Machine Vision for Industry and Automation 2018 Report by Yole Developpement

© 2018
From Technologies to Markets
MachineVision for
Industry and
Automation
Sample

©2018 | www.yole.fr | Machine Vision for Industry and Automation | Sample 2
TABLE OF CONTENTS
• GLOSSARY 2
• TABLE OF CONTENTS 3
• REPORT OBJECTIVES 5
• SCOPE OF THIS REPORT 9
• EXECUTIVE SUMMARY 14
• 1. INTRODUCTION 25
• 2. MARKET FORECAST 56
• By segments and applications
• Shipment volume 2016-2023 for Machine Vision cameras
• Shipment volume 2016-2023 for Automatic Data Capture camera modules
• ASP forecast 2016-2023 for Machine Vision cameras
• ASP forecast 2016-2023 for Automatic Data Capture camera modules
• Revenue forecast 2016-2023 for Machine Vision cameras
• Revenue forecast 2016-2023 for Automatic Data Capture camera modules
• By segments, applications, and technologies (CCD, CMOS, GS, RS, linear and area
sensors)
• Revenue forecast 2012-2022 for Machine Vision & Automatic Data Capture image
sensors
• 3. SUPPLY CHAIN 85
• Supply chain for cameras
• Supply chain for image sensors
• 4. APPLICATIONS 99
• Scientific applications
• Factory automation
• Agriculture applications
• Surveillance
• Logistics
• Robotic vehicles
• 5. APPLICATION FOCUS 127
• Food sorting
• Automatic Numerical Plate Recognition
• Robotic cars
• 6.TECHNOLGIES 147
• Board-Level cameras
• Camera software
• 3D imaging
• Hyperspectral imaging
• Camera interfaces
• The Shift from CCD to CMOS
• Global shutter technology
• Backside illumination technology
• IR and UV Sensitivity
• Scientific CMOS
• 7. GENERAL CONCLUSIONS 184
GS: Global shutter
RS: Rolling shutter

3
3M,Adimec,AlliedVision Technologies (AVT), ams,ARH Inc.,Axis AB, Banner Engineering, Basler, Basler AG, Baumer Electric AG,
BaySpec, Bosch Security Systems , Brandywine Photonics, Buhler GmbH, CA Traffic Limited , Chromasens GmbH, Cognex Corp.,
Compac, Cubert GmbH, Daewon GSI Co,. Ltd., Datalogic, Delta Optical Thin Film A/S, Delta Technology Corp., Digital
recognition, ELSAG, FLIR Integrated Imaging Solutions Inc. , Flo-Mech, Genetec Inc. , Gilden photonics, Hamamatsu Photonics,
Hamamatsu Photonics, Hamamatsu Photonics KK, Headwall Photonics, Hefei Angelon Electronics Co., Hefei Growking
Optoelectronic Technology Co., Hefei Meyer Optoelectronic Technology Inc., Hefei Taihe Optoelectronic Technology, Hitachi
Kokusai Electric Inc., Honeywell, HySpex, IC Intracom, ifm electronic GmbH, Imaging Development Systems GmbH (IDS), JAI A/S,
Jenoptik Traffic Solutions UK Ltd., Key technology, Keyence, Leica Microsystems, LMI Technologies, Lumenera Corp., Matrox, MAV
Systems, Microscan Systems, Inc. , Motorola, NDI Recognition Systems Ltd. (NDI-RS), Neology Inc. , NET GmbH , Nikon, Nippon
Electro-Sensory Devices Corp. (NED), Nippon Electro-Sensory Devices Corporation, Northrop Grumman, Olympus
Corporation, Omron , Omron Sentech Co., ON Semiconductor, Photometrics, Pixelteq, Q-Free ASA , Quercus Technologies ,
Resonon, Satake Group, Sesotec GmbH, Sick AG, Siemens AG, Smartek vision, Sony Imaging Products & Solutions Inc., Sony
Semiconductor Solutions Corporation, Specim, Stemmer Imaging, SVS-Vistek GmbH, Symbol,Tattile SRL,Teledyne Dalsa,Teledyne
e2v,Teledyne e2v,Thorlabs,Tomra Sorting Solutions,Toshiba Electronic Devices and Storage Corporation,Toshiba Teli Corp.,
Unitech Electronics Co.,Viavi Solutions,Vieworks Co.,Vision Components GmbH,Wasp Barcode Technologies, Xenics, Ximea
GmbH, Zebex Industries Inc., Zebra Technologies and more …
COMPANIES CITED IN THE REPORT
©2017 | www.yole.fr | Status of the CMOS image sensor industry

