Status of CMOS Image Sensor Industry 2021

© 2021
From Technologies to Markets
Market and Technology
Report 2021
Status of the
CMOS Image
Sensor Industry
Sample

2
2
TABLE OF CONTENTS
Players & rankings 66
2020 CIS revenue rankings, by player
2020 CIS mobile market revenue breakdown, by player
2020 CIS consumer photography market revenue breakdown, by player
2020 CIS consumer home IoT market revenue breakdown, by player
2020 CIS computing market revenue breakdown, by player
2020 CIS automotive market revenue breakdown, by player
2020 CIS medical market revenue breakdown, by player
2020 CIS security market revenue breakdown, by player
2020 CIS industry market revenue breakdown, by player
2020 CIS Defense & Aerospace market revenue breakdown, by player
Ecosystem 85
CMOS image sensor – ecosystem
CMOS image sensor – M&A historical timeline
CMOS image sensor – noteworthy news of the last 2 years
CMOS image sensor - supplychain
CMOS image sensor - competitive landscape
CIS and LOGIC foundries capacity
Glossary 2
Companies cited in this report 5
Report methodology & definitions 7
What we got right, what we got wrong 9
Executive Summary 14
Context 32
o Global Semiconductor market
o Huawei ban timeline
o Semiconductor shortages
o History of tripple disruption in photography
o CMOS image sensor technology shift - CMOS vs. CCD
o CMOS image sensor technology shift – Imaging vs. Sensing
o CIS market forecast 48
o 2020 CIS revenue breakdown, by market, by player
o 2020 CIS revenue breakdown, by market segment
o 2016 – 2026 CIS volume shipment forecast
o 2016 – 2026 CIS revenue forecast CIS
o 2016 – 2026 average selling price forecast
o 2016 – 2026 CIS wafer production forecast
Part 1/2
Status of the CMOS Image Sensor Industry 2021 | Sample | www.yole.fr | ©2021

3
3
TABLE OF CONTENTS
Automotive market trends 135
o Automotive market dynamics
o Automotive imaging trends
o Automotive camera mix – forecast
Medical market trends 149
Security market rend 161
Industrial market trends 169
Defense & aerospace market trend 178
Technology trends 185
o Pixel/resolution/optical format
o BSI opened the way to 3D semiconductor
o In-pixel hybrid stack technology
o In-pixel hybrid stack technology
o 3D imaging & sensing
o Other technology trends
Conclusions 222
Foundry profiles 224
Yole Group of companies 236
Mobile market trends 91
o Mobile market dynamics
o Mobile market volume forecast, by player
o Market drivers
o Mobile phone market trend
o Mobile multiple camera mix – forecast
o Imaging and Sensing trend
o Cloud vs Edge AI trend
Consumer market trends 120
o Consumer market dynamics
o Consumer photography volume forecast
o Consumer home IoT volume forecast
o Consumer market trend
Computing market trends 129
o Computing market dynamics
o Computing volume forecast
o Computing market trends
Part 2/2

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OBJECTIVES AND SCOPE OF THIS REPORT
Markets CIS Devices Forecasts Players Trends
Forecasts
Units
$USD
Players and rankings Market trends
Defense and Aerospace
Industrial
Mobile
Automotive
Technology trends
Market shares
Smartphone cameras
Feature phone cameras
DSLR/DSC
Camcorders
Action cameras
Consumer drone cameras
AR, VR headset cameras
Webcams
Laptop cameras
Tablet cameras
Viewing cameras
ADAS cameras
Capsule endoscopy cameras
X-ray flat panel
PET detectors
Security cameras
Machine vision cameras
Are your needs
outside the scope
of this report?
Contact us for a customized report:
Security
Computing
Consumer
12’’
8’’
Wafer sizes
The objectives of this report are to provide:
o A global view about the future of CIS
o An understanding of the CIS markets and applications
(Mobile, consumer, computing, automotive, industrial,
medical, security, and Aerospace/Defense)
o CIS players’ rankings, dynamics and market shares
o CIS market data in $M, units, and wafers for 2019 - 2025
o A presentation of CIS market and technology trends
Medical

5
5
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METHODOLOGY AND DEFINITIONS
Market segmentation
volume in Munits,
ASP in $,
revenue in $M
Yole’s market forecast model is based on matching heterogeneous sources:
Information
aggregation
Preexisting
information
Forecast
Reconciliation
END SYSTEM SEMICONDUCTOR DEVICE

