MicroLED Displays - Market, Industry and Technology Trends 2021

From Technologies to Markets
© 2021
MicroLED
Displays
Market, Industry and
Technology Trends
Report 2021
Sample

2
MicroLED Displays - Market, Industry and Technology Trends 2021 | Sample | www.yole.fr | ©2021
ACRONYMS
• microLED: microLED
• 3D: three dimensions
• 4K: 3840x2160 resolution
• 4N: Four Nines – meaning 99.99%
• 5N: Five Nines – meaning 99.999%
• 8K: 7680x4320 resolution
• ADAS: Advanced Driving Support System
• AI: Artificial Intelligence
• ALD: Atomic Layer Deposition
• AMOLED: Active Matrix OLED
• AR: Augmented Reality
• ASP: Average Selling Price
• a-Si: Amorphous Silicon
• AOI: Automated Optical Inspection
• ASP: Average Selling Price
• BLU: Backlight Unit
• CAGR: Compound Annual Growth Rate
• Capex: Capital Expenditure
• CF: Color Filter
• CMOS: Complementary Metal Oxide
Semiconductor
• CMP: Chemical Mechanical Planarization
• CoC: chip on Carrier
• CoW: Chip on Wafer
• CR: Contrast Ratio
• CRT: Cathodic Ray Tube
• CSP: Chip Scale Packaging
• DLP: Digital Light Projection
• EL: ElectroLuminescence
• EL-QD: Electroluminescent QD
• EQE: External Quantum Efficiency
• FALD: Full Array Local Dimming
• FHD: Full High Definition (1920x1080)
• FMM: Fine Metal Mask
• FOV: Field Of View
• FWHM: Full Width at Half Maximum
• GDP: Gross Domestic Product
• GOA: Gate on Array
• GenX: fab of Xth generation
• HDR: High Dynamic Range
• HMD: Head Mounted Display/Device
• HUD: Head Up Display
• HVM: High Volume Manufacturing
• IC: Integrated Circuit
• IJP: Inkjet Printing
• IP: Intellectual Property
• IQE: Internal Quantum Efficiency
• IR: Infrared
• KBD: Known Bad Die
• KGD: Known Good Die
• KSF: K2SiF6 PFS phosphor
• LC: Liquid Crystal
• LCD: Liquid Crystal Display
• LCOS: Liquid Crystal on Silicon
• LED: Light Emitting Diode
• LLO: Laser Lift-Off
• LTPS: Low Temperature Poly Silicon
• MBE: Molecular Beam epitaxy
• mLED: miniLED
• MMG: Multi Mother Glass
• MOCVD: Metal Organic Chemical Vapor
Deposition
• MR: Mixed Reality
• NBP: Narrow Band Phosphor
• NRE: Non-Recurring Engineering
• NTSC: National Television System Committee
• OEM: Original Equipment Manufacturer
• OLED: Organic Light Emitting Diode
• OSAT: Outsourced Semiconductor Assembly and
Testing
• PCB: Printed Circuit Board
• PDMS: Polydimethylsiloxane (polymer material)
• PECVD: Plasma-Enhanced Chemical Vapor
Deposition
• PFS: Potassium Fluoro Silicate
• PL: PhotoLuminescence
• PL-QD: Photoluminescent QD
• PPI: Pixels per Inch
• PVD: Physical Vapor Deposition
• PWM: Pulse Width Modulation
• QD: Quantum Dot
• QDCF: Quantum Dot Color Filter
• QDEF: Quantum Dot Enhancement Filter
• QD-OLED: Quantum Dot OLED
• QWP: Quarter Wave Plate
• RCLED: Resonant Cavity Light Emitting Diode
• RGB: Red, Green and Blue
• RIE: Reactive Ion Etching
• RoHS: Restriction of Hazardous Substances
• SID: Society for Information Display
• TADF: Thermally Activated Delayed Fluorescence
• TFT: Thin Film Transistor
• UHD: Ultra High Definition
• UV: Ultra-Violet
• VR: Virtual Reality
• VTE: Vacuum Thermal Evaporation
• WCG: Wide Color Gamut
• WOLED: White OLED
• YAG: Yttrium Aluminum Garnet