4
ABOUT THE AUTORS OF THIS REPORT
Biography & contact
Pierre Cambou
From 1999, Pierre Cambou has been part of the imaging industry. Pierre took several positions atThomsonTCS which became
Atmel Grenoble in 2001 and e2v Semiconductors in 2006. In 2012 he founded a start-up calledVence Innovation (now Irlynx) in
order to bring to market a disruptive Man to Machine interaction technology. He has an Engineering degree from Université de
Technologie de Compiègne and a Master of Science fromVirginiaTech. More recently he graduated with an MBA from Grenoble
Ecole de Management. He joinedYole Développement as Imaging Activity Leader in 2014.
Contact: cambou@yole.fr
Dr. Alexis Debray
Dr. Alexis Debray is aTechnology and Market Analyst atYole Développement (Yole).As a member of the MEMS & Sensors
Business Unit,Alexis is today engaged in the development of technology and market reports as well as the production of custom
consulting projects dedicated to the imaging industry.
After spending two years at the University ofTokyo developing expertise focused on MEMS technologies,Alexis served as a
research engineer at Canon Inc. Over 15 years he contributed to numerous projects of development, focused on MEMS devices,
lingual prehension,and terahertz imaging devices.
Alexis is the author of various scientific publications and patents. He graduated from ENSICAEN, and holds a PhD in applied
acoustics.
Contact: debray@yole.fr

6©2018 | www.yole.fr | Machine Vision for Industry and Automation | Sample
SCOPE OF THIS REPORT
Industrial machine vision value chain overview
The number
of players
increases as
we reach the
end users.
END
USERS
< 10 players
TPSCo, ON Semi,
Teledyne Dalsa, Sony,
Lfoundry, DB HiTek,
Espros, STMicro,
Hamamatsu.
≈ 100 players
Hundreds of players Thousands of players
< 10 players
Teledyne e2v ,Sony,
Teledyne Dalsa, ON
Semi, AMS, Hamamatsu,
Toshiba.
CMOS/CCD
foundries
Image sensor
suppliers
Camera suppliers
Optics
manufacturers
Lighting
manufacturers
Resellers &
distributors
Machine Vision
system integrators
Vision system
suppliers (OEM)
IC chips
manufacturers
Interface
manufacturers

Applications
Machine
vision
technologies
expands into
various fields.
Medical
Sport,
Entertainment
Robotic
vehiclesMicroscopy
Logistics
ANPRAgriculture
Factory
automation
OUT OF SCOPE
IN SCOPE
ANPR: Automatic Number Plate Recognition
Other

MACHINEVISION COMPETITIVE LANDSCAPE 2017
MV Camera Player
Suppliers
Lens set vendors
Sensor vendors
Data & Power Management
New Entrants
Substitute technologies
Buyers
Automotive
Electronic - Semiconductors
Illumination

GLOBAL TRENDS IN MANUFACTURING
Added value
of manufactu-
ring has been
globally
growing 3.7%
between 2008
and 2013.
Machine vision for factory automation relates to the variation of world manufacturing
added value and to the penetration of automation.

MARKETS OF INDUSTRIAL CAMERAS
Looking at applications in 2016
Industrial
cameras
expand in
various
applications
with various
size and
dynamics.

