Are OTFTs ready to disrupt the display industry and enable fully-flexible devices? ORGANIC TFTS ARE ENTERING THE FAB BY THE BACK DOOR When trying to build a flexible display panel, the Thin Film Transistor (TFT) matrix is one of the most challenging and fragile functional layers. Interest in OTFT emerged in the mid-2000s when mobility reached values similar to amorphous silicon (a-Si), the dominant display backplane technology. This triggered a flurry of activity at leading display manufacturers, and prototypes rapidly emerged. Besides fast-improving electrical performance, OTFT’s intrinsic flexibility made the technology ideal for the realization of flexible displays. In 2007, the first ever flexible AMOLED panel was demonstrated by Sony and featured an organic TFT. However, interest waned as performance and homogeneity issues persisted, and other TFT technologies like LTPS and metal oxide emerged. Nevertheless, organic semiconductor companies kept perfecting their molecules and ink formulations, gaining a better understanding of the interaction between the materials, the transistor structure, and the manufacturing process. Consequently, performance in the lab improved by another order of magnitude. Combined with the explosive growth of flexible displays and the promise of a cost-efficient, solution-based manufacturing process, interest in OTFT has renewed. Panel makers remain cautious, but a handful in Taiwan and China are currently attempting to retrofit older Gen 2.5 - 4.5 fabs with OTFT. These first attempts to move OTFT into mass production will be critical for the technology’s future. Failure in these initial industrialization attempts could be fatal for the OTFT industry, or, at the very least, set it back many years. However, if OTFT proves that it can be mass produced and enables panel makers to revive those obsolete fabs with high-margin flexible displays, there are no fundamental barriers prohibiting the technology from being quickly scaled up to fabs Gen 8 or above, and possibly challenge the vast market for traditional a-Si based panels like LCD TV, monitors, etc. In the long-term, because they are inherently solution-processable, OTFTs are also an ideal backplane candidate for additive manufacturing and fully printed displays. More information on that report at http://www.i-micronews.com/reports.html

1. © 2015 - 2016
From Technologies to Market
OrganicTFT 2016:
Flexible Displays and
other Applications
Are organicTFTs ready to disrupt
the display industry and enable fully
flexible devices?
Sample
From Technologies to Market
Picture Credit: Samsung Display
FromTechnologies to Market
October 2016

2. 2
TABLE OF CONTENTS
• Table Of Contents p2
• About the Authors p7
• Who should Be Interested In this Report p8
• Objective Of the Report p9
• Scope Of the Report p10
• Companies cited in the report p11
• Glossary and Display Fundamentals p12
• Definitions and Acronyms
• Display Application Trends and Requirements
• Evolution of Display Substrate Sizes
• Display Substrates Example: Gen 10
• Display Resolutions
• Display structure Overview
• Executive Summary p19
• The 2 page summary: Panel Industry Perspective
• Overview ofTFT Channel Materials
• Pros and Cons
• Backplanes TechnologiesVs Applications
• Status of the Display Backplane Industry
• TFT Capacity Breakdown
• TFT Capacity Forecast
• Potential for OrganicTFT (OTFT)
• OTFT Technology Status
• OTFT Performance: HypeVersus Reality.
• OTFT Status: EPD and OLCD.
• Mid PPI flexible AMOLED for Wearable and Embedded displays.
• High end AMOLED and True flexibility?
• Conclusions: Potential for OTFT
• OTFT Applications Scorecard
• OTFT Application Roadmap
• Display Market: Panel consumption through 2022
• OTFT adoption: Base Scenario
• OTFT adoption:Aggressive Scenario
• Comparisons
• Overview of TFT BackplaneTechnologies and Market p55
• Active and Passive Matrix
• TFT and OLED Pixel Structures
• TFT current
• OLED vS. LCD TFT
• Specific Challenges for AMOLED Backplanes
• Conclusions
• TFT Channel Materials
• Factors of Merits of theVarious TFT Chanel Materials
• Mobility vs Display Specifications:
• TFT TechnologiesVs Applications
©2016 | www.yole.fr | Organic TFT

3. 3
TABLE OF CONTENTS
• TFT Backplane Technologies: Pros and Cons
• TFT Supply and Demand
• 2016 Geographic Breakdown
• Amorphous SiliconTrends
• Metal Oxide Trends
• LTPS and Organic TFT Trends
• Flexible Displays – Overview andTechnical Challenges p73
• Definition
• Introduction
• Potential Benefits
• Display Structure
• Challenges for Flexible display
• Technology Bricks for Flexible displays
• Flexible Display: Roadmap
• Commercial Status
• What’s coming next?
• Flexible Displays – Manufacturing Status p86
• Overview
• Flexible OLED capacity Expansion Plans
• Flexible EPD Status
• Front-planes For Flexible Displays p91
• Front-plane Candidates for Flexible Displays
• E-Papers: Electrophoretic And Cholesteric LCD
• Flexible LCD
• Flexible OLED
• Examples
• Japan Display Corporation
• JOLED
• Sony
• Sharp
• Substrates For Flexible Displays p108
• Requirements
• Major Types of Flexible Substrates
• Substrates Materials
• Substrates vs.TFT processTemperature
• Flexible Substrate Processing
• Roughness and Planarization
• De-bonding
• Material Trends
• Backplanes For Flexible Displays p118
• Introduction
• Candidates for Foldable Displays
• Technology Strategies for Flexible Backplanes
• Amorphous Silicon
• Amorphous Silicon for flexible Displays
• Low Temperature Polysilicon (LTPS)
• LTPS for flexible Displays
©2016 | www.yole.fr | Organic TFT

4. 4
TABLE OF CONTENTS
• Commercial Flexible LTPS Displays.
• Metal Oxides
• Benefits of IGZO TFT versus a-Si
• Evolution of IGZO technology at Sharp
• Other Metal Oxide TFT
• CBRITE
• Metal Oxides for flexible displays
• Illustration: LG 18” Flexible Display
• Illustration: SEL Flexible OLED Technology
• Solution Processed Oxide
• Other TFT:Amorphous Metal Non Linear Resistor (AMNR)
• Printed – Dopant Polysilicon (PDPS)
• Graphene and Carbon Nanotubes
• Focus on OrganicTFTs p143
• Overview
• Potential Benefits
• Organic TFT And True Flexibility
• Small Molecules vs Polymers
• Performance: Hype versus Reality.
• Pixel density and Channel Length
• Frequency Cut-Off
• Discussion
• TFT Performance vs Application Mapping
• OTFT Applications Roadmap
• Illustrations
• OTFT for LCD Displays
• OTFT For E-Paper
• OrganicTFT Manufacturing p167
• Major OTFT Technology Bricks
• OTFT Structure:Top GateVs Bottom Gate
• Detailed OTFT Structure.
• Control of Crystallization (Small Molecules)
• Example: SmartKem
• Interface Engineering & Material choices
• Patterning & Compatibility with TFT Fabs
• Illustration: Patterning
• Example of Process Flow (Photolithography)
• Discussion
• Conclusions
• OTFT Cost Of Ownership p179
• Key Benefits
• Requirements for Mass Production
• Bill Of Material
• Cost of Ownership
• Cost Of Ownership: Smartkem
©2016 | www.yole.fr | Organic TFT