3
Company Cited in this Report P7
Scope of this Report P8
Why This Report? P9
About the Authors P10
Executive Summary P12
Introduction to MicroLEDs P62
Cost Aspects P73
• Cost Target for Die, Transfer and Repair
• Key Outcomes
• Cost Reduction Opportunities
• Illustration: Long Term 75” 8K TV cost reduction Potential
Forecast P79
• MicroLED SWOT per Application
• Key Drivers and roadblocks for Adoption
• Timeline and Leading Players
MicroDisplays (AR, VR) P85
• Key Players
• Ecosystem Shaping Up
• Display Forecast for AR and VR Headsets
TV and Information Displays P92
• 2018-2028 TV Set Volume forecast - Size Breakdown
• Value is in Large and Premium TV
• Manufacturing: Panel Cuts for Large Displays
• Challenges for Large Panels (80” and above)
• Laser TV
• Modular LED and MicroLED displays
• Prices: MicroLED, OLED, LCD and Laser TVs.
• Convergence Between TV and Direct View LED displays
• Display Size, Pixel Pitch and Resolution
• LED Package and Assembly Types for Narrow and Fine Pitch Displays
• Illustration: Playnitride, Nationstar
• Substrate for Narrow and Fine Pixel Pitch
• Direct View LED Displays Technology Roadmap
• Supply Chain: Crossing Over
• Leyard and Samsung “MicroLED TV”
• Samsung’s MicroLED Developments: 3 Technology Tracks
• MicroLED Adoption in Consumer Markets
• MicroLED Die Cost for TV
• Scenario for Consumer Adoption
• Consumer TV Technology Roadmap
• MicroLED TV Panel Volume Forecast
• Direct View LED Displays Pitch Vs Applications
• Narrow Pixel Pitch Direct View LED Display Market Trends
• B2B Adoption: Information Displays
Automotive P128
• Automotive Display Forecast per function
• Trends: Integration, Size, Performance
• Comparison of Display Technologies for Automotive
• MicroLED Adoption and Volume Forecast
• Automotive MicroLED Prototypes: AUO, Tianma, Playnitride
TABLE OF CONTENTS

4
Smartwatch P142
• Drivers For MicroLED Adoption
• MicroLED Adoption and Volume Forecast
Smartphones P147
• Mobile Phones: Display for Differentiation?
• MicroLED Adoption Challenges
• MicroLED Adoption Scenario
• MicroLED Smartphone Adoption and Volume Forecast
Laptop, Tablets and Monitors P155
• Overview
• MiniLED Products
• Adoption and Volume Forecasts.
Epiwafer Forecast P162
• Key Hypotheses
• MicroLED Epiwafer Forecast – Aggressive scenario
• Base and Conservative Scenario, Risk Factors
Intellectual Property Trends P168
• General dynamics
• Technology Trends
• Competitive Landscape
• Time Evolution of Patent Filing for Top 25 Companies (By Filing Date)
• Top 40 Patent Applicant Ranking
• 2020 Publishing Activity
• Main Applicant Ranking and Legal Status - granted/pending/Dead
• Overview of Patent Families By Technology Node
• Technology Landscape: Major Trends & Thrust Areas
• Technology Map
Recent Trends: The Shaping of the microLED Industry Landscape P183
• MicroLED Display News
• Recent Prototypes
• Early Monetization
• Funding and Startups
• New entrants
• Industrial Collaborations and Partnerships
• The Nationalization of MicroLED ?
• Progress Toward Manufacturing
• Stratacache Manufacturing Strategy
Competitive Landscape P200
• Major Players by Technology Node
• Overview of Large Companies and Their MicroLED ecosystems
• LED Partner Candidates for Apple
• Samsung LED Ecosystem
• Samsung and Apple: Different Supply Chain Requirements
• AUO, Innolux
• Taiwan’s MicroLED Ecosystem
• China’s MicroLED Ecosystem
• Focus on Konka
Supply Chain P215
• MicroLED Chips
• Supply chain Requirements and Maturity Level
• Supply Chain scenarios With TFT Backplane
• Disruptive Supply Chain Scenario: MicroDrivers
TABLE OF CONTENTS

5
Technology and Equipment P223
Front End: Epitaxy and Chip Manufacturing P224
• Example of Process Flow
• Epitaxy
• Wavelength Binning
• Front End Fab Requirements for Small MicroLED
• Focus: Atomic Layer Deposition
• Toward High Volume Manufacturing
• MicroLED and Traditional Semiconductor Convergence
• GaN-On-Si Key Players and Partners
• Front End Equipment Suppliers
MicroLED Display Efficiency P240
• MicroLED vs OLED
• Improving Internal Efficiency
• Looking for Red LED Alternatives
• Illustration: Soitec, Porotech
• Light Extraction and Beam shaping
• Backplane Losses
• 2021 Status
Color Conversion & RGB Chips P251
• Approaches for Color Displays
• Color Conversion Benefits & Challenges
• Illustration: Applied Materials
• Monolithic RGB chips by Color conversion: Saphlux
• Monolithic RGB Chips with NanoWires
• Aledia Roadmap
• RGB Chips by Strain Control
Transfer & Assembly P263
• Pick and Place and Sequential Printing
• Bonding
Mass Transfer Metrics and Economics P270
• Transfer Stamp Size
• Where do we stand?
• Display Price and Revenue Generation Metrics
• Transfer Optimization for Large Displays
Mass Transfer Processes P277
• Trends in Mass Transfer Technologies
• Classifications of Transfer Technologies
• Laser Processes
• Illustration: 3D Micromac – Coherent
• Toray Engineering “RAP-LLO” Laser Transfer Process Flow
• Stamp vs Laser? Status as of 2021
• One Step vs Two-Step Processes
• Example of New Entrant (Stamp-based): LuxNour
• Self-Assembly: Overview
• Examples: eLux.
• Semi-Deterministic Self Assembly: Xerox PARC
Mass Transfer and Assembly Equipment P293
• Main Requirements
• Process Developers Vs Equipment Makers
• Active Players: Status and Collaboration Strategy
• Recent Trends
• Commercial Solutions as of Q2-2021
• Example of Other Solutions In Development
TABLE OF CONTENTS