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7
Pierre CAMBOU
Pierre Cambou MSc, MBA, is a Principal analyst in the Photonic and Display Division. Pierre has authored more than 15Yole Market & Technology
reports. Pierre hold an Engineering degree from Université de Technologie de Compiègne (France) and a Master of Science fromVirginia Tech. (VA,
USA), Pierre also graduated with an MBA from Grenoble Ecole de Management (France).
Contact: pierre.cambou@yole.fr
Chenmeijing LIANG
Chenmeijing Liang works as a Technology & Market Analyst within the Photonics & Sensor division.As part of the Imaging team, Chenmeijing
contributes to analyses of CIS markets, related technologies and market strategies as well as the quarterly Monitor. Chenmeijing Liang holds a Master’s
Degree in the field of Applied physics and Optical engineering from Paris-Saclay University and University Pierre and Marie Curie UPMC (Paris,
France).
Contact: chenmeijing.liang@yole.fr
Biographies & contacts
ABOUT THE AUHTORS
Richard LIU
Richard Liu is a Technology and Market Analyst in the Photonics & Sensing division. Based in Shenzhen (China), Richard focuses on imaging activity as
well as the development of technology & market reports. Richard has over 12 years post graduate experience in both the imaging semiconductor and
camera module industries. Richard graduated fromWuhan University (China) and holds an Electronics Engineering Degree.
Contact: richard.liu@yole.fr

8
Almalence,Ambarella,Apple,Ams,Arm,Axis, Basler, Bosch, Brigates, BYD, Caeleste,
Canon, Clairpixel, Cmosis, Cognex, Continental, Core Photonics, CSEM, Dahua, DB
Hitek, DXO Mark, Espros Photonics, Evg, ExcelitasTechnologies, Fairchild Imaging, Flir,
Forza Silicon, Fotonic, Foxconn, Fraunhofer, Fujitsu, Fujifilm, GalaxyCore, Given
Imaging, GoPro, Gpixel, GrassValley, Hamamatsu, Hasselblad, Himax Imaging,
HikVision, Honeywell, Hoya, HTC, Huawei, Image Lab, IMEC, Infineon, Invisage,
Kingpak, Konica Minolta, Lattice, Leap Motion, Leica, Lenovo, LG, Luxima, Magna,
MantisVision, Medigus, Melexis, Microsoft, Mobileye, Movidius, New Imaging
Technologies, Nikon, NXP, Nvidia, Olympus, OmniVision, Omron, onsemi, Panasonic,
PerkinElmer, Philips, Pixart, PixelPlus, Pelco, PMDTechnologies, Pyxalis, Raytrix, Rosnes,
Red, Samsung, Sanei Hytech, Sharp, Silicon Optronics, Sirona, SK Hynix, SMIC, Siemens,
SmartSens, Socionext, Soitec, Sony, STMicroelectronics, SuperPix,Teledyne,Teradyne,
Trixell,TSMC,TowerJazz, TPSCo, UMC,Valeo,Videantis,Viimagic,WLCSP, Xiaomi, X-
Fab, Xintec, Xperi, ZTE, and more.
COMPANIES CITED IN THIS REPORT

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What we got right
o The CIS industry navigated the COVID-19
crisis without much impact
o Investments in capacity expansion continues.
o Increasing demand on the smartphone market
for high-end cameras.
o Increased competition throughout the market
o Introduction of new CIS technology e.g. GS,
iToF and dToF.
WHATWE GOT RIGHT, WHATWE GOT WRONG
Technology and market forecast challenges
What we got wrong
o Sanctions on Huawei exacerbated demand for CIS on
the short term in 2019 and 2020.
o CIS capacity issues at the end of 2019 and 2020
increased average selling prices.
o Increasing demand on the smartphone market for low
resolution cameras such as 2Mp.
o Pixel shrink race has reignited
o Smartphone market uptake is expected in 2021
| Status of CIS industry | www.yole.fr | ©2018

10
WHAT DOES OUR ANALYSIS COVER?
From wafers to the initial packaged sensor
Analysis at the
component
level.
Analysis at the component level.
Courtesy of OmniVision
Courtesy of Valeo
Courtesy of Prophesee
Courtesy of Tesla
Camera
modules
End-systems
Image
sensors
Courtesy of Xiaomi
CIS
dies
Courtesy of Sony
CIS
wafers
Courtesy of Apple
Market report focus Market analysis only

