION SYSTEMS
Advanced Packaging projection systems breakdown 2015 vs 2020
Projection
steppers
represent the
majority of
lithography
systems used
for Advanced
Packaging

16. 16
MASK ALIGNERSVS STEPPERS
Mask
aligners
represent
the majority
of projection
systems
used for
MEMS
devices
Mask aligners are mainly used for non-CMOS processes in MEMS devices
Steppers are used for the CMOS part of MEMS devices or for the most challenging lithography step
By
revenue
By
revenue
In 2015

17. 17
MASK ALIGNERSVS STEPPERS
Mask
aligners
represent
the majority
of projection
systems
used for
LEDs
Mask aligners are mainly used for LED manufacturing
Steppers are used for Patterned Sapphire Substrates (PSS), with feature sizes below 2-3µm
Steppers are mainly refurbished tools provided by Nikon at a lower cost ($250k for 2-4 inch)
However, we have seen an investment in new stepper equipment from Ultratech for PSS applications at a
higher cost ($1.2M for 2-4-6 inch)
In total
equipment
shipment
In 2015

18. 18
LITHOGRAPHY TECHNOLOGY LIFE CYCLE
Mask
aligners are
in decline in
packaging,
while many
technologies
are emerging
R&D Qualification Maturity Decline
Technology
Phases
Legend
Mask aligner
Stepper
Laser direct imaging (LDI)
Ready for pre-
production
Advanced
Packaging
MEMS
devices
LED
devices
Mask aligner
Mask aligner
LDI
LDI
Stepper
Stepper
Stepper
Laser ablation
Laser ablation
NanoImprint Lithography (NIL)
NIL
NIL

19. 19
0
50
100
150
200
250
2014 2015 2016 2017 2018 2019 2020
Toolshipmentforecast(inunits)
Projection Systems market forecast
(in unit of production tools)
Breakdown by application field
Advanced Packaging MEMS devices LED devices
Yole Developpement © July 2015
LITHOGRAPHY EQUIPMENT MARKET FORECAST
Number of production tools
Advanced
Packaging
represents
around a
third of the
projection
systems
shipped in
2014 and has
the highest
CAGR (10%)

20. © 2016
Lithography equipment
suppliers in the
Semiconductor frontier

21. 21
Advanced Packaging (all advanced
packaging platforms included)
MEMS devices LED devices
EQUIPMENTSUPPLIERS
Mask aligner
Projection
(Stepper &
scanner)
Laser ablation
Laser direct
Imaging
NIL
Stepper
NIL
Full-field
NIL
DTL
STRONG COMPETITION INTHE LITHOGRAPHY AREA: HOW CAN NEW EQUIPMENT
VENDORS ENTERTHE MARKET AND BECOME SUCCESSFUL?

22. 22
PROJECTIONTOOLVENDORS: POSSIBLE RESHAPING OF THE INDUSTRY
There are
barriers to
entry for
both front-
end and
back-end
lithography
vendors
Front-End area
(Mainstream)
Back-end areaNiche areas
(MEMS, LEDs, Advanced Packaging)
Projection
system
equipment
players
Barrier to entry Barrier to entry
DOF
Field
size
Cost of the
tool
Resolution
Overlay
THP
Wafer
warpage

23. 23
LITHOGRAPHY EQUIPMENT TECHNOLOGY
Price vs Resolution capabilities
Top-tier vs
specialized
equipment
vendors
Price ($M)
Resolution
(µm)
$1M
$2M
$3M
$4M
1 µm 2 µm 3 µm 4 µm
Laser ablation
>5 µm

24. 24
EQUIPMENT SUPPLIERS’ MARKET SHARES
Market share by application covered in the report
Lithography
vendors’
market
shares
across
Advanced
Packaging,
MEMS and
LED devices
Advanced Packaging MEMS devices LED devices
Ultratech
58%
SUSS MicroTec
12.5%
Rudolph
9.5%
Canon
9%
SMEE
9%
Others, 2%
SUSS MicroTec
60%
Ushio
18%
EVG
22%
SUSS MicroTec
22%
Ultratech
60%
EVG
12%
Ushio, 6%

25. © 2016
The Last Word …

26. 26
CONCLUSIONS
• Advanced Packaging has very complex technical specifications which differ from those
associated with the front-end area.
• MEMS and LED have relaxed specifications compared to the packaging area.
• MEMS photolithography market benefits from a high percentage of re-
used/retrofitted equipment coming from the mainstream front end semiconductor
industry.
• The LED industry historically uses a lot of legacy semiconductor tools from ASML,
Canon and Nikon
• However, new lithography techniques (NIL) are being developed to answer the specific
challenges and to increase manufacturing yields of large diameter PSS.
• There is a compromise between cost effectiveness and better performances that is
becoming increasingly important in the photolithography business
• Although mask aligner and steppers are already well established, disruptive
technologies such as laser direct imaging (LDI) and laser ablation might emerge and
could contribute and gain a small market share in coming years.

27. 27
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Amandine Pizzagalli
Email: pizzagalli@yole.fr

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