5. 5
TABLE OF CONTENTS
• OrganicTFTVolume and Revenue forecast p187
• Methodology
• Display Panel Market
• Applications Segment SWOT
• OTFT Forecast- Base Scenario p193
• EPD (and other reflective/passive Technologies)
• Wearables
• Mobile Phones
• Embedded Displays:Automotive and Transportation
• Embedded Displays: Others
• Tablet, Laptops and convertible
• Digital Signage
• Monitors and TV:AMOLED
• Monitors and TV: LCD
• OTFT adoption trends: Summary
• Organic TFT Application Roadmap
• Volume and Price Hypothesis (OSC and Gate Insulator)
• OSC And OGI: 2016 – 2022Volume & Revenue Forecast
• Discussion:Aggressive Scenarios
• Technology Breakthrough Scenario #1: Printing Process p216
• Overview
• Illustrations
• Key Hypothesis
• Results
• Technology Breakthrough Scenario #2:Vertical Transistors p221
• Introduction
• Vertical OFET
• Vertical Organic Light Emitting Transistor (VOLET)
• Potential impact on market
• Price and consumption Hypothesis
• Conclusion
• Scenario Comparison and Conclusions p230
• Scenario comparisons
• OSC and OGI Revenue Scenario
• Conclusion
• End Game Scenario
• Non Display Applications p236
• Introduction
• SmartTags
• Thin Film Electronics
• Sensors and Imager Arrays: ISORG
• OrganicTFT Supply Chain p243
• OSC Suppliers
• Supply Chain
• Fab activity
©2016 | www.yole.fr | Organic TFT

6. 6
TABLE OF CONTENTS
• Selected Company Profiles p252
• SmartKem
• Merck - EMD
• BASF
• Polyera
• Neudrive
• Annex: OLED Display Structure and Key Technologies p266
• OLED: Operating Principle
• OLED Frontplane Structure Overview
• Full Amoled Display Structure (TFT + Frontplane)
• RGB OLED vs.White OLED
• Top and Bottom OLED Pixel Structures
• TFT and OLED Pixel Structures
• Summary: OLED Pixel Structures
• Discussion
• Expected Technology Evolution
©2016 | www.yole.fr | Organic TFT

7. 7
Biography & contact
ABOUT THE AUTHORS
Eric VIREY received a Ph-D in Optoelectronics from the National Polytechnic Institute of Grenoble. He’s held various R&D,
engineering, manufacturing and marketing positions with Fortune 500 company Saint-Gobain in France and the United States. In
its most recent position, he was Market Manager Optoelectronics in charge various product lines and serving the LED, optical
telecommunication and display industries. In parallel, he was leading the corporate “Lighting Community” effort, acting as a
market and technology competitive intelligence evangelist to identify and develop new business opportunities in solid state
lighting and displays (LED/OLEDs) across multiple business units.
Eric has a broad knowledge of the solid state lighting and display value chains. In 2009, he joined Yole Developpement as a Senior
Market andTechnology Analyst for Solid State Lighting and Displays
Eric is also author / co-author of multiples reports (examples below) and contributed to various custom projects.
• LED Packaging
• LED Front End Manufacturing
• III-V Epitaxy
• Bulk GaN
• GaN on Silicon
• Status of the LED Industry
• Sapphire Market & Applications
• Phosphors and Quantum Dots
• …
Contact: virey@yole.fr
©2016 | www.yole.fr | Organic TFT

8. 8
WHO SHOULD BE INTERESTED IN THIS REPORT
• Organic TFT material and technology
suppliers
• Understand the flexible TFT and display panel
ecosystem.
• Understand the panel maker requirements
and constrains.
• Understand the real value of OTFT.. And the
major roadblocks for adoption
• Understand the strength and weaknesses of
otherTFT technologies.
• OTFT competitive landscape: monitor and
benchmark your competitors
• Evaluate the volume and revenue potential for
your product
• R&D Organizations and Universities
• Understand the market potential of your
technologies for emerging markets
• Identify the best candidates for collaboration
and technology transfer.
• Display Makers
• Hype versus reality: what is the status of
Organic TFT? What can we expect in the
near future?
• Which application can OTFT address? A
detailed roadmap.
• What are the benefits and drawbacks of
OTFT vs established technologies?
• Find the right partner: detailed mapping
of the OTFT ecosystem: channel and full
TFT stack providers.
• Financial and strategic investors
• Understand and value chain of the TFT
industry and the challenges for flexible
displays.
• Key players and emerging start up in
organic semiconductors.
©2016 | www.yole.fr | Organic TFT

9. 9
OBJECTIVE OF THE REPORT
The report provides a complete review of establishedTFT backplanes technologies and a full analysis
of the status and prospect of OrganicThin FilmTransistors for displays and other applications.
Market data,
application
focus, analysis,
deep
understanding
…
• Understand the current status of the flexible display industry:
• Overview of the various types of flexible displays and main challenges associated in term of front plane
(LCD, OLED, EPD), backplanes and substrates.
• Current status of flexible display manufacturing: key players, fabs, capacity)
• Understand the specific challenges related to theTFT backplane:
• Detailed overview of the various types of established TFT backplanes: a-Si, LTPS, Metal Oxide
• Capacity trends per technology.
• Their respective potential and associated challenges for flexible displays.
• The first comprehensive study of OrganicTFT for displays and other applications:
• Technologies roadmap, SWOT analysis, manufacturing challenges, OTFT in the fab.
• Application analysis: pros and cons of OTFT for each segment, application roadmap.
• OTFT forecast (2017-2022): 3 different scenario with total OTFT surface (m2), OSC channel and gate
dielectric volumes (kg) and revenue (US$M),ASP forecast.
©2016 | www.yole.fr | Organic TFT

10. 10
SCOPE OF THE REPORT
• There are numerous potential applications for Organic TFTs. Examples include flexible, large-area electronics
applications, such as TFT backplanes for flexible displays, conformable sensor arrays, and plastic circuits.
This report
focuses on
display
applications
which represent
the single
largest
mid/short-term
application
potential for
OTFT.
Digital
Signag
e
Wearables
E-readers
Temperature,
biological,
electrochemical… Sensor Arrays, Imagers
(X-Ray, fingerprint…)
True-flexible, wearable
sensors, e-skin etc…
Flexible smart
systems, logic…
Embedded
(Automotive,
Industrial,
Medical…)
MobileTV &
Monitor
s
E-Ink
LCD
OLED
Smart Card, Smart
tags
Sensors
Imagers
E-Skin, wearable
sensors
Logic
©2016 | www.yole.fr | Organic TFT

11. 11
CHALLENGES FOR FLEXIBLE DISPLAY
Flexible Display: every single layer needs to be flexible!
TFT (electrodes, channel, dielectric, passivation…)
Backlight (LCD display only)
Frontplane (LC cells, polarizers, color filter substrate…)
Encapsulation (OLED only)
Touch sensor (glass, electrodes..)
Cover Lens and coatings (AR, anti fingerprint…)
• In addition to the requirement on each individual layer, delamination and creasing of the stacked layers
must be eliminated.
• The total number of layers and the total thickness must be minimized to reduce the stress experienced by
the layers.
• Ideally, the structure must be designed so that the most fragile and critical layer can be moved to the
neutral plane (experiencing the least stress) in the stack.
TFT Substrate
©2016 | www.yole.fr | Organic TFT