6
Yield Management: Inspection, Testing and Repair P304
• Yield Management and Repair Strategies
• Partial Redundancy and Adaptive Color Patterning
• Transfer and Actionable Known Good Die Maps
• Inspection, Testing and Yield Management Requirements
• Front-End: Epiwafers and chips
• Optical Inspection + Photoluminescence
• MicroLED Chip Functional Testing
• Possible Functional Test strategies
• Other Metrology and Testing Methods
• Post Transfer Inspection and Testing
• Pixel Repair
• Examples: Toray, Charm Engineering
• Display Inspection and Calibration, De-Mura
• De-Mura Illustration: Radiant Vision Systems, VueReal, Kyocera
• MicroLED Display Inspection, Testing and Repair Tool Makers
• Illustration: Orbotech
Driving and Pixel Architecture P327
• Analog Driving
• Digital and Hybrid Driving:
• Active-Matrix vs Passive-Matrix
• Thin Film Transistors Versus Microdriver ICs
• Cost Reality check: TFT vs MicroDrivers
• MicroDriver Multiplexing and Local Passive Matrix
• IR Drop, Thermal Management
• Pixel chiplets and Microsystems
Self-Assembled Nanorod LEDs: QNED P343
• Key patents Timeline
• Technology Trends
• Nanorod for QNED: Etched vs Seeded
• QNED Vs QD-OLED
• QNED vs Standard MicroLED
• Challenges
• QNED SWOT and Status
Modular Display Tiling P355
• Tiled Display Architecture
• Signal routing for Bezel-Less MicroLED
• Possible Architectures
• Status
Monolithic Microdisplays P364
• MicroLED MicroDisplay Manufacturing
• Wafer Sizes
• Challenges
• Illustration: Stacked RGB (Sundiode, Ostendo, OKI)
• Optical combiners
Conclusion – What’s Next? P373
Annex I: Recent MicroLED Display Prototypes P375
About Yole Développement P380
TABLE OF CONTENTS

7
SCOPE OFTHIS REPORT
• This reports provides a detailed update on the status of the microLED industry as of Q3-2021.
• As the buzz around these new display technologies started growing exponentially, our 2017 and
2018 “microLED” and “miniLED” reports aimed at providing a thorough reference base. They
featured detailed introductions to the key concepts, thorough analyses of the processes, competing
technology bricks, design and manufacturing paradigms and all the major associated challenges, as
well as an understanding of the key cost drivers and applicability for each major display application.
Your needs are
out of scope of this
report?
Contact us for a custom study:
• Previous reports extensively analyzed technology roadblocks for
microLED and presented cost sensitivity analysis to determine cost
envelop for some key processes, such as transfer, yield management and
repair and die size. To keep the report length manageable, it is assumed
that the reader is already familiar with all the key concepts and analyses
developed in the previous edition.
• With microLED technologies edging closer to reality, this report brings
a new focus on requirements for volume manufacturing and the
corresponding nascent microLED equipment ecosystem.

8
METHODOLOGIES & DEFINITIONS
Market
Volume (in Munits)
ASP (in $)
Revenue (in $M)
Yole’s market forecast model is based on the matching of several sources:
Information
Aggregation
Preexisting
information

9
ABOUT THE AUTHORS
Biographies and contacts
Dr. EricVirey
As a senior market and technology analyst atYole Développement, Eric is a daily contributor to the development of LED, OLED,
and display activities atYole. He has authored a large collection of market and technology reports as well as multiple custom
consulting projects on subjects including business strategy, identification of investments or acquisition targets, due diligence in
buying and selling, market and technology analyses, cost modelling and technology scouting.Thanks to his deep knowledge of the
LED/OLED and display industries, Eric has spoken at more than 30 industry conferences worldwide over the last five years. He
has been interviewed and quoted by leading media all over the world.
Previously Eric has held various R&D, engineering, manufacturing and business development positions with the Fortune 500
Company Saint-Gobain, based in France and the United States.
Dr. EricVirey holds a PhD in Optoelectronics from the National Polytechnic Institute of Grenoble.
Contact: virey@yole.fr
Dr. Zine Bouhamri
As a technology and market analyst for the display industry, Dr. Zine Bouhamri is a member of the Photonics, Sensing and Display
division atYole Développement.Zine manages the day-to-day production of technology and market reports, as well as custom
consulting projects. He is also deeply involved in business development activities for the Displays unit atYole.
Previously, Zine was in charge of numerous R&D programs at Aledia. In his time there he developed strong technical expertise as
well as a detailed understanding of the display industry. Zine is the author and co-author of several papers and patents.
Dr. Bouhamri holds a degree in Electronic Engineering from the National Polytechnic Institute of Grenoble (France), one from
the Politecnico diTorino (Italy), and a PhD in Radio Frequency and Optoelectronics from Grenoble University (France).
Contact: zine.bouhamri@yole.fr