11
0
5 000
10 000
15 000
20 000
25 000
30 000
35 000
Revenue
($M)
Historical CIS revenue forecast (in $M)
2010 Fcst 2011 Fcst 2012 Fcst 2013 Fcst 2014 Fcst 2015 Fcst
2016 Fcst 2017 Fcst 2018 Fcst 2019 Fcst 2020 Fcst 2021 Fcst
WHATWE GOT RIGHT,WHAT WE GOT WRONG
Yole’s 10-year historical CIS forecast
Iterative
approach to
CIS market
forecasting.
In 2020, CIS revenues were
exactly at our expectation of
$20.7B.
In 2021 we expect the
continuation of lower growth
due to the accumulation of
CIS inventories at Huawei in
2019 and 2020.
In the longer term, the
upside in smartphones
should revive CIS sales
growth.
Yole has increased its
forecast for CMOS image
sensors, to reach $31.5B by
2026.
2020
$20.7B

13
13
2021 CMOS IMAGE SENSOR INDUSTRY – STATUS REPORT
Having reached
$20.7B in 2020,
the CIS industry
is thriving.
Matching Yole’s forecast in the previous Status of the CIS Industry report, the CIS industry ended 2020 at
$20.7B in revenue. CIS industry players achieved a 7.3% YoY revenue growth rate amidst a global pandemic
and trade-war issues between the U.S. and China.
Globally, the CMOS image sensor industry is thriving. This performance is mainly due to the sustainability
of the mobile camera market as well as most ‘other’ markets. In this context, sanctions on Huawei have
exacerbated the demand for CIS, with Huawei purchasing CIS equivalent to four quarters’ worth of
additional inventory. Yole’s expectation is a 7.5% CAGR forecast for the 2020 - 2026 timeframe, with
revenue reaching a predicted $31.5B within five years. In 2020, security and automotive applications are
the second- and third-largest CIS market segments respectively, with both experiencing explosive growth
in the range of ~40%.
Within the ‘other’ markets, only consumer photography – DSC, DSLR, action cameras, drone cameras, etc.
– is on a downward slope. All other sub-segments (e.g., computing, automotive, medical, security, industrial,
and defense & aerospace) are now outperforming the CIS market’s average growth. CIS is currently heavily
dominated by mobile applications, but the growth is now greater in the ‘other’ category.

14
14
Sony
40%
Samsung
22%
OmniVision
12%
STMicroelectronics
6%
onsemi
4%
Galaxycore
3%
SK Hynix
2%
Panasonic
2%
SmartSens
Technology
1%
Canon
1%
Other
7%
2020 CIS semiconductor market share
by player (in % revenue)
LOOKING BACK AT THE 2020 CIS MARKET
CIS revenue breakdown by player in $M
Sony $ 8,172 $ 8,198 0.3%
Samsung $ 4,122 $ 4,641 13%
Omnivision $ 1,863 $ 2,410 29%
STM $ 1,220 $ 1,322 8%
Galaxycore $ 535 $ 813 52%
onsemi $ 757 $ 739 -2%
SK Hynix $ 377 $ 501 33%
Smartsens $ 172 $ 217 26%
Canon $ 257 $ 192 -25%
Panasonic $ 374 $ 172 -54%
Other $ 1,474 $ 1,538 4%
Total $ 19,323 $ 20,743 7.3%
2019 2020 YoY(%)
Revenue ($M)
2020
$20.7B
2019
$19.3B
©Yole Développement - August 2021
Galaxycore
4%
onsemi
4%
Smartsens
4%
Canon
1%
Panasonic

15
15
Mobile
68%
Consumer
4%
Computing
8%
Automotive
7%
Medical
1%
Security
8%
Industrial
3%
Aerospace & Defense
1%
2020 CIS industry revenue breakdown
by market segment (in % of total revenue)
2020
$20.7B
2019
$19.3B
LOOKING BACK AT THE 2020 CIS MARKET
CIS revenue breakdown by market in $M
Mobile $ 14,068 $ 14,141 5.0%
Consumer $ 794 $ 887 -18.9%
Computing $ 1,745 $ 1,832 15.1%
Automotive $ 1,440 $ 1,734 10.4%
Medical $ 150 $ 162 30.0%
Security $ 1,636 $ 1,927 36.2%
Industrial $ 600 $ 698 7.0%
Defense and
aerospace $ 293 $ 324 31.1%
TOTAL $ 19,323 $ 20,743 7.3%
2019 2020 YoY(%)
Revenue ($M)