12. 12
EXAMPLES
Feature Specs
Presented August 2015
Size (Diagonal) 5”
Resolution / ppi 1280x720/ 295 ppi
TFT LTPS
Substrate PI
PanelThickness 200 µm with touch
OLED Structure RGB+CF /Top Emission
Encapsulation TFE
Bending Radius > 500k cycles at 4 mm
AUO
Feature Specs
Presented May 2014
Size (Diagonal) 9.55”
Resolution / ppi 640x432 / 81
TFT A-IGZO
Substrate PI
PanelThickness ?
OLED Structure RGB /Top Emission
Encapsulation TFE + barrier film
Bending Radius < 20 mm
BOE (CN)
Feature Specs
Presented May 2016 (SID)
Size (Diagonal) 4.35”
Resolution / ppi 1120x480 / 280
TFT ?
Substrate ?
PanelThickness ?
OLED Structure ?
Encapsulation TFE
Bending Radius 5 mm
BOE (CN)
©2016 | www.yole.fr | Organic TFT

13. 13
FLEXIBLE OLED CAPACITY EXPANSION PLANS (1)
Company Prototype Mass Production 2016 2017 and beyond
XXXX Yes
• Fab Name X: Gen 4.5 LTPS with XXk
substrate capacity producing small volume rigid
OLED + flexible OLED pilot.
• The company is cautious about OLED investment.
XXXX Yes No
• Fab Name X: 2 Gen 6 LTPS lines with XXk substrate capacity each.
One line dedicated to flexible OLED. Production to start in Q3-2017.
Total investment: US$Xb.
XXXX Yes No • No plans announced
XXXX Yes No
• Fab Name X: Gen 4.5 LTPS fab. Started OLED production at XXk
substrate capacity in 2016. Plan to start flexible OLED in Q2-2017
• Fab Name XGen 6 LTPS with XXk substrate capacity. Construction
to start end of 2016, production in H2-2018 will include flexible OLED.
XXXX Yes No
• Fab Name X: Gen 6 LTPS. Plan to manufacture OLED from 2018. will
have to include flexible OLED if expect to remain an Apple supplier.
XXXX Yes
• Fab Name X: Gen 4.5 LTPS with XXk
substrates for flexible OLED. SuppliesYYY
• Fab Name X: Gen 6 LTPS with initial capacity of XXk substrate for
flexible OLED to start in H2-2017.Total investment US$XXXm
XXXX Yes No ?
XXXX Yes No ?
©2016 | www.yole.fr | Organic TFT

14. 14
MAJOR TYPES OF FLEXIBLE SUBSTRATES
Flexible Glass
(Corning “Willow”,
Schott…)
Metal foils
(Stainless steel…)
High Temperature
Polymer optical Films
(PI, PES, PEEK…)
Common optical
polymer films
(PET, PEN, PC,TAC, PMMA…)
• Mechanical and thermal
characteristics well suited
forTFT manufacturing
process.
• Good oxygen and moisture
barriers (no need for back
encapsulation layer).
• Fairly low cost
• Not transparent.
• Poor surface roughness
(require planarization layer
or chemical-mechanical
polishing)
• Must be isolated to avoid
parasitic capacitance with
theTFT circuits.
• Can’t restored to original
shape once bent at a low
radius.
• Excellent optical properties
• Process ready surface
• Good oxygen and moisture
barrier.
• Low CTE
• Can’t be bent to small radius
(2016 best in class: 9 mm).
• Break easily, challenging to
handle in manufacturing.
• Excellent optical transparency.
• Low cost.
• Tend to birefringent: not
suitable for LCD.
• High CTE
• Poor surface roughness
(require planarization layer)
• Low glass transition
temperatureTg: unsuitable
for traditionalTFT processes
(a-Si, LTPS or oxides).
• PI: Strong absorption in the
visible spectra  unsuitable
for bottom emission and
transparent displays.
• High CTE (PES)
• High cost (>glass for display-
grade PI)
• Compatible with some or all
TFT process temperatures
(with some adjustments)
• Low CTE (PI)
Pros
Cons
©2016 | www.yole.fr | Organic TFT

15. 15
TFT AND OLED PIXEL STRUCTURES
• There are variousTFT architectures:
Example of TFTs fabrication steps: (a) gate definition,
(b) gate-insulator deposition, (c) channel layer
deposition (d) source/drain (S/D) definition, (e)
passivation (source: Transparent Oxide Semiconductors
for Advanced Display Applications, Arokia Nathan,
Information Display, Jan 2013)
Gate
Substrate
Gate Insulator
ChannelSource Drain
Gate Insulator
Substrate
Gate Insulator
DrainChannelSource
Gate
Top Gate TFT Bottom Gate TFT
• In “Bottom Emission” display structures, the light generated by the pixel is emitted toward the
TFT. In this configurations, the TFT array therefore blocks some of the light or reduces the active
surface of the pixel. It is therefore important to minimize the size of the TFT circuitry to increase
display brightness.
OLED
Emitting
area
Full
Pixel
Aperture ratio: in this example, the aperture ratio is ~ 30%
Picture:“Carbon Nanotube Driver Circuit for 6×6 Organic Light Emitting Diode Display”, Jianping
Zou et al. Scientific Reports 5, # 11755 (2015) ©2016 | www.yole.fr | Organic TFT

16. 16
2016 TFT GEOGRAPHIC BREAKDOWN
• Korea still dominates with close to 35% of worldwide capacity, followed by Taiwan with 30%.
• China currently represents 27% of the total capacity but is expected to become #1 by 2018 and capture 38% of the
total
China is on
track to
become the
#1 country in
term of panel
manufacturing
capacity by
2018
2016: Inner circle
2018: Outer circle
©2016 | www.yole.fr | Organic TFT

17. 17
DISPLAY MARKET: PANEL CONSUMPTION THROUGH 2022
• We estimate that the demand for TFT
display panels will reach XXX Millions
of m2 in 2016 and increase to XXXM
of m2 by 2022.
• Demand is strongly dominated by
large displays: television and
computer monitors. Smartphones
come third despite their smaller area
thanks to very high volumes. Together,
those 3 segments represent > XX%
of the total.
• Wearables (represented by the
categories “smartwatches” and “other
wearable”) as well as embedded
displays (automotive etc…) are
expect to experience fast growth but
remain a small fraction of about XX%
of the total TFT market.
• Note that “other wearable” category
is a catch all category to account for
wearable devices that are not
smartwatches. Those include
wristband, fitness trackers etc… and
possibly new applications.
©2016 | www.yole.fr | Organic TFT

18. 18
Number of Pixels
RequiredMobility(cm2/Vs)
1M 10M 100M
0.1
1
10
100
120Hz Dual Scan
120Hz Single Scan
Reduced blur
240Hz Single Scan
Blur free or 3D
HD 2k1k
1920x1080
4k2k UHD1
4096x2160
8k4k UHD2
8192x4320
MOBILITYVS DISPLAY SPECIFICATIONS:
Due to low mobility, a-Si 4k2k panels are limited to 120 Hz refresh rate
 otherTFT materials such as Oxides or LTPS are required for high
end 4K2KTVs with reduced motion blur and good 3D performance.
High resolutionTVs also require high performanceTFT materials
(Yole, derived from MatsuedaY 2010, Digest of Int.Transistor Conf. 2010)
2k1k 4k2k 8k4k
a-Si
HD
IGZO
LPTS,
New Oxides (?)
480Hz Single Scan
Blur free + 3D
Refresh Rate Refresh Rate & Resolution
LineTime (µs) for different combinations of resolution and refresh rates (e.g.:
for UHD at 120Hz, only have 3.85 µs for each line)
©2016 | www.yole.fr | Organic TFT