10
3D Micromac (DE) Aixtron (DE), Applied Materials (US), Aledia (FR), Allos Semiconductor (DE), Advanced Powertch (KR), Aerotrans
Tech. (TW), AMEC (CN), Apple (US), AQlaser (KR), ASMPT (SG), AUO (TW), Attolight (CH), BOE (CN), Bolite (TW), Beneq (FI), CEA-
LETI (FR), CEC Panda (CN), Charm Engineering (KR), CIOMP (CN), Coherent (US), Comptek (FI), Contrel (TW), Compound Photonics
(US), Cooledge (CA), CSOT (CN), Cyberoptics (US), eLux (US), eMagin (US), Enkris (CN), ENNOSTAR (TW), EpiLED (TW), EpiPix (UK),
Epistar (TW), Facebook (US), Finetech (DE), Flex Photonic (CN), Foxconn (TW), Gamma Scientific (US), glō (SE/US),
GlobalFoundries (US), Goertek (CN), Google (US), GPM (TW), Hamamatsu (JP), HCP (CN), HC Semitek (CN), Hexagem (SE), HKUST
(HK), iBeam (US), Intel (US), Innocise (DE), Innolux (TW), Innovation Semiconductors (US), Instrument Systems (DE), Inziv (IS), ITRI
(TW), Jade Bird Display (HK), Jasper Display (TW), Kansas State University (US), KIMM (KR), KLA Tencor, Konka (CN), Kookmin U.
(KR), Kopin (US), Kyocera (JP), LG (KR), Kulicke & Soffa (SG), LC Square (KR), Lextar (TW), Leyard (CN), Lumens (KR), Lumiode (US),
Luxnour (US), LuxVue (US), MICLEDI (BE), Mikro Mesa (TW), Mojo Vision (US), Nanosys (US), Nationstar (CN), NCD Tech (KR), NCTU
(TW), Nichia (JP), Nitride Semiconductors (JP), Nuflare (JP, Nth Degree (US), Oculus (US), OKI (JP), Optovate (UK), Orbotech (IS),
Osram (DE), Ostendo (US), Oxford Instruments (UK), Picosun (FI), PlayNitride (TW), Plessey (UK), Polar Light (SE), Porotech (UK),
PSI Co (KR), Powdec (JP), Radiant Vision Systems (US), Raxium (US), Rohinni (US), Samsung (KR), Sanan (CN), Saphlux (US), Sapien
(KR), SelfArray (US), Smart Equipment Technology (FR), Seoul Semiconductor (KR), Sharp (JP), Shibaura (JB), Sitan Technology (CN),
Sony (JP), Soft Epi (KR), Southport (TW), SPTS (US), Stratacache (US), Strathclyde University (UK), Sundiode (US), SUSTech (CN), Sun
Yat-sen University (TW), Sxaymiq Technologies (US), TDK (JP), Terecircuit (US), Tesoro (US), Tetos (KR), Texas Tech (US), Tianma
(CN), Topcon (JP), Toray Engineering (JP), TowerJazz (IS), TSMC (TW), Tyndall National Institute (IE), Ultra Display Tech (TW),
Uniqarta (US), U. Of Hong Kong (HK), U. of Illinois (US), V-Technology (JP), Veeco (US), VerLASE (US), V-Technology (JP), Viewtrix
(TW), Visionox/Vistar (CN), VueReal (CA), Vuzix (US), X Display (US), XTPL (PL).. and more!
COMPANY CITED IN THIS REPORT

11
WHY THIS REPORT
• Understand the status of microLED technologies:
• Recent progress.
• What are the remaining pinch points?
• Cost targets and roadmaps? Technology roadmaps.
• Which applications could microLED displays address and
when?
• Detailed analyses and roadmaps for major display
applications.
• Competitive landscape and supply chain
• Identify the key players and IP owners in technology
development and manufacturing. Who’s taking the lead? Key
partnerships.
• Scenario for a microLED display supply chain: OEM, display
makers, equipment makers, start-up and technology
providers.
• Impact on the display supply chain.
Everything you ever wanted to know about
microLED displays.
Report Structure
Introduction to MicroLED
Executive Summary
Cost Aspects
Forecast
Supply Chain and Competitive Landscape
Technology and equipment:
QNED, efficiency, transfer, color conversion,
driving, display architetcurs, monolithic
microdisplays, modular displays etc
Industry and IP trends