EVOLUTION OF INDUSTRIAL CAMERAS
Industrial
cameras are
evolving in
two opposite
directions:
smart
cameras and
board
cameras.
PC-based Machine
Vision system
Industrial smart
camera
Industrial board
camera
The PC-based machine vision system is
the original one.
In terms of performances, it is still the
one which offers the best performances
and the best flexibility.
The industrial smart camera is an evolution of the
PC-based machine vision system. It is an
integrated system with on-board computing
capabilities. For the user, it is much more easier
to implement than the PC-based system.
However, its flexibility and performances are
limited.
Industrial board cameras are a recent
evolution of industrial cameras.The
transition from CCD to CMOS has
resulted in a simplification of the camera
components, the camera being reduced
to a single board.
The industrial camera allows integration
into new systems and might be an
important part in the next evolution of
machine vision.
More features
Naked

CAMERA FORECAST

SENSOR TECHNOLOGY FORECAST

BOARD-LEVEL CAMERAS
The camera that is no more a camera.
The board-
level camera is
a new step in
minimal
cameras.
Courtesy of Ximea
CMOS
image sensor
USB controller
Memory
USB 3Vision
connector
FPGA
Board-level cameras are the direct consequence of the transition from CCD to CMOS.

HYPERSPECTRAL IMAGING
Trends in hyperspectral imaging
Hyperspectral
cameras and
market have
greatly
evolved in 30
years.
Market size
$200 million
+15% growth
Camera size
Camera price
The breakthrough
of smart cameras
Year 2016
Applications:
•Airborne
•Industry
•Mobile
Year 1996
Start of hyper-
spectral cameras
Hyperspectral
cameras as a
platform

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There is a silent revolution going on in factories.
The transformative forces we are facing are
similar to what happened during the previous
industrial revolutions. But this transformation
is not about steam or electricity. Today’s trend
is autonomous and on-demand processes, for
humans and machines alike. Inside factories
the transformation is about automation
and machine vision is often the key enabling
technology.
Machine vision (MV) is at the heart of this
automation revolution. The MV camera market
will grow from $2B in 2017 to roughly $4B in
2023, with a 12% Compound Annual Growth
Rate (CAGR). Machine vision for industry and
automation is not limited to robotics, but is
involved in almost all machines and aspects of
the manufacturing cycle. The need for quality
has boosted MV in the automotive, electronic,
semiconductor, food, and packaging industries.
Food sorting is an interesting example of this
push toward automation. The ability to sort
fruits and food in general has helped to grow
agro-food business revenues, especially in
Asian markets. Indeed, MV has moved out of
the factory. It is now on farms, on roadways for
license plate recognition, and more recently in
autonomous cars, the market for which we
expect to grow at 140% CAGR starting this
year.
These dynamics are here to stay. At the
time of our last report, in 2014, the Swatch
Group announced its Sistem51, the world first
mechanical watch whose manufacturing is
fully automated. Since then, other companies
have made similar moves, such as Canon in
camera manufacturing and Foxconn who
announced the deployment of a million robots
for manufacturing consumer electronic goods.
Sales of automation products are therefore
surpassing the growth of industrial production.
The trend could accelerate in the future
while cheap human labor is scarce in western
countries and China is also increasing wages.
MACHINE VISION FOR INDUSTRY AND AUTOMATION 2018
Market & Technology report - February 2018
MACHINEVISION IS AT THE HEART OF THE AUTOMATION REVOLUTION
Machine vision is at the heart of the automation revolution.
KEY FEATURES OF THE REPORT
Get the sample of the report
on www.i-Micronews.com
• Market forecast for machine vision
cameras through 2023
• Market forecast for machine vision
image sensors through 2023
• Market shares for PC-based
cameras, smart cameras, data
capture camera modules, and
related image sensors
• Description of machine vision
applications
• Description of machine vision
technologies
• Focus on food sorting, license plate
recognition, and robotic vehicles
OBJECTIVES OF THE REPORT
• Market trends and forecasts
• Key players for cameras and image
sensors
• Application diversity
• Synergy between image sensor
technology, camera technology,
and other technologies
• Technology trends
• New applications such as food
sorting and robotic vehicles
(Yole Développement, February 2018)
Forecast for machine vision cameras market in its main applications
Factory
automation
$1.1B
Factory automation
$1.4B
CAGR 4%
Robotic vehicles
$900M
CAGR 140%Robotic vehicles
$5M
Scientific
$64M
Scientific
$90M
CAGR 6%
Agriculture
$54M
Agriculture
$142M
CAGR 17%
Surveillance
$171M
Surveillance
$252M
CAGR 7%
2017
$1.4B
2023
$2.8B
Area is proportional to market size. The forecast MV market in 2017 is $2B and $4B in 2023, only the main applications are included in this graph.
CAGR 12%
HIGHLY DYNAMIC MARKET AND PLAYER ECOSYSTEM
The automation revolution has created a highly
dynamic market and player ecosystem. In the
three years from 2014 to 2017, merger and
acquisition (MA) activity has accelerated in
MV both at image sensor and camera level.
Among the latest examples of this trend are
FLIR acquiring Pointgrey for $215M in 2016,
and Teledyne acquiring e2v for $790M in
2017. Other notable acquisitions are ams’
acquisition of CMOSIS for $235M in 2015,
and a little earlier in 2014 ON Semiconductor
consolidation of Aptina for $400M and
Truesense for $90M. Most recently, private
equity firm Lakesight aggregated MV camera