19. 19
OTFT PERFORMANCE: HYPEVERSUS REALITY.
• Communication of OTFT performance
is often focused on mobility. But other
parameters such as homogeneity,
reliability, manufacturability, cost of
ownership etc.. are equally important.
• State of the art molecular engineering
allows to deliver on all those criteria: all
the building blocks are ready in the lab.
But bringing it all together is another
challenge.
• Ultimately, the best OSC for mass
production of devices might not be the
one with the highest electrical
performance but rather, one designed
for the application that offers the best
compromise on those requirements.
• Material suppliers and OTFT
manufacturers will eventually develop
increasingly versatile process and
material toolboxes allowing them to
adjust the materials and the TFT
process to each application.
Mobility
Homogeneity
Electrical
Stability
Environmental
Stability
Manufacturability
Cost
©2016 | www.yole.fr | Organic TFT

20. 20
SMALL MOLECULES VS POLYMERS
• While mobility is a critical parameter, reproducibility and processability
are equally important.
• Small molecules tend to be ahead in term of performance but
crystallization is difficult to control. This creates homogeneity and
reproducibility issues.
• Amorphous and polymer materials have a wider process window but
lag in term of performance.
Small
molecule and
polymer each
have their
pros and cons.
But materials
and processes
have improved
dramatically
for both over
the last few
years.
Polymer OTFT (Merck)
W/L = 1000/20 µm
W
L
Small molecule OTFT (Merck)
W/L = 1000/50 µm
W
L
Homogeneity
Mobility
Polymers
©2016 | www.yole.fr | Organic TFT

21. 21
PIXEL DENSITY AND CHANNEL LENGTH
• As the resolution of mobile displays increases, the available surface for the TFT circuit decreases. In the last 2 generations of
Samsung’s Galaxy S6 and S7 phones (discussed below), we estimate that the 5 transistors + 2 capacitor + data lines required to
drive each subpixel must fit in a ~ XX x XX µm2 box (Samsung uses a top emission structure so the circuit can occupy the
entire pixel area). This estimate was confirmed by our sister company “System+ Consulting” which conducted a tear down
analysis of the Galaxy S6 (next pages)
XX µm
The human eye is most sensitive to green, especially for high resolution luminance
information. The Galaxy displays exploit this feature and use a pentile diamond
subpixel arrangement in which green pixels are interleaved with red and blue pixels:
• The green subpixels are mapped to input pixels on a one to one basis, reconstructing
the luminance signal to the display resolution (1440 x 2560). The red and blue
subpixels are subsampled, reconstructing the chromatic signal at a lower resolution.
• The Red, Green, and Blue sub-pixels have different sizes. The blue ones are the
largest because of the low material efficiency and human eye response sensitivity.
Feature Value
Display resolution 1440 x 2560
Display size 2.49” x 4.43” (5.1 inch diagonal)
Pixel density 577 PPI
Sub pixel count
Green: 3.69 millions (577 PPI)
Red, blue : 1.84 millions (408 PPI) each
Total: 7.37 millions
Average subpixel area XXX µm2
Estimated circuit area XX µm x XX µm
Subpixel driving circuit 5T1C
Pentile diamond subpixel arrangement in Samsung Galaxy S6 and S7 series.
XX µm
XX µm
©2016 | www.yole.fr | Organic TFT

22. 22
EXAMPLE OF PROCESS FLOW (PHOTOLITHOGRAPHY)
Glass Carrier
Flexible film substrate
S D OSC
Glass Carrier
Flexible film substrate
S D
Gate Dielectric
Gate
OSC
Glass Carrier
Flexible film substrate
S D
Gate Dielectric
Gate
Passivation
OSC
Glass Carrier
Flexible film substrate
S D
Gate Dielectric
Gate
Passivation
OSC
Glass Carrier
Flexible film substrate
S D
Gate Dielectric
Gate
Source & Drain
Mask #1
• Au,Ag, Cu or Al: sputtering
(typical: 50 nm/5nm)
• Patterned by photolithography +
wet etching.
• SAM treatment on contacts.
OSC and OGI
No Mask
• OSC (typ: 20-50 nm) and OGI deposited
by slot die or spin coating (small
substrates)
• OGI must be orthogonal to OSC
OSC
Glass Carrier
Flexible film substrate
S D
Gate Dielectric
Gate
Mask #2
• Ag,Al, Cu or ITO: sputtering (typical: 50nm)
• Patterned by photolithography + wet etching
(additional passivation and/or adhesion layer
required before depositing and patterning the gate)
Organic Layers Patterning
• Dry etching (RIE)
• Use the gate metal as the mask
Passivation
Mask 3
• Solution processable (e.g.: Polyvinalalcohol)
formulated as a negative tone resist,
deposited by slot die.
• Patterning by photolithography (material can
be directly photo patternable)
Contacts
Mask 4
• Au: sputtering (typical: 50 nm)
©2016 | www.yole.fr | Organic TFT

23. 23
BILL OF MATERIAL
• The level of complexity in the molecular engineering and manufacturing process of the OSC is not too different from that of
OLED materials such as the ETL, HTL etc... As volume increase, the cost of the OSC material could decrease toward similar
levels (<$XX/g)
• The cost per gram of the gate dielectric is lower than that of the OSC but offers less opportunity for cost reduction. Long
term cost will depend on the chemistry and the level of functionalities put into them (crosslinked, photo-patternable etc…).
• The binder material used in the ink formulation is not highly engineered and generally low cost, to the exception of
companies that use a low performance polymer semiconductor.
• We estimate that the BOM for OTFT could drop by 40 to 50% over the next 3-5 years and a factor of 2.5 to 3x if adoption
rate enable high volumes and economies of scale. Ultimately, transition to an additive manufacturing process (inkjet or other
printing technology) could further reduce the cost.
Key Hypothesis Short term
Mid term -
Base
HighVolume
OSC cost ($/g) $XXX $XXX $XXX
Binder cost ($/g) $XXX $XXX $XXX
OGI ($/g) $XXX $XXX $XXX
Metal ($/g) $XXX $XXX $XXX
OSC & OGI Thickness
OSC: XX nm
OGI: XX nm
OSC: XX nm
OGI: XX nm
OSC: XX nm
OGI: XX nm
Organic material utilization
efficiency
(Slot dye coating)
75% 75% 75%
©2016 | www.yole.fr | Organic TFT

24. 24
OSC AND OGI REVENUE FORECAST THROUGH 2022
• The base scenario shows that under the current
technology roadmap and status of the industry,
OTFT will remain a niche market. The market for
OSC materials remains small and can’t support
more than a couple of companies able to capture
the most value by selling all materials in the stack.
• Under this scenario, it is not clear if the industry
will reach a critical mass to allow a massive take
off. Will material suppliers and panel makers
continue to invest to enable a larger market?
• Our “breakthrough” scenarios illustrate how
further technology advancements could enable a
much larger market. The underlying assumption
for those scenario are:
• The “Printing scenario” accelerates
penetration of AMOLED TVs versus LCD by
reducing manufacturing cost. It provides incentive
for panel makers to accelerate development of
printable TFTs. This enables OTFT penetration in
TVs
• The “Vertical TFT scenario” accelerates OTFT
performance and increases OSC consumption per
unit surface.
To create a
significant
market, a
technology
breakthrough, or
an acceleration
of the current
OTFT roadmap
is required.
©2016 | www.yole.fr | Organic TFT