12
WHAT’S NEW? MAJOR EVENTS.
H1-2021
H1-2020 H2- 2020

13
STRONG MOMENTUM IN R&D ACTIVITY AND PATENTS
0 0 0 0 1 0 3 16 18 11 4 10 3 13 9 18 13 30 33 70 62
136
309
548
1149
1637
0
200
400
600
800
1000
1200
1400
1600
1800
2000
2200
2400
2600
2800
3000
3200
3400
3600
1995
1996
1997
1998
1999
2000
2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
Number
of
families
published
Every
Year
1st publication year
Time evolution of patent publications
(# of new families published each year)
Patents (priority and extensions)
Patent families (inventions)
86%
CAGR
2016-2020
Activity takes off
8900+ MicroLED display patents (4093 families) filed by close to 480 organizations
More and more companies are developing microLED. Patent filing is increasing exponentially, driven by display makers,
especially in China and Korea, and by startups
2015 2016 2017 2018 2019 2020
Number
of
Patent
families
Company Types
Display makers
dominate
activity, followed
by startup
2013 2014 2015 2016 2017 2018 2019 2020
Number
of
Patent
Families
Chinese companies
dominate
activity…Korea
came back strong
in 2020!
Company Headquarter
CN
KR
US
TW
JP
For more details on methodology, please check:
https://www.linkedin.com/video/live/urn:li:ugcPost:6691356796029820928/
Display
Makers
Startups

14
OFF-THE SHELVES MICROLED TOOLS ARE BECOMING AVAILABLE
More and More Dedicated MicroLEDTools Available or
in Development (examples)
ASM PT
Toray Engineering
Collaborations / Alliances between Process
Developers andTool Makers: unique, microLED-
specific processes are becoming available
Etching, plating, tiling…
Tesoro
Scientific
miniLED
technology
licensing
MiniLED/
microLED
Acquisition
(feb 2021)
Acquisition (2020)
Transfer
Bonding
….
Metrology
Testing
Repair
Etc.
Others
*: laser sources only. Collaborate with equipment makers for full equipment
Ultra Display
Tech.
Process Tools

15
Type
Placement
Accuracy
Transfer
Cycle Time
Bonding
Substrate
area
Users
COMMERCIAL SOLUTIONS AS OF Q2-2021(1)
AD300Pro
MT 3000 L
MTP 200,
300, MTP
Panel
Nova+
RAP-LLO [1]
[1]: see additional info in the “Transfer & Assembly - Process” section of this report.

16
Early stage [1] Advanced Tool Prototypes Commercial tools available
ACTIVE PLAYERS: STATUS AND COLLABORATION STRATEGY
An increasing
number of
established
equipment
makers are
showing interest
in microLED
transfer and
assembly tools.
[1]: some intellectual property activity, or have signal their intention/on-going effort in media, financial reporting, conferences etc.
[2]: High precision die bonders, suitable and used by various companies for microLED development work but not developed specially for this application
Mechanical
Transfer:
Laser
Transfer:
Laser
Transfer:
Mechanical
Transfer:
Non-µLED
Specific[2]:
Laser
Bonding:
Laser
Bonding:
Laser
Transfer:
Laser
Transfer:
KnS: commercial MiniLED tool
available Q4 2021. MicroLED
in development
Mechanical
Transfer:
DST
System
+
?
Maturity
In-houseTransfer Process
Collaboration with
microLED startup or
research institutions

17
XXX
XXX
XXX
XXX XXX XX
XXX
XXX
XXX
XXX
XXX XXX
$-
$200
$400
$600
$800
$1 000
$1 200
$1 400
$1 600
$1 800
$-
$5 000
$10 000
$15 000
$20 000
$25 000
$30 000
$35 000
$40 000
$45 000
$50 000
2021 2023 2025 2027 2029 2031
MicroLED Die and epiwafer cost Roadmap
Cost for 100M die Processed 6" µLED Chip On Wafer (CoW) Selling Price
FOCUS: CHIP ON WAFER AND DIE COST ROADMAP
XX x XX µm
Horizontal
Flip Chip
XX x XX µm
Horizontal
Flip Chip
XX x XX µm
Horizontal
Flip Chip
XX x XX µm
Vertical
Chip
XX x XX µm
Vertical
Chip ?
XX x XX µm
Vertical
Chip?
XXXXXXXXX
XXXXXXXXX
XXXXXXXXX
XXXXXXXXX
XXXXXXXXX
XXXXXXXXX
HVM
R&D HVM?
R&D HVM?
R&D
R&D
R&D
Note: for mass transfer, i.e excluding micro-displays (< 3 µm vertical chips)
HVM?
HVM (Apple iPhone)?
XXXXXXXXX HVM (Apple watch)?
R&D
Logos: current R&D focus at this node (HVM: High Volume Manufacturing)
Company Current focus (2021)
Apple -------------
Applied Materials -------------
Lextar -------------
LG -------------
Mikro Mesa -------------
Nitride Semicon. -------------
PlayNitride -------------
Sharp -------------
X-Display -------------
• The industry was initially confident that 6” Chip on Wafer
prices (including margins) could rapidly drop to <$XXX. This
target now appears elusive, putting even more pressure on die
size reduction.
• The industry is advancing different die sizes and structures.
Vertical die is the end game for cost/size but poses many
manufacturing as well as display testing & repair challenges.
• Some companies are shooting directly for vertical die though:
Apple, Mikro Mesa. Others use intermediate nodes of
horizontal Flip Chip to produce demoes and first products.
• A more than XXXx reduction in epiwafer cost seems unlikely
unless breakthrough technologies can be developed (e.g.:
iBeam Materials effort for R/R epitaxy on metal foils)
Transition to vertical chips?