MACHINE VISION FOR INDUSTRY AND AUTOMATION 2018
FROM CCD TO CMOS: MAJOR MODIFICATION AT THE CAMERA LEVEL THAT
MIGHT LEAD TO THE EMERGENCE OF NEW PLAYERS
On the technology side, the transition from CCD
to CMOS image sensors has greatly simplified
camera design, trending toward commoditization.
The integration of camera functions into the
CMOS image sensor has also led to cameras fitting
on a single board. This single board camera in turn
places MV camera players higher in the supply
chain. Consequently, we could see new camera
players integrating these board cameras into new
systems, applications, and smart cameras.
Integrating cameras into systems and smart
cameras have also been boosted by technologies
coming from smartphones. Systems-on-chips
(SoCs) and the Mobilie Industry Processor
Interface (MIPI) make it much easier to develop
A crossroads for machine vision
2017 Machine vision camera market shares
Cognex Corp.
45%
Datalogic
4%
Other
15%
FLIR Integrated
Imaging Solutions Inc.
13%
Basler AG
5%
Allied Vision
Technologies (AVT)
5%
JAI A/S 4%
Other
39%
$1.2B $800M
PC-based and board cameras Smart Cameras
Keyence
26%
Keyence
13%
Toshiba Teli
Corp.
8%
Teledyne Dalsa
7%
Sony Imaging
Products Solutions
Inc.
6%
IFM Electronic
GmbH
10%
CCD CMOS
Board-level camera
Embedded computing
Hyperspectral imaging
3D imaging
CMOS sensors and machine learning open the
door for machine vision. X-ray
Infrared imaging
Machine
learning
makers Tattile, Microtron and Chromasens.
The total amount of MA in this time period is
approaching $1.7B.
The shift from Charge-Coupled Device (CCD)
to CMOS has had a profound impact on image
sensors for MV, driving this MA wave. Although
this affected other markets years ago, such
as consumer image sensors in the 1990s and
photography sensors in the early 2000s, it is
only now that the shift from CCD to CMOS
technology is reaching the high end of the imaging
sensor market.
The main direct consequence for companies
selling high cost/low volume products is the
inability to invest in or sustain manufacturing
facilities that require high output due to the large
fixed cost. The entry cost to establishing CMOS
Image Sensor (CIS) manufacturing has been far
too high for previous vertically-integrated CCD
players. Therefore, all except Sony have shifted
to the fabless business model suited to high-end
“specialty products”. Dedicated foundries such as
TPSCo, Dongbu Hitek and SMIC, who recently
acquired LFoundry’s assets, have therefore
emerged.