25. 25
THIN FILM ELECTRONICS
• The company initially developed various types of organic electronic devices in collaboration with Xerox PARC, including a display
driver based on complementary organic logic demonstrated in 2013.
• Its commercial and development efforts now focus on thin film memories, smart labels and NFC barcodes.
• Its temperature threshold labels were initially based on OTFT with materials supplied by Polyera.
• Its sensing and logic development efforts (NFC-enables smart labels that combine sensing + wireless communication) however are focused on
Printed – Dopant Polysilicon (PDPS).The technology was acquired from Kovio / Printed Logic in 2014
Thinfilm’s Product Overview (source: Company)
©2016 | www.yole.fr | Organic TFT

26. 26
SMARTKEM (1)
• SmartKem was founded in 2009 and is based in Manchester (UK). The company sells or licenses its semiconductor inks and has the ability to
deliver test kits including full TFT arrays[1] . As of Q4-2015, the company had 35 employees, rising to 40 by the end of 2016. The team includes
former employees of Samsung, Merck, Kodak, Liquivista, CDT,Avecia, ICI, Philips and Qualcomm.
• SmartKem has announced 4 joint-development agreement (JDA) and 2 Letters of intent (LOI) with various partners including some major
Asian display manufacturers. The intention of these agreements is to transfer SmartKem OSC technology into existing production lines at
those display manufacturers once process feasibility has been established.
• SmartKem also has a JDA with BASF and in August 2014, the company raised €3 million in a series A funding including €1 million from BASF
ventures and other investors. BASF stated that “The technologies and portfolios of both SmartKem and BASF have complementary aspects; moreover,
BASF has a long experience on bringing technologies from an early stage to commercialization, leading to collaboration to help speed up the market
penetration of flexible organic electronics. In this case, BASF VC has been supporting the company in their prioritization of the infrastructure needed to
commercialize their products, drawing on experience from BASF’s core chemical business”.
• SmartKem technology platform marketed under the trademark truFLEX™ consists of high mobility organic semiconductor molecules and
inks for the fabrication of TFT backplanes. The company offers a “full stack” toolbox including OSC, OGI, passivation, planarization materials as
well as processes and transistor designs.
[1] In order to test and demonstrate its products, the company has the capabilities to produce its ownTFT's using combinations of photolithography, printing and coating methods
(uses shadow and gate masks).
MOLECULES
Fully synthesized and purified small
molecule organic semiconductors
and fully synthesized functional
polymers.
INKS
Formulations comprising of
SmartKem molecules in suitable
solvent systems which are customized
for wet processing techniques such as
printing and coating.
PROCESSING
Specialized know-how relating
to wet processing methods
and fabrication conditions
DEVICES
Specialized know-how relating
to the construction and
overall materials stack
for Organic Thin Film
Transistors (OTFT)
©2016 | www.yole.fr | Organic TFT

27. 27
RELATED REPORTS
Discover more related reports
within our bundles here.
©2016 | www.yole.fr | Organic TFT

28. © 2016
Yole Développement
FromTechnologies to Market

29. 29
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30. 30
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32. 32
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35. 35
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36. 36
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MARKET ANDTECHNOLOGY REPORTS
byYole Développement
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Opportunities 2016…
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38. 38
OUR 2016 REPORTS PLANNING (2/2)
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39. 39
OUR 2015 PUBLISHED REPORTS LIST
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o POWER ELECTRONICS
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40. 40
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43. When trying to build a flexible display panel, the
Thin Film Transistor (TFT) matrix is one of the
most challenging and fragile functional layers.
Interest in OTFT emerged in the mid-2000s when
mobility reached values similar to amorphous
silicon (a-Si), the dominant display backplane
technology. This triggered a flurry of activity at
leading display manufacturers, and prototypes
rapidly emerged. Besides fast-improving electrical
performance, OTFT’s intrinsic flexibility made
the technology ideal for the realization of flexible
displays. In 2007, the first ever flexible AMOLED
panel was demonstrated by Sony and featured an
organic TFT.
However, interest waned as performance and
homogeneity issues persisted, and other TFT
technologies like LTPS and metal oxide emerged.
Nevertheless, organic semiconductor companies
kept perfecting their molecules and ink
formulations, gaining a better understanding of the
interaction between the materials, the transistor
structure, and the manufacturing process.
Consequently, performance in the lab improved
by another order of magnitude. Combined with
the explosive growth of flexible displays and
the promise of a cost-efficient, solution-based
manufacturing process, interest in OTFT has
renewed.
Panel makers remain cautious, but a handful in
Taiwan and China are currently attempting to
retrofit older Gen 2.5 - 4.5 fabs with OTFT. These
first attempts to move OTFT into mass production
will be critical for the technology’s future. Failure in
these initial industrialization attempts could be fatal
for the OTFT industry, or, at the very least, set it
back many years. However, if OTFT proves that it
can be mass produced and enables panel makers
to revive those obsolete fabs with high-margin
flexible displays, there are no fundamental barriers
prohibiting the technology from being quickly scaled
up to fabs Gen 8 or above, and possibly challenge
the vast market for traditional a-Si based panels like
LCD TV, monitors, etc. In the long-term, because
they are inherently solution-processable, OTFTs
are also an ideal backplane candidate for additive
manufacturing and fully printed displays.
This report presents a detailed review of flexible
displays, including an analysis of technical challenges
(frontplane, backplane, substrates), manufacturing
status, key players, and technologies.
This report also provides a complete review of
established TFT backplane technologies.
ORGANIC THIN FILM TRANSISTOR (OTFT) 2016:
FLEXIBLE DISPLAYS AND OTHER APPLICATIONS
Market & Technology report - October 2016
ORGANIC TFTs ARE ENTERING THE FAB BY THE BACK DOOR
Are OTFTs ready to disrupt the display industry and enable fully-flexible devices?
KEY FEATURES OF THE REPORT
Get the sample of the report
on www.i-Micronews.com
• Flexible displays: benefits,
challenges, roadmap, technologies
(frontplanes, backplanes and
substrates)
• Backplanes for flexible displays:
a-Si, LTPS, metal-oxide, OTFT
• OTFT performance roadmap,
challenges, cost of ownership,
progress toward the fab, SWOT
analysis
• OTFT application roadmaps:
detailed segment analysis
(wearable, mobile, laptops
tablets, TV monitors, automotive
embedded displays, digital
signage, e-readers)
• OTFT materials volume and
revenue forecast through 2022
OBJECTIVES OF THE REPORT
This report provides a full analysis of
the status and prospects for organic
thin film transistors (OTFT) for
displays and other applications:
• Main challenges for producing
flexible displays
• TFT backplanes: technology
review, capacity analysis, potential
for flexible displays
• OTFTs: technology roadmap,
SWOT analysis, manufacturing
challenges, OTFT in the fab
• Application: pros and cons
of OTFT for each segment,
application roadmap, penetration
forecast
• 2017 - 2022 forecast: total OTFT
surface (m2
), channel and gate
dielectric volumes (kg) and
revenue (US$M), ASP forecast
(Yole Développement, October 2016)
TFT performance and flexibility
Mobility
(cm2/vs)
Bending radius
(mm)
1
0.1
10
100
0.1110100
True flexibilityCurved
Bendable /
Conformable
Foldable /
Rollable
Medical sensors
X-Ray Imager
0.01
EPD
Mid-resolution
Wearable displays
(300 ppi)
Metal Oxide
LTPS
OTFT 2016 lab result /
Mid term fab goal (5 years)
OTFT 2016 “Fab-level” performance
a-Si
Possible extension
of oxide flexibility?
ORGANIC SEMICONDUCTOR (OSC) SUPPLIERS HAVE MORPHED INTO FULL
SOLUTION PROVIDERS
The display panel industry tends to require high
capex in order to generate fairly low margins.
Companies are therefore relatively conservative
when it comes to switching to new TFT. They look
for technologies that:
• Are highly compatible with existing process and
equipment.
• Generate higher margins than the incumbent
technology by allowing higher added-value
products (OLED, flexible displays) and/or reduced
manufacturing costs.