18
2021 2022 2023 2024 2025 2026 2027 2028
Monitors - - - - - 0,0 0,1 0,3
TVs ("luxury" + consumer) 0,00028 0,0011 0,007 0,022 0,082 0,26 0,69 1,5
Laptops - - - - - - 1,3 3,8
AR/MR/VR 0,002 0,01 0,3 0,6 2,3 9,6 29,7 52,7
Automotive - - - - 0,1 0,6 1,4 3,1
Tablets - - - - - - 1,9 5,8
Smartwatches - - 1,1 22,1 55,3 109,6 130,4 148,2
Smartphones - - - - - - 44,8 96,1
Total 0 0 1 23 58 120 210 311
0 0 1
23
58
120
210
311
0
50
100
150
200
250
300
350
Million
of
Units
MicroLED PanelVolume Forecasts - Aggressive Scenario
Smartwatch and AR applications will drive initial adoption. Smartphone remains very challenging elusive. However, we are more
optimistic than in our previous report:Apple’s decision to push for a 200 mm microLED supply chain signals a strong will to enable
very small die high yields and manufacturing efficiency that are key to achieving the cost reduction required to enable smartphone
applications.
MICROLED ADOPTION:AGGRESSIVE SCENARIO
Smartwatches
+ AR/MR
TVs,
Automotive
Smartphones ?
2021 2022 2023 2024 2025 2026 2027 2028
Smartphones 0,0% 0,0% 0,0% 0,00% 0,00% 0,00% 2,8% 5,9%
Smartwatches 0,0% 0,0% 0,8% 13,7% 29,9% 53% 58% 61%
Tablets 0,0% 0,0% 0,0% 0% 0% 0% 1,0% 3,0%
Automotive 0,0% 0,0% 0,0% 0,0% 0,1% 0,3% 0,7% 1,5%
AR/MR/VR 0,01% 0,04% 1,1% 1,7% 4,1% 10,7% 23,0% 32,5%
Laptops 0,0% 0,0% 0,0% 0,00% 0,00% 0,00% 0,50% 1,50%
TVs 0,00011%0,0004% 0,003% 0,008% 0,030% 0,093% 0,24% 0,52%
Monitors 0,0% 0,0% 0,0% 0,00% 0,00% 0,01% 0,05% 0,20%
0%
10%
20%
30%
40%
50%
60%
70%
Adoption Rates Per Application

19
$2 000
$20 000
$200 000
$2 000 000
50 70 90 110 130 150 170 190 210 230 250
LCD 4K OLED 4K LCD 8K OLED 8K Mini/microLED 4K mini/MicroLED 8k Laser TV 4K
• Mini and microLED prices are coming
down but are still 15x to 30x higher
than what is acceptable for high-
end consumer products.
• LCD and OLED cost becomes
prohibitive above 85”. Laser TVs
(projection) is the only technology
to enable consumer-friendly prices
for large sizes, but unless used in a
darkened room, they deliver subpar
brightness and contrast compared to
other technologies.
• In the midterm, MicroLED therefore
have the most opportunities for
differentiation in larger sizes.
However, not every home can
accommodate a 90”+ display so this
market remains small in volume.
• In the longer term, how much microLED
cost can decrease will determine if and
when it can start challenging OLED or
even LCD in more widespread TV sizes
such as 75” or 85”.
PRICES: MICROLED, OLED, LCD AND LASER TVS.
Laser TV
8K miniLED
8K OLED
4K LCD
4K OLED
8K LCD
Konka “Aphaea”
miniLED 2020
Sony 220”
“Crystaled”
2017
Samsung 146 inch
“The Wall” miniLED
2019
($350k)
Konka 118”
“Aphaea” miniLED
2020
($240k)
Samsung 110”
µLED TV
2021
($155k)
Note: Samsung and LG 2020 and 2021 flagship MSRP used for 65” to 88” LCD on OLED respectively. For 98”,
used Sony and Samsung models for 8K and various Samsung and NEC for 4K. Xiaomi 2020 offer for limited
quantities of a 98” 4K model for $3300 is excluded. For 120” LCD: Sharp 8K model : 8M-B120C
4K mini/microLED
Sharp 120”
8K LCD
($150k)
$10,000
$100,000
Leyard
216“ 2021
Leyard 108“
2021
($136k)
$2000-$10,000:
High-end consumerTV
(B2C)
$10,000 - $100,000
“Luxury” consumerTV
+ B2B
$100,000+
B2B only (corporate,
high end retails etc.)
MicroLEDTVs’
Blue Ocean
???
Prices vs Size for Different Resolutions