MARKET TECHNOLOGY REPORT
intelligent vision systems. One example of
the spread of smart cameras is the recent
multispectral product from Specim.
Another technology that will enable intelligent
MV to spread is machine learning (ML). As
an example, in 2017, Cognex acquired Vidi
Systems, a deep learning software company, in
order to implement ML into smart cameras.
But MV and ML, among other technologies, will
have an important impact on robotic vehicles.
Annual robotic vehicle production could reach
150,000 units in 2027, and grow exponentially
from there. By 2023, the market for industrial
cameras for robotic vehicles could be worth
more than $900M, suddenly becoming one
quarter of the MV camera market.
Find more
details about
this report here:
COMPANIES CITED IN THE REPORT (non exhaustive list)
3M, Allied Vision Technologies (AVT), ams AG, Basler AG, Baumer Electric AG, Bosch Security
Systems, Compac, Daewon GSI Co,. Ltd., FLIR Integrated Imaging Solutions Inc., Genetec
Inc., Hamamatsu Photonics, Hefei Growking Optoelectronic Technology Co., Hitachi Kokusai
Electric Inc., Honeywell, Imaging Development Systems GmbH (IDS), JAI A/S, Jenoptik Traffic
Solutions UK Ltd., Leica Microsystems, Microscan Systems, Inc. , Motorola, NDI Recognition
Systems Ltd. (NDI-RS), Nikon, Nippon Electro-Sensory Devices Corp. (NED), Nippon Electro-
Sensory Devices Corporation, Olympus Corporation, Omron, ON Semiconductor, Pixelteq,
Satake Group, Sesotec GmbH, Siemens AG, Sony Imaging Products Solutions Inc., Sony
Semiconductor Solutions Corporation, Teledyne Dalsa, Teledyne e2v, Toshiba Electronic
Devices and Storage Corporation, Toshiba Teli Corp., Unitech Electronics Co., Viavi Solutions,
Vieworks Co., Vision Components GmbH, Zebra Technologies, and more.

Glossary2
Table of contents 3
Report objectives 5
Scope of this report 9
Executive summary 14
Introduction25
Market forecast 56
By segment and application
Shipment volumes 2016-2023 for
machine vision cameras
Shipment volumes 2016-2023 for
automatic data capture camera modules
ASP forecast 2016-2023 for machine
vision cameras
ASP forecast 2016-2023 for automatic
data capture camera modules
Revenue forecast 2016-2023 for machine
vision cameras
Revenue forecast 2016-2023 for
automatic data capture camera modules
By segment, application, and technology,
including CCD, CMOS, GS, RS, linear
and area sensors
Revenue forecast 2012-2022 for machine
vision and automatic data capture image
sensors
Supply chain 85
Supply chain for cameras
Supply chain for image sensors
Applications 99
Scientific applications
Factory automation
Agriculture applications
Surveillance
Logistics
Robotic vehicles
Application focus 127
Food sorting
Automatic numerical plate recognition
Robotic cars
Technologies147
Board-level cameras
Camera software
3D imaging
Hyperspectral imaging
Camera interfaces
The shift from CCD to CMOS
Global shutter technology
Backside illumination technology
IR and UV Sensitivity
Scientific CMOS
General conclusions 184
Yole Développement presentation 190
TABLE OF CONTENTS (complete content on i-Micronews.com)
• Status of the CMOS Image Sensor Industry
2017
• Camera Module Industry Market and
Technology Trends 2017
• 3D Imaging and Sensing 2017
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AUTHORS
Dr. Alexis Debray is a Technology and
Market Analyst at Yole Développement
(Yole). As a member of the MEMS
Sensors Business Unit, Alexis is
today engaged in the development of
technology and market reports as well
as the production of custom consulting
projects dedicated to the imaging
industry.
After spending two years at the University
of Tokyo developing expertise focused
on MEMS technologies, Alexis served as
a research engineer at Canon Inc. Over
15 years he contributed to numerous
projects of development, focused on
MEMS devices, lingual prehension, and
terahertz imaging devices.
Alexis is the author of various scientific
publications and patents. He graduated
from ENSICAEN, and holds a PhD in
applied acoustics.
Pierre Cambou joined the imaging
industry in 1999. Following an engineering
degree from Université de Technologie
de Compiègne in parallel to a master
of science from Virginia Tech in 1998,
as well as graduating from Grenoble
Ecole de Management’s MBA, Cambou
took several positions at Thomson TCS,
which became Atmel Grenoble in 2001
and e2v Semiconductors in 2006. In
2012 he founded Vence Innovation, now
called Irlynx, in order to bring to market
a disruptive man-to-machine interaction
technology. He joined market research
and strategy consulting company Yole
Développement as imaging activity
leader in 2014.
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• MEMS Sensors
• RF devices technologies
• Imaging
• Medical technologies (MedTech)
• Photonics
• Advanced packaging
• Manufacturing
• Advanced substrates
• Power electronics
• Batteries and energy management
• Compound semiconductors
• Solid state lighting
• Displays
• Software