44. ORGANIC THIN FILM TRANSISTOR (OTFT) 2016: FLEXIBLE DISPLAYS AND OTHER APPLICATIONS
ORGANIC TFTs ARE SEARCHING FOR THEIR FIRST KILLER APPLICATION
OTFT mobility in the lab now exceeds 10 cm2
/vs,
with record values up to 40 cm2
/vs, theoretically
good enough to drive all display types and compete
with all TFT technologies. But while these results are
a good indication of the progress made with organic
semiconductors, they have been obtained in conditions
far from practical in actual fabs and commercial devices.
Current realistic fab-level performance stands in the
range of 1 - 2 cm2
/vs, with a credible path toward 3 - 5
cm2
/vs over the next 18 months - 3 years, and possibly
10 cm2
/vs and above within 5 - 10 years.
At the current level, OTFTs are already superior to
the dominant a-Si platform and enable a whole new
range of very cost-effective, flexible electrophoretic
and LCD displays with a bending radius as low as 30
mm. Not exactly “foldable”, but flexible enough to
conform to curved surfaces in all application types,
such as embedded displays in automotive, consumer
appliances, and digital signage. These displays also
feature reduced weight and thickness and improved
ruggedness from their plastic-based construction.
The aforementioned applications could become a
stepping stone for OTFT, allowing panel makers
to validate and optimize the technology in their
Gen 2.5 - 4.5 fabs and prepare to scale up to larger
substrates while material suppliers fine-tune their
molecules to reach performance sufficient to drive
mid-pixel density OLEDs. This would unlock a whole
new range of applications by enabling cost-effective
manufacturing of low power consumption, fully
flexible displays for wearable and mobile applications.
From there, it remains to be seen if performance
will further improve in order to serve the high-end
OLED market, or if OTFT can deliver on its cost-
effectiveness promises. If so, OTFT could become
a credible alternative to a-Si in the manufacture of
large LCD panels, enabling higher resolution and
higher brightness - features that are critical to the
UHD TV market’s emergence.
This report focuses on OTFT display applications and
the associated market volume for the period 2016 –
2022, broken down in 13 segments. Moreover, this
report provides an analysis of market volume and revenue
for organic semiconductors (OSC) and gate insulators (i.e.:
OGI). Our forecasts have been developed on the basis of
different scenarios, taking into account potential future
technology breakthroughs (i.e. printing process, vertical
transistors).
OTFT performance vs. applications mapping
(Yole Développement, October 2016)
Virtual Reality /
Augmented
Reality
Sensors
EPD EWD
LCD TV
FHD to UHD
50 200100 400 800
0.1
1
10
100
Mobile OLED
FHD to UHD
Mobility (cm²/vs)
Pixel
density
(PPI)
3
30
0.3 2016 OSC
performance
status
Long term OSC
potential ?
New applications: flexible
OLED in wearable
embeddable
1600
Traditional
applications
Applications with strong
potential for OTFT?
Conformable OLCD in
wearable embeddable
OLED TV
FHD to
UHD
Mobile LCD
FHD to UHD
Organic semiconductor suppliers have realized that
success means offering turnkey solutions comprising
the full material stack, and processes as compatible as
possible with old a-Si equipment. This means photo-
patternable, cross-linkable materials that can be
processed with existing broadband lithography tools
already present in the fab, and which can withstand
traditional patterning and etching techniques.
In the short-term, this puts significant stress on
companies that started as small teams of organic
materials experts. These companies now must access
additional capital and set up partnerships in order
to access fab equipment and develop a full process
toolbox.
However, in the long-term this will permit surviving
companies to capture more added-value than by
simply supplying the channel material.
This report presents a detailed analysis of OTFT, including
benefits, challenges, performance status, and roadmaps.
Additionally, this report provides an analysis of OTFT
manufacturing (technologies, structure, etc.), cost of
ownership, and competitive landscape (i.e. supply chain,
OSC suppliers). Company profiles for key players are also
included.
System approach for OTFT performance optimization
(Yole Développement, October 2016)
• Design for manufacturing
• Contact resistance
• Wavy channels
• Optimized thicknesses:
OSC, OGI
OSC molecule
engineering
Ink engineering
Transistor
architecture
design
Manufacturing
process
Optimization
of non OSC
materials and
surfaces
• High charge mobility
• Stability
• Polymer / small
molecule blends
• Control of phase
separation
Contacts materials, •
SAM treatment
Surface roughness •
and interfaces
Other surface treatment •
to control wetting
Surface free energy •
and phase separation
Limit damages of critical layers •
Precise control of patterns •
(lithography or printing)
Control of crystallization •
(electric field, directional
crystallization, substrate
patterning…)
OTFT Performance