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LOOKING BACK AT 2020 CIS PLAYER MARKET SHARE
by player in $M
2020 CIS semiconductor market : $20,743M
Status of the CMOS Image Sensor Industry 2021 | Report | www.yole.fr | ©2021

17
-
1 000
2 000
3 000
4 000
5 000
6 000
7 000
8 000
9 000
0
100
200
300
400
500
600
700
2016 2017 2018 2019 2020 2021e 2022e 2023e 2024e 2025e 2026e CAGR
kWafer
per
year
(12''eq.)
k
Wafer
per
month
(12''eq.)
2016-2026 CIS wafer production forecast
by technology type (kWpm 12''eq.)
CIS LOGIC DRAM YoY (%) TOTAL
CIS AND LOGIC WAFER PRODUCTION FORECAST 2015-2025
By technology in kWafers 12” equivalent
Stacked
sensors are
produced via
different wafer
technologies.
Additional
DRAM remains
a niche
technology.
Stacked sensors are produced via different wafer technologies.
Additional DRAM remains a niche technology.

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CMOS IMAGE SENSOR - ECOSYSTEM - 1/2
CIS have a specialized semiconductor supply chain
Wafer Manufacturing
Chip design
Front-End
Equipments
& material
Back-End
Equipments
& material
Packaging
Equipment
& material
Test
equipment
Design and
simulation
tool
Embedded
software
Semiconductor
IP
Assembly &Test
Implant, Masking,
Etching,TSV, stacking…
Design
3D Stack, RDL,
Bumping, Flip Chip, etc.
Computing
ecosystem
Semiconductor
Research institutes
End-system
OEM
Camera Module
manufacturing
IDM
Fab-less design companies
Wafer
foundries
BEOL
CFA
MLA
OSATs
Test
houses
Custom design
service
OEM

19
19
0 0 0 0 0
1 410
1 371 1 396 1 416 1 435
1 480
1 464 1 467
1 429
1 384
1 300
-
- - - -
-
0
200
400
600
800
1 000
1 200
1 400
1 600
2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 2026 CAGR
Volume
(Munits)
Smartphones Prod.Total - (Mu)
MOBILE MARKET DYNAMICS
The upward revision of Yole’s smartphone forecast is the main contributor to CIS forecast up-side

20
20
0
20
40
60
80
100
120
2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 2026 CAGR
Volume
(Munits)
LightVehicle ProductionTotal - (Mu)
AUTOMOTIVE MARKET DYNAMICS

21
21
Mastcam-Z x2
Navcam x2
Supercam RMI x1
DDC x1
IMAGE SENSORS - MARS SOIL SAMPLE DELIVERY – PERSEVERANCE ROBOT
PUC x3
RDC x1
RUC x1
LCAM x1
Entry Descent
Landing x7
x4
x2
NAV x1
RTE x1
Engineering x9
Scientific x7
FrontHazcams
Rear Hazcams
21
21
Sherlock x1
Cachecam x1

22
INNOVATION PATH FOR THE CIS INDUSTRY
New Technology
more data
New markets
open low end
Same markets
up-market race
SameTechnology
better data
High end excellence
Low end excellence
Low end disruption
High end incremental
Current
CIS market
Neuromorphic
Event-based
Quantum
Single photon
Hyperspectral
Embedded
AI

23
MOBILE TECHNOLOGY TRENDS
The market is asking for a smaller module and better image quality
Due to optical
limitations,
module height
cannot shrink
as desired.
Limitations to reducing module height:
o Light must enter the pixel in the corner of the
array. CRA cannot increase.
o Focal length is a consequence of sensor array
size and maximum CRA.
Improvement could come from a
nonsymmetrical MLA which would reduce the
CRA and therefore ease the optical design.
CRA
Sensor
array
Chief ray angle (CRA)
Pixel geometry
Courtesy of System Plus
Shifted micro lens array (MLA)
Deep trench isolation (DTI)