OUR 2018 REPORTS COLLECTION (1/3)
MEMS SENSORS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the MEMS Industry 2018 - Update
− Silicon Photonics 2018 - Update
− Consumer Biometrics: Sensors Software 2018 - Update
− MEMS Pressure Sensors 2018
− Air Quality Sensors 2018
− Sensors for AR/VR 2018
o REVERSE ENGINEERING COSTING REVIEW – by System Plus Consulting
− Gas Particles Sensors
− MEMS Pressure Sensors
− Piezo MEMS 2018 *
o PATENT ANALYSES – by KnowMade
− MEMS Microphone – Patent Landscape Analysis
RF DEVICES ANDTECHNOLOGIES
o MARKET AND TECHNOLOGY REPORT – byYole Développement
− RF Front End Module and Connectivity for Cellphones 2018 – Update
− 5G Impact on RF Industry: From Wireless Infrastructure to Cellphone Terminals
2018 - Update
− RF GaN 2018 – Update
− Advanced RF System-in-Package for Cellphones 2018 – Update *
− Radar Technologies for Emerging Applications 2018 *
− Radar Technologies for Automotive 2018
− RF Photonic Technologies for 5G Infrastructure 2018
− RF Front-End Modules in Smartphones
− RF GaN *
− RF Front End Module – Patent Landscape Analysis
− RF GaN – Patent Landscape Analysis
IMAGING OPTOELECTRONICS
− Status of the CMOS Image Sensor Industry 2018 – Update
− Status of the Compact Camera Module Industry 2018 - Update
− 3D Imaging and Sensing 2018 - Update
− Imaging for Industry and Automation 2018
− Sensors for Robotic Vehicles 2018
− Imagers and Detectors for Security and Smart Buildings 2018
− LiDARs 2018
o QUARTERLY UPDATE – by Yole Développement
− CMOS Image Sensors 2018 *
− CMOS Image Sensors
− Compact Camera Modules
− LiDAR – Patent Landscape Analysis
− Time-of-Flight IR Sensor in the Apple iPhone 7 Plus - Patent-to-Product Mapping
SOFTWARE
− Consumer Biometrics: Sensors Software 2018 - Update
− Processing Hardware and Software for AI: Integration Challenges 2018
Update : 2017 version still available / *To be confirmed

ADVANCED PACKAGING
− Status of Advanced Packaging Industry 2018 - Update
− Status of Advanced Substrates 2018: Embedded Die and Interconnects, Substrates
Like PCB Trends
− Fan-Out Packaging 2018 – Update
− 3D TSV and Monolithic Business Update 2018 – Update
− Advanced RF System-in-Package for Cellphones 2018 – Update *
− Power Packaging Modules 2018 - Update
− Discrete Power Packaging 2018 – Update
− MEMS Packaging and Testing 2018 – Update
− Memory Packaging Market and Technology Report 2018 – Update
− Status of Panel Level Packaging 2018
− Trends in Automotive for Advanced Packaging 2018
− Processing Hardware and Software for AI: Integration Challenges 2018
− Integrated Passive Devices (IPD) 2018
− RF Front-End SiP
− Fan-Out Packaging *
− Hybrid Bonding for 3D Stack – Patent Landscape Analysis
MANUFACTURING
− Manufacturing Wafer Starts for More than Moore 2018
− Equipment for More than Moore: Technology Market Trends for Lithography
Bonding/Debonding 2018
− Equipment for More than Moore: Technology Market Trends for Thin Film
Deposition Etching 2018
− Wafer Bonding Technology Overview 2018
MEMORY
− Emerging Non Volatile Memory 2018 – Update
− Memory Packaging Market and Technology Report 2018 – Update
− Memory Market 2018 (NAND DRAM)
o MONTHLY UPDATE – by Yole Développement
− Memory Pricing 2018 (NAND DRAM)
− DRAM Technology Cost Review 2018
− NAND Memory Technology Cost Review 2018
COMPOUND SEMICONDUCTORS
MARKET AND TECHNOLOGY REPORT – byYole Développement
− Status of Compound Semiconductor Industry 2018 *
− Power SiC 2018: Materials, Devices, and Applications - Update
− Power GaN 2018: Materials, Devices, and Applications – Update
− RF GaN 2018 – Update
− GaAs Materials, Devices and Applications 2018
− InP Materials, Devices and Applications 2018
− Power SiC Devices
− Power GaN Devices
− Power SiC – Patent Landscape Analysis
− Status of the GaN IP – Patent Landscape Analysis