20
B2B ADOPTION: INFORMATION DISPLAYS
With adoption of
mass transfer[1] and
reduction in chip size,
microLED onTFT
backplanes become
increasingly
competitive in sub-
millimeter (“P0.X”)
pixel pitch information
displays applications
(meeting rooms,
corporate lobbies,
retail etc.)
[1]: the smaller the pitch, the more die are transferred in a single printing cycle and the more cost competitive mass transfer becomes.
2021 2022 2023 2024 2025 2026 2027 2028
P0.X (m2 x 1000) 20 45 85 130 200 280 330 350
uLED (m2 x 1000) 0,0 1,4 4,3 13 40 98 182 245
MicroLED Adoption 0,2% 3,0% 5,0% 10,0% 20,0% 35,0% 55,0% 70,0%
0%
10%
20%
30%
40%
50%
60%
70%
80%
-
50
100
150
200
250
300
350
400
Suqare
Meter
(m
2
)
P0.X Market Forecast and microLED Adoption
2021 2022 2023 2024 2025 2026 2027 2028
uLED (m2 x 1000) 0,0 1,4 4,3 13 40 98 182 245
Equivalent 110" 12 404 1 272 3 892 11 976 29 341 54 341 73 353
-
10 000
20 000
30 000
40 000
50 000
60 000
70 000
80 000
90 000
100 000
-
50,0
100,0
150,0
200,0
250,0
300,0
110"
Equivalent
Suqare
meter
x
1000
MicroLED Information display Forecast
Square
Meter
x
1000
(m
2
)

21
MAIN APPLICANT RANKING AND LEGAL STATUS - GRANTED/PENDING/DEAD
590
505
424
381
351
286
272 270
244
211 210 209
193
174
146 135 135
123 121 115 115 114 105 100 98 98
80 70 67 63 53 46
34 33 31 27 24
Number of patents and their current legal status
Dead patents (expired, abandoned or rejected)
Pending Patents
Granted Patents
Number
Of
Patents
XXX
10%
XXX
7%
XXX
6%
XXX
4%
XXX
4%
XXX
3%
XXX
3%
XXX
3%
XXX
3%
XXX
2%
Others
55%
Granted Patents [1]
XXX
10% XXX
7%
XX
6%
XXX
4%
XXX
3%
XXX
3%
XXX
3%
XXX
XXX
XXX
2%
XXX
2%
Others
55%
Pending Patents [1]
[1]: as of January 2021
The ranking in terms of individual published patents differs slightly from the ranking in patent families, but high-level trends are similar.
©Yole Développement - August 2021

22
TECHNOLOGY MAP (NON-EXHAUSTIVE!)
In-display
sensors
(sensors)
Laser Detach
(transfer) PDMS Stamp
(transfer)
MEMS
(transfer)
Other self assembly
– Non fluidic
(transfer)
Surface tension, phase
transition, capillary forces,
vacuum membrane
displacement etc.
(transfer)
OpticalTweezer,
spring/pin-based
transfer, mechanical
self assembly etc.
(transfer)
Hybrid pixels and
hybrid displays
(µLED/OLED;
µLED/LCD)
(Pixel & Display
Architecture)
Chiplets,
“smart Pixels”
(Pixel & Display
Architecture)
Optical
multiplexing
(Monolithic /
microdisplay)
Contactless, wafer-
level µLED functional
testing
(Yield management,
testing & repair) Full LED + transistor
monolithic integration
(Monolithic/microdisplay)
Die shaping
(Chip structure &
manufacturing)
Selected Area
Growth
(Chip structure &
manufacturing)
Monolithic
RGB on same
wafer
(Chip structure &
manufacturing)
QD color
conversion
(color conversion
/ generation)
High efficiency Red
GaN emitters [1]
(color conversion /
generation)
Chip testing on
transfer head
(Yield management,
testing & repair)
Sidewall
Passivation,
current
confinement
(Chip structure
& manufacturing)
Self Assembled
nanorod LED
“QNED”
(chip structure, transfer
pixel & display
architecture)
Maturity /
Production
Readiness
Credibility /
Feasibility
Fluidic self
assembly
(transfer)
[1] Engineered substrates, rare earth doped, nanowires, strain induced etc.
Nanowire
µLED
(Chip
structure &
manufacturing)
Micro-
drivers
(Driving)

23
RECENT PROTOTYPES (NON EXHAUSTIVE)
The microLED
display
prototypes
shown to date
cover a broad
range of
potential
applications
and
performance
0,1
1
10
100
1000
1 10 100 1 000 10 000
Display
Size
(Inch
Diagonal)
Pixels Per Inch
TV, signage
Microdisplays
(AR,VR, HUD):
: smartphones
Wearables:
Tiling
(TFT
or
µDrivers)
Single
module
(
TFT
or
µDrivers)
GlassTFT or Microdrivers
Si CMOS
Monolithic
(
Si-CMOS)
PCB
Automotive:
RGB!
RGB!
+
+
+
CES 2012: Crystal LED 55” FHD
Video walls,PID
See Annex I for details