45. • Phosphors Quantum Dots for LED
Applications: Patent Landscape 2016
• Samsung Galaxy S6 teardown
physical analysis of key components
Find all our reports on
www.i-micronews.com
Find more
details about
this report here:
MARKET TECHNOLOGY REPORT
AUTHOR
Dr Eric Virey serves as a Senior Market
andTechnologyAnalystandhascontributed
to the development of sapphire LED
activities at Yole Développement (Yole),
the “More than Moore” market research
and strategy consulting company. Eric
has a broad knowledge of the sapphire,
solid state lighting and display industries:
Since 2009, he authored multiple Yole’s
reports, he also contributed to multiple
custom projects with Yole Finance. Before
that, he’s held various RD, engineering,
manufacturing and marketing positions
with Fortune 500 Company Saint-Gobain
in France and the United States. Those
included a 5 year tenure as Market Manager
in charge of Sapphire substrates and
materials for optical telecoms and displays,
a 3-year cross functional corporate
position where he acted across multiple
business units as a market and technology
evangelist to identify and develop new
business opportunities in solid state lighting
(LED/OLEDs). Dr Eric Virey holds a Ph-D
in Optoelectronics from the National
Polytechnic Institute of Grenoble.
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COMPANIES CITED IN THE REPORT (non exhaustive list)
Amorphyx, Apple, Ares Materials, AU Optronics, BASF, BOE, Cambridge Display Technology, Cbrite,
CEC Panda, Chunghwa Picture Tube, Coherent, Corning, CSOT, Dupont, Dupont Teijin, E-Ink, ETC.
SAES, Everdisplay Corporation, Evonik, FlexEnable, FlexInk, FlexUp, Fujifilm, Hannstar, Innolux, ISORG,
Japan Display, JOLED, Kaneka, Kateeva, Kolon, Konika Minolta, LG Displays, Merck, MGC, Mitsubishi
Chemical, Neudrive, New Vision, Nippon Kayaku, Novaled, nVerPix, Panasonic, Plastic Logic, Polyera,
Ricoh, Royole, Samsung, Schott, Seiko Epson, SEL, Sharp, SmartKem, Solip Technology, Sony, Sumitomo
Bakelite, ThinFilm electronics, Tianma, Tokyo Electron, Toppan, Toyobo, Visionox; and more
Glossary and display fundamentals 12
Executive summary 19
Overview of TFT backplane technologies
and market 55
Active and passive matrix
TFT and OLED pixel structures
TFT current
OLED vs. LCD TFT
Specific challenges for AMOLED backplanes
TFT channel materials
Mobility vs. display specifications
TFT technologies vs. applications
TFT backplane technologies - pros and cons
TFT supply and demand
Amorphous silicon, metal oxide, LTPS and
organic TFT trends
Flexible displays - Overview and technical
challenges 73
Potential benefits
Display structure
Challenges for flexible displays
Technology bricks for flexible displays
Flexible display - roadmap
Commercial status
What’s coming next?
Flexible displays - Manufacturing status 86
Frontplanes for flexible displays 91
Frontplane candidates for flexible displays
E-papers - electrophoretic and cholesteric LCD
Flexible LCD and OLED
Focus on Japan Display Corporation, JOLED,
Sony, Sharp
Substrates for flexible displays 108
Requirements
Major flexible substrate types
Substrate materials
De-bonding
Material trends
Backplanes for flexible displays 118
Technology strategies for flexible backplanes
Amorphous silicon
Low-temperature polysilicon (LTPS)
Metal oxides
Focus on CBRITE
Solution-processed oxide
Other TFT - amorphous metal non-linear
resistor (AMNR)
Printed dopant polysilicon (PDPS)
Graphene and carbon nanotubes
Focus on organic TFTs 143
Potential benefits
Organic TFT and true flexibility
Small molecules vs. polymers
Performance - hype vs. reality
TFT performance vs. application mapping
OTFT applications roadmap
OTFT for LCD displays and e-paper
Organic TFT manufacturing 167
Major OTFT technology bricks
OTFT structure
Crystallization control
Interface engineering material choices
Patterning and compatibility with TFT fabs
Organic TFT cost of ownership 179
Key benefits
Bill of material
Cost of ownership
Organic TFT volume and revenue forecast 187
Display panel market
Applications segment SWOT
Organic TFT forecast - Base scenario 193
EPD (and other reflective/passive technologies)
Wearables
Mobile phones
Embedded displays
Tablet, laptops, and convertibles
Digital signage
Monitors and TV
OTFT adoption trends
OTFT application roadmap
Volume and price hypothesis
OSC and OGI - 2016 - 2022 volume and revenue
forecast
Discussion - aggressive scenarios
Technology breakthrough scenario
#1 - Printing process 215
Key hypothesis
Results
Technology breakthrough scenario
#2 - Vertical transistors 220
Vertical OFET
Vertical organic light-emitting transistor (VOLET)
Scenario comparison and conclusions 229
Non-display applications 235
Smart tags
Thin film electronics
Sensors and imager arrays - ISORG
Organic TFT supply chain 242
Selected company profiles 251
SmartKem
Merck - EMD
BASF
Polyera
Neudrive
Appendix - OLED display structure
and key technologies 265
TABLE OF CONTENTS (complete content on i-Micronews.com)