POWER ELECTRONICS
MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of Power Electronics Industry 2018 - Update
− Power Packaging Modules 2018 - Update
− Discrete Power Packaging 2018 - Update
− EV/HEV Market Expectations and Technology Trends - Update
− Wireless Charging Market Expectations and Technology Trends 2018
− Integrated Passive Devices (IPD) 2018
− Power ICs Market 2018 – Update
− Power ICs Market 2018 *
− Power Modules *
BATTERY AND ENERGY MANAGEMENT
− Status of Battery Industry Update with Focus on Manufacturing 2018 *
− Battery Pack Technology and Business Opportunities 2018 - Update
− Solid-State Batteries – Patent Landscape Analysis
SOLID STATE LIGHTING
− IR LEDs and Lasers 2018 - Update
− Automotive Lighting 2018 – Update
− UV LEDs 2018 - Update
− VCSELs 2018
− Lasers 2018
− Light Shaping Technologies 2018
− LiFi 2018
− VCSELs 2018
− UV LEDs 2018 *
DISPLAYS
− MicroLED Displays 2018 – Update
− Quantum Dots and Wide Color Gamut Display Technologies 2018 - Update
− Organic Thin Film Transistor 2018: Flexible Displays and Other Applications -
Update *
− Displays for AR / VR / MR 2018
− Non Display Applications of MicroLEDs 2018 *
− MicroLED Display – Patent Landscape Analysis
MEDTECH
− Status of the BioMEMS Industry 2018 - Update
− Point-of-Need Testing: Application of Microfluidic Technologies 2018 - Update
− Neuro-Technologies for Healthcare and Consumer Applications 2018
− CRISPR Technology: From Lab to Industries 2018
− Portable Medical Imaging 2018
− Inkjet for Additive Manufacturing in the Micro-Electronics Industry 2018
− Liquid Biopsy 2018: From Isolation to Downstream Applications
− Chinese Microfluidics Industry 2018
− Microfluidic IC Cooling – Patent Landscape Analysis
− Circulating Tumor Cell Isolation – Patent Landscape Analysis
− Organ-on-a-Chip – Patent Landscape Analysis

OUR 2017 PUBLISHED REPORTS (1/3)
MEMS SENSORS
− Status of the MEMS Industry 2017
− High End Inertial Systems Market and Technology 2017
− Magnetic Sensors Market and Technologies 2017
− MEMS and Sensors for Automotive - Market and Technology Trends 2017
− Acoustic MEMS and Audio Solutions 2017
− Sensors and Sensing Modules for Smart Homes and Buildings 2017
− Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017
o REVERSE COSTING REPORT – by System Plus Consulting
− Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Systems –
Reverse Costing Report
− Bosch Mobility Ultrasonic Sensor – Reverse Costing Report
− MEMS Packaging 2017 - Reverse Costing Review
− Bosch BMP380 Pressure Sensor – Reverse Costing Report
IMAGING PHOTONICS
− Status of the CMOS Image Sensor Industry 2017
− 3D Imaging and Sensing 2017
− Uncooled Infrared Imaging Technology Market Trends 2017
− Camera Module Industry Market and Technology Trends 2017
− FLIR Boson – a small, innovative, low power, smart thermal camera core – Reverse
Costing Report
− Camera Module Physical Analyses Overview 2017
RF DEVICES ANDTECHNOLOGIES
− RF Front End Modules and Components for Cellphones 2017
− Advanced RF System-in-Package for Cell Phones 2017
− 5G Impact on RF Front-End Industry 2017
ADVANCED PACKAGING
− Status of the Advanced Packaging Industry 2017
− Embedded Die Packaging: Technology and Market Trends 2017
− Fan-Out: Technologies and Market trends 2017
− Advanced Substrates Overview: From IC Package to Board 2017
− 3D TSV and 2.5D Business Update - Market and Technology Trends 2017
− Advanced RF System-in-Package for Cellphones 2017
− Memory Packaging Market and Technology Report 2017
− MEMS Packaging 2017
− Emerging Non-Volatile Memory 2017
− NVIDIA Tesla P100 - Reverse Costing Report
− MEMS Packaging - Reverse Technology Review
− Advanced RF SiP for Cellphones 2017 - Reverse Costing Review
SOFTWARE
− Embedded Software in Vision Systems
MEDTECH
− Status of the Microfluidics Industry 2017
− Solid-State Medical Imaging 2017
− Organs-On-Chips 2017
− Connected Medical Devices Market and Business Models 2017
− Artificial Organ Technology and Market analysis 2017
− Medical Robotics Technology Market Analysis 2017