24
COLLABORATIONS BETWEEN LARGER COMPANIES

25
Multiple paths are being investigated to improve red InGaN LED.The name of the game: how to incorporate more indium?
Efficiency remains low compared to AlGaInP LEDs but rapid progress are being reported [1].
Color purity (defined as the Full Width Half Maximum) often remains an issue, indicating composition inhomogeneities when
trying to incorporate high indium contents in the alloy.
LOOKING FOR RED LED ALTERNATIVES
Technology Technology Companies
Optimized epitaxy xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
Strain engineering xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
Engineered substrates xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
Porous GaN xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
Semi-polar/non-polar GaN xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
Nanowires xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
LowT° GaN deposition xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
InGaN quantum well doping xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
Color conversion xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
[1]: KAUST reported 0.87% on 47 um chip, UCSB 0.2% on 10 um chips, some companies reported up to 5% at 5 µm and 10% with 20 µm chips but those data are unverifiable

26
• For microLED display assembled by mass transfer,
the throughput metric that matters is the display
area that can be produced per hour, i.e. the ratio of
the stamp area and the equipment cycle time.
• For example, an equipment with a 30x30 mm
stamp and a 20s cycle time can produce 0.16 m2 of
display per hour.
• As of mid 2021, the transfer rates of some the
major players in the industry range from ~XX to
~XX m2/hour [1].
WHERE DO WE STAND?
[1]: based on the “envelop” of public information available as of July 202. For
example,
xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
xxxxxxxxxxxx
-
0,2
0,4
0,6
0,8
1,0
1,2
1,4
1,6
1,8
2,0
Cycle
Time
(s)
m
2
per
hour
Stamp Size (mm)
TransferThroughput
1,8 - 2,0
1,6 - 1,8
1,4 - 1,6
1,2 - 1,4
1,0 - 1,2
0,8 - 1,0
0,6 - 0,8
0,4 - 0,6
0,2 - 0,4
- - 0,2
To increase throughput:
• Larger stamps
• Shorter cycle time
• Equipment with multiple
transfer heads
Throughput
Full RGB Display CycleTime
(seconds)
Number of transfer heads required to produce
1M display per year *
m2/hour
Watch 6” Phone 75"TV Watch 6” Phone 75"TV
Min 2021 XX XX XX XX XX XX XX
Max 2021 XX XX XX XX XX XX XX

27
EXAMPLE OF NEW ENTRANT (STAMP-BASED): LUXNOUR
Step #1
BulkTransfer to
Intermediate
Carrier:
LLO or wet etch
Step #2
Transfer from
Carrier to
Backplane
LuxNour’s 2-step transfer and assembly process relies on electromagnetic pattern-sensitive transfer head (PSH) and epiwafers with
magnetic die metallization and optional sacrificial layer for wet etch-based die singulation
OR
• For wet etch, Epi structures includes a sacrificial
layer under the die. Not needed for LLO.
• Die metallization contains magnetic material
• PSH of the exact layout of Epi wafer picks
up all dies during etch or LLO
• Sacrificial layer etched away
• Die transfer onto intermediate carrier
• Selective-PSH picks up die at desired display pitch
• Transfer to intermediate RGB die carrier, chiplets or
directly to display backbone (repeat for each color)
Alternatively, to the PSH, a die-level Addressable Micro Coils (AMC) head can be used for specific purpose
(KGD management, repair and backfill, etc)
Optical microscope view of a PSH
(source: Luxnour)

28
ILLUSTRATION:
Repair
pad
Missing Die
Mis-aligned Die Mis-aligned Die
Print Repair Die
Cracked Die
Defective Die or
Bonding
(not lighting up)
Disconnect bad
die
De-bond Bad Die
Inspection Repair Print Isolate/Remove
Right row:
RGB chips
Left row:
Bonding pads
for repair die
Picture: PlayNitride

29
Contact our
SalesTeam
for more
information
Displays and Optics for AR &
VR 2020
Next GenerationTV Panel
Technology and MarketTrends
2020
MicroLED Displays - Intellectual
Property Landscape and Analysis
2021
Microdisplays – Market, Industry
andTechnologyTrends 2020
YOLE GROUP OF COMPANIES RELATED REPORTS
Yole Développement

30
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System Plus Consulting, Knowmade and PISEO, are pleased to
provide you a glimpse of our accumulated knowledge.
Feel free to share our data with your own network, within your
presentations, press releases, dedicated articles and more. But
before that, contact our Public Relations department to
make sure you get up-to-date, licensed materials.
We will be more than happy to give you our latest results and
appropriate formats of our approved content.
Your contact: Sandrine Leroy, Dir. Public Relations
Email: leroy@yole.fr
HOWTO USE OUR DATA?

31
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