46. ORDER FORM
Organic Thin Film Transistor (OTFT) 2016: Flexible Displays and Other Applications
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(1)
Our Terms and Conditions of Sale are available at
www.yole.fr/Terms_and_Conditions_of_Sale.aspx
The present document is valid 24 months after its publishing date:
October 25, 2016
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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to
corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing (technology or process), Yole Développement
group has expanded to include more than 50 associates worldwide covering MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics, Microfluidics
Medical, Photovoltaics, Advanced Packaging, Manufacturing, Nanomaterials and Power Electronics. The group supports industrial companies, investors and RD
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47. Definitions: “Acceptance”: Action by which the Buyer accepts
the terms and conditions of sale in their entirety. It is done by
signing the purchase order which mentions “I hereby accept
Yole’s Terms and Conditions of Sale”.
“Buyer”: Any business user (i.e. any person acting in the course
of its business activities, for its business needs) entering into the
following general conditions to the exclusion of consumers acting
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one hand and the Buyer on the other hand.
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rights held by the Seller in its Products, including any patents,
trademarks, registered models, designs, copyrights, inventions,
commercial secrets and know-how, technical information,
company or trading names and any other intellectual property
rights or similar in any part of the world, notwithstanding the fact
that they have been registered or not and including any pending
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and a consulting approach), is defined in the order. Reports are
established in PowerPoint and delivered on a PDF format and the
database may include Excel files.
“Seller”: Based in Lyon (France headquarters), Yole
Développement is a market research and business development
consultancy company, facilitating market access for advanced
technology industrial projects. With more than 20 market
analysts, Yole works worldwide with the key industrial companies,
RD institutes and investors to help them understand the markets
and technology trends.
1. SCOPE
1.1 The Contracting Parties undertake to observe the following
general conditions when agreed by the Buyer and the Seller.
ANY ADDITIONAL, DIFFERENT, OR CONFLICTING
TERMS AND CONDITIONS IN ANY OTHER DOCUMENTS
ISSUED BY THE BUYER AT ANY TIME ARE HEREBY
OBJECTED TO BY THE SELLER, SHALL BE WHOLLY
INAPPLICABLE TO ANY SALE MADE HEREUNDER AND
SHALL NOT BE BINDING IN ANY WAY ON THE SELLER.
1.2 This agreement becomes valid and enforceable between the
Contracting Parties after clear and non-equivocal consent
by any duly authorized person representing the Buyer. For
these purposes, the Buyer accepts these conditions of sales
when signing the purchase order which mentions “I hereby
accept Yole’s Terms and Conditions of Sale”. This results in
acceptance by the Buyer.
1.3 Orders are deemed to be accepted only upon written
acceptance and confirmation by the Seller, within [7 days] from
the date of order, to be sent either by email or to the Buyer’s
address. In the absence of any confirmation in writing, orders
shall be deemed to have been accepted.
2. MAILING OF THE PRODUCTS
2.1 Products are sent by email to the Buyer:
• within [1]
month from the order for Products already
released; or
• within a reasonable time for Products ordered prior to
their effective release. In this case, the Seller shall use its best
endeavours to inform the Buyer of an indicative release date
and the evolution of the work in progress.
2.2 Some weeks prior to the release date the Seller can propose
a pre-release discount to the Buyer
The Seller shall by no means be responsible for any delay in
respect of article 2.2 above, and including incases where a
new event or access to new contradictory information would
require for the analyst extra time to compute or compare
the data in order to enable the Seller to deliver a high quality
Products.
2.3 The mailing of the Product will occur only upon payment
by the Buyer, in accordance with the conditions contained
in article 3.
2.4. The mailing is operated through electronic means either by
email via the sales department or automatically online via an
email/password. If the Product’s electronic delivery format
is defective, the Seller undertakes to replace it at no charge
to the Buyer provided that it is informed of the defective
formatting within 90 days from the date of the original
download or receipt of the Product.
2.5 The person receiving the Products on behalf of the Buyer
shall immediately verify the quality of the Products and their
conformity to the order. Any claim for apparent defects or
for non-conformity shall be sent in writing to the Seller within
8 days of receipt of the Products. For this purpose, the Buyer
agrees to produce sufficient evidence of such defects. .
2.6 No return of Products shall be accepted without prior
information to the Seller, even in case of delayed delivery.
Any Product returned to the Seller without providing prior
information to the Seller as required under article 2.5 shall
remain at the Buyer’s risk.
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sold on a unit basis or corresponding to annual subscriptions.
They are expressed to be inclusive of all taxes. The prices
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deemed to be the one applicable at the time of the order.
3.2 Yole may offer a pre release discount for the companies willing
to acquire in the future the specific report and agreeing on the
fact that the report may be release later than the anticipated
release date. In exchange to this uncertainty, the company will
get a discount that can vary from 15% to 10%.
3.3 Payments due by the Buyer shall be sent by cheque payable to
Yole Développement, credit card or by electronic transfer to
the following account:
HSBC, 1 place de la Bourse 69002 Lyon France
Bank code: 30056
Branch code: 00170
Account n°: 0170 200 1565 87
BIC or SWIFT code: CCFRFRPP
IBAN: FR76 3005 6001 7001 7020 0156 587
To ensure the payments, the Seller reserves the right to request
down payments from the Buyer. In this case, the need of down
payments will be mentioned on the order.
3.4 Payment is due by the Buyer to the Seller within 30 days
from invoice date, except in the case of a particular written
agreement. If the Buyer fails to pay within this time and fails
to contact the Seller, the latter shall be entitled to invoice
interest in arrears based on the annual rate Refi of the «BCE»
+ 7 points, in accordance with article L. 441-6 of the French
Commercial Code. Our publications (report, database, tool...)
are delivered only after reception of the payment.
3.5 In the event of termination of the contract, or of misconduct,
during the contract, the Seller will have the right to invoice
at the stage in progress, and to take legal action for damages.
4. LIABILITIES
4.1 The Buyer or any other individual or legal person acting on
its behalf, being a business user buying the Products for its
business activities, shall be solely responsible for choosing the
Products and for the use and interpretations he makes of the
documents it purchases, of the results he obtains, and of the
advice and acts it deduces thereof.
4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable
pecuniary loss, caused by the Products or arising from a
material breach of this agreement
4.3 In no event shall the Seller be liable for:
a) damages of any kind, including without limitation, incidental
or consequential damages (including, but not limited to,
damages for loss of profits, business interruption and loss of
programs or information) arising out of the use of or inability
to use the Seller’s website or the Products, or any information
provided on the website, or in the Products;
b) any claim attributable to errors, omissions or other
inaccuracies in the Product or interpretations thereof.
4.4 All the information contained in the Products has been
obtained from sources believed to be reliable. The Seller
does not warrant the accuracy, completeness adequacy or
reliability of such information, which cannot be guaranteed to
be free from errors.
4.5 All the Products that the Seller sells may, upon prior notice
to the Buyer from time to time be modified by or substituted
with similar Products meeting the needs of the Buyer. This
modification shall not lead to the liability of the Seller,
provided that the Seller ensures the substituted Product is
similar to the Product initially ordered.
4.6 In the case where, after inspection, it is acknowledged that
the Products contain defects, the Seller undertakes to replace
the defective products as far as the supplies allow and without
indemnities or compensation of any kind for labor costs,
delays, loss caused or any other reason. The replacement is
guaranteed for a maximum of two months starting from the
delivery date. Any replacement is excluded for any event as set
out in article 5 below.
4.7 The deadlines that the Seller is asked to state for the mailing
of the Products are given for information only and are not
guaranteed. If such deadlines are not met, it shall not lead to
any damages or cancellation of the orders, except for non
acceptable delays exceeding [4] months from the stated
deadline, without information from the Seller. In such case only,
the Buyer shall be entitled to ask for a reimbursement of its first
down payment to the exclusion of any further damages.
4.8 The Seller does not make any warranties, express or implied,
including, without limitation, those of sale ability and fitness for
a particular purpose, with respect to the Products. Although
the Seller shall take reasonable steps to screen Products for
infection of viruses, worms, Trojan horses or other codes
containing contaminating or destructive properties before
making the Products available, the Seller cannot guarantee
that any Product will be free from infection.
5. FORCE MAJEURE
The Seller shall not be liable for any delay in performance directly
or indirectly caused by or resulting from acts of nature, fire, flood,
accident, riot, war, government intervention, embargoes, strikes,
labor difficulties, equipment failure, late deliveries by suppliers or
other difficulties which are beyond the control, and not the fault
of the Seller.
6. PROTECTION OF THE SELLER’S IPR
6.1 All the IPR attached to the Products are and remain the
property of the Seller and are protected under French and
international copyright law and conventions.
6.2 The Buyer agreed not to disclose, copy, reproduce,
redistribute, resell or publish the Product, or any part of it
to any other party other than employees of its company. The
Buyer shall have the right to use the Products solely for its
own internal information purposes. In particular, the Buyer
shall therefore not use the Product for purposes such as:
• Information storage and retrieval systems;
• Recordings and re-transmittals over any network (including
any local area network);
• Use in any timesharing, service bureau, bulletin board or
similar arrangement or public display;
• Posting any Product to any other online service (including
bulletin boards or the Internet);
• Licensing, leasing, selling, offering for sale or assigning the
Product.
6.3 The Buyer shall be solely responsible towards the Seller of
all infringements of this obligation, whether this infringement
comes from its employees or any person to whom the Buyer
has sent the Products and shall personally take care of any
related proceedings, and the Buyer shall bear related financial
consequences in their entirety.
6.4 The Buyer shall define within its company point of contact for
the needs of the contract. This person will be the recipient
of each new report in PDF format. This person shall also be
responsible for respect of the copyrights and will guaranty that
the Products are not disseminated out of the company.
6.5 In the context of annual subscriptions, the person of contact
shall decide who within the Buyer, shall be entitled to access
on line the reports on I-micronews.com. In this respect, the
Seller will give the Buyer a maximum of 10 password, unless
the multiple sites organization of the Buyer requires more
passwords. The Seller reserves the right to check from time
to time the correct use of this password.
6.6 In the case of a multisite, multi license, only the employee
of the buyer can access the report or the employee of the
companies in which the buyer have 100% shares. As a matter
of fact the investor of a company, the joint venture done with
a third party etc..cannot access the report and should pay a
full license price.
7. TERMINATION
7.1 If the Buyer cancels the order in whole or in part or postpones
the date of mailing, the Buyer shall indemnify the Seller for
the entire costs that have been incurred as at the date of
notification by the Buyer of such delay or cancellation. This
may also apply for any other direct or indirect consequential
loss that may be borne by the Seller, following this decision.
7.2 In the event of breach by one Party under these conditions
or the order, the non-breaching Party may send a notification
to the other by recorded delivery letter upon which, after a
period of thirty (30) days without solving the problem, the
non-breaching Party shall be entitled to terminate all the
pending orders, without being liable for any compensation.
8. MISCELLANEOUS
All the provisions of these Terms and Conditions are for the
benefit of the Seller itself, but also for its licensors, employees
and agents. Each of them is entitled to assert and enforce those
provisions against the Buyer.
Any notices under these Terms and Conditions shall be given in
writing. They shall be effective upon receipt by the other Party.
The Seller may, from time to time, update these Terms and
Conditions and the Buyer, is deemed to have accepted the latest
version of these terms and conditions, provided they have been
communicated to him in due time.
9. GOVERNING LAW AND JURISDICTION
9.1 Any dispute arising out or linked to these Terms and
Conditions or to any contract (orders) entered into in
application of these Terms and Conditions shall be settled
by the French Commercial Courts of Lyon, which shall have
exclusive jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and
the Seller, in accordance with these Terms and Conditions.
TERMS AND CONDITIONS OF SALES