OUR 2017 PUBLISHED REPORTS (2/3)
MANUFACTURING
− Laser Technologies for Semiconductor Manufacturing 2017
− Equipment and Materials for 3D TSV Applications 2017
− Equipment and Materials for Fan-Out Packaging 2017
− Glass Substrate Manufacturing in the Semiconductor Field 2017
BATTERIES ENERGY MANAGEMENT
− Status of the Rechargeable Li-ion Battery Industry
− Market Opportunities for Thermal Management Components in Smartphones
DISPLAYS
− MicroLED Displays
− Quantum Dots and Wide Color Gamut Display Technologies
− Phosphors Quantum Dots 2017 - LED Downconverters for Lighting Displays
SOLID STATE LIGHTING
− LED Packaging 2017: Market, Technology and Industry Landscape
− CSP LED Lighting Modules
− IR LEDS and VCSELs - Technology, Applications and Industry Trends
− LED Lighting Module Technology, Industry and Market Trends 2017
− Automotive Lighting: Technology, Industry and Market Trends 2017
− Horticultural LED Lighting: Market, Industry, and Technology Trends
POWER ELECTRONICS
− Status of the Power Electronics Industry 2017
− Thermal Management Technology and Market Perspectives in Power Electronics and
LEDs 2017
− Gate Driver Market and Technology Trends 2017
− Power MOSFET 2017: Market and Technology Trends
− Power Module Packaging: Material Market and Technology Trends 2017
− IGBT Market and Technology Trends 2017
− Power Management ICs Market 2017
− EPC2045 100V GaN-on-Silicon Transistor – Reverse Costing Report
− Silicon Capacitor - Technology and Cost Review
− Industrial 100V MOSFET - Technology and Cost Review
− InvenSense ICM-20789: High Performance 6-Axis Motion Sensor and Pressure Sensor
Combo – Reverse Costing Report
COMPOUND SEMICONDUCTORS
− Bulk GaN Substrate Market 2017
− RF Power Market and Technologies 2017: GaN, GaAs and LDMOS
− Power SiC 2017: Materials, Devices, Modules, and Applications
− Power GaN 2017: Epitaxy, Devices, Applications, and Technology Trends

OUR 2017 PUBLISHED REPORTS LIST (3/3)
OUR PARTNERS’ REPORTS
PATENT ANALYSES – by KnowMade
− Wireless Charging Patent Landscape Analysis
− RF Acoustic Wave Filters Patent Landscape Analysis
− NMC Lithium-Ion Batteries Patent Landscape Analysis
− Pumps for Microfluidic Devices Patent Landscape
− III-N PatentWatch
− FLUIDIGM Patent Portfolio Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets
− MicrofluidicTechnologies for Diagnostic Applications Patent Landscape
TEARDOWN REVERSE COSTING – by System Plus Consulting
More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017
MORE INFORMATION
o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com.
o Ask for our Annual Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then have up
to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports
automatically (multi-user format). Contact your sales team according to your location (see the last slide).

MICRONEWS MEDIA
o About Micronews Media
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technological and business information,
Micronews Media integrates several tools able
to reach each individual contact within its
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CONTACT INFORMATION
o CONSULTING AND SPECIFIC ANALYSIS
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Email: laferriere@yole.fr – +1 31 06 008 267
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• RoW: Jean-Christophe Eloy, CEO President, Yole Développement
Email eloy@yole.fr - +33 4 72 83 01 80
o REPORT BUSINESS
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Email: laferriere@yole.fr – +1 31 06 008 267
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