24
24
 Backside
illumination
will
enable ~
100% fill-
factor!
In-pixel
Hybrid
Stack
2020
CMOS IMAGE SENSOR TECHNOLOGY
CIS led the way for 3D integration in semiconductors
Front-side
illuminated
(FSI)
TSV
Stack
Backside
illuminated
(BSI)
2008 2010 2014
CIS
wafer
Logic
wafer
Hybrid
Stack
2016
Blank
wafer
Logic
wafer
Logic
wafer
Logic
wafer

25
25
THREE-PAGE SUMMARY - 1/3
CIS market and players
• From 2015 to 2020 the CMOS Image Sensor (CIS) industry doubled its generated revenues going from $10.2B
to $20.7B at 15.1% CAGR.The CIS industry do represent 4.7% of the $440B global semiconductor industry.
• In 2020, 7.08B units CMOS Image Sensors (CIS) were manufactured, almost one for each inhabitant of the planet.
This is due to the staggering volume of Mobile handsets representing 1.7B units and the increasing number of
cameras per phones. In the meantime Automotive cameras, Security cameras and Industrial cameras have
proliferated adding to the dynamics of CIS.
• As of 2020, Sony remains the biggest CIS player with a market share of 40%, in comparison to Samsung’s 22%,
OmniVision’s 12% and STMicroelectronics 6%.These top players are all focusing on mobile applications either on
Imaging or Sensing applications.
• Mobile remains the most important application for CIS, representing 68% of market revenues. Security and
automotive applications have emerged with explosive growth in the range of 30% year on year.
• Within consumer products, new momentum is provided by new applications including home and IoT products
which tend to includes more cameras either for imaging or sensing.
• Yole Développement has increased its forecast for CMOS image sensors to reach $31.5B by 2026.

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26
CIS technology trends
• The technology race remains a key aspect of CIS competition, driving developments towards smaller pixels, 3D
integration technologies, and novel pixel designs.
• Over the years, significant improvements have been made to the CIS manufacturing process.The industry has
transitioned from FSI to BSI and now towards Stacked BSI, where TSVs are used to make connections to the
sensor array and the logic die.The standard technique has now become hybrid stack using Cu-Cu connections.
• The latest products did shrink the hybrid connection pitch down to the pixel pitch which opens the way for in-
pixel connections, 2020 was the first year such product was mass produced with the Apple “Lidar”.
• Technology nodes for CIS are moving from 90nm to 65nm and for logic wafers are moving towards 28nm.The
next move should be 22nm.
• New designs, namely GS, iToF and dToF technologies, have penetrated the market well.
• Quantum and neuromorphic approaches should bring a new generation of applications to the market.
• The next technology challenge should be the integration of artificial intelligence (AI) within CIS sensors.

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2021 conclusions
• The CIS industry was little affected by the COVID-19 situation.
• The impact of the Huawei ban has been much greater since large quantities of CIS inventory were added in 2019
and 2020.This effect ceased on the 15th September 2020.
• The short-term forecast for 2021 is therefore the worst we have seen in recent times with 4.9%YoY growth and
$21.8B the expected end result.
• In the mid-term, the CIS industry is expected to grow 7.2% CAGR, on par with global semiconductor growth
reaching $31.5B in 2026.
• A new cycle of growth is expected to come from the high-end industrial, security and automotive markets as
well as consumer, home and IoT products, alongside the continuous growth of the mobile segments.
• The CIS industry has become a major sub-segment of the semiconductor industry. Beyond the US-CN
geopolitical difficulties, new challenges such as the mandate to reduce CO2 emissions will come into play and be
an axis of competition.

28
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SalesTeam
for more
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information
3D Imaging and Sensing –
Technology and MarketTrends
2021
CMOS Camera Module Industry
for Consumer & Automotive 2020
YOLE GROUP OF COMPANIES RELATED ANALYSES
Yole Développement
MachineVision for Industry
and Automation 2021

29
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for more
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Camera Module Comparison 2021
Vol. 2 – Apple iPhone Evolution
Smartphone 3D Sensing Modules
Comparison 2020
Smartphone Camera Module
Comparison 2020Vol 3: Focus on
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Camera Module Comparison 2021
Vol. 3 – Samsung Galaxy S
Evolution
Apple iPad Pro LiDAR Module
YOLE GROUP OF COMPANIES RELATED ANALYSES
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