Successfully reported this slideshow.
We use your LinkedIn profile and activity data to personalize ads and to show you more relevant ads. You can change your ad preferences anytime.

0

Share

Download to read offline

System-in-Package Technology and Market Trends 2021 - Sample

Download to read offline

Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/

Related Books

Free with a 30 day trial from Scribd

See all

Related Audiobooks

Free with a 30 day trial from Scribd

See all
  • Be the first to like this

System-in-Package Technology and Market Trends 2021 - Sample

  1. 1. From Technologies to Markets © 2021 From Technologies to Markets System-in-Package Technology and Market Trends 2021 Market and Technology Report 2021 Sample
  2. 2. 2 2 System-in-Package Technology 2021| Sample | www.yole.fr | ©2021 GLOSSARY Abbreviation Description A&D Aerospace and Defense ABF Ajinomoto Build-up Film ACPS ACCESS Clipless Power Stage A-EASI Advanced-Embedded Active System Integration AI Artificial Intelligence APE Application Processor Engine AR Augmented Reality ASIC Application-Specific Integrated Circuit ASP Average Selling Price BE Back-End BGA Ball Grid Array CAGR Compound Annual Growth Rate CIS CMOS Image Sensor CPU Central Processing Unit CSP Chip Scaled Package DC Direct Current DMS Design Manufacturing Services DSP Digital Signal Processor DTV Digital TV ECP Embedded Component Package ED Embedded Die ED Embedded Die System-in-Package eHDF embedded High Density Film EMIB Embedded Multi-die Interconnect Bridge EMS Electronics Manufacturing Service ETS Embedded Trace Substrate EV/HV Electrical Vehicle/Hybrid Vehicle FC Flip Chip FC-EIC Flip Chip Embedded Interposer Carrier FE Front-End FI Fan-In FO Fan-Out FO SiP Fan-Out System-in-Package FO WLP Fan-Out Wafer Level Packaging FO-SIB Fan Out System in Board Abbreviation Description FPC Flexible Printed Circuit FPGA Field Programmable Gate Array GaN Gallium Nitride GPU Graphics Processing Unit HBM High Bandwidth Memory HD High Density (Fan-Out) OR High Definition (TV) HDI board High Density Interconnect Board HIPS Heterogeneous Integrated Power Stages HPC High Performance Computing HVM High Volume Manufacturing I/O Input/Output IC Integrated Circuit(s) ICE Internal Circuit Engine ICT Information Communication Technology IDM(s) Integrated Device Manufacturer(s) IIoT Industrial Internet of Things IoT Internet of Things IP Intellectual Property i-THOP integrated Thin film High density Organic Package L/S Line/Space LED Light Emitting Diode LGA Land Grid Array M&A Merger & Acquisition MCeP Molded Core embedded Package MCM Multi-Chip Module MEMS Micro-Electro Mechanical Systems MIS Molded Interconnection Substrate mSAP modified Semi-Additive Process ODM Original Design Manufacturer OEM Original Equipment Manufacturer OSAT Outsourced Semiconductor Assembly and Test PCB Printed Circuit Board PCBA Printed Circuit Board Assembly PiP Package in Package Abbreviation Description PKG Package PLP Panel Level Packaging PMIC Power Management IC PMU Power Management Unit POL Power Overlay PoP Package on Package PTH Plated Through Hole PWB Printed Wiring Board QFN Quad Flat No-Leads QFP Quad Flat Package RDL ReDistribution Layer RF Radio Frequency SAP Semi-Additive Process SeSUB Semiconductor Embedded in SUBstrate SiC Silicon Carbide SiM System in Module SiP System-in-Package SLP Substrate Like PCB SMD Surface Mount Die SMT Surface Mount Technology STB Set-Top Box TO Transistor Outline Package TPV-Frame Through Prepeg Via in Frame TSV Through-Silicon-Via TXVR Transceiver VR Virtual Reality WABE Wafer And Board level device Embedded WB Wire-bond WBG Wide Band Gap WE Wearables WiFi Wireless Fidelity WLCSP Wafer Level Chip Scale Package WLP Wafer-Level packaging
  3. 3. 3 3 3 • Glossary 002 • Table of contents 003 • Report scope & objectives 005 • Report methodology 007 • About the authors 008 • Companies cited in this report 009 • Who should be interested in this report 010 • Yole Group’s related reports 011 • Three-page summary 012 • Executive summary 016 • Introduction 066 o SiP definitions, historical perspectives, drivers 067 o Report focus 079 • Combined market forecasts: system-in-ackage 082 o Market and forecasts (units, revenue) 083 o Market trends: explanation of SiP growth 087 • Combined market share and supply chain: System-in-Package 089 o Combined market share (2018 & 2019) 091 o Supply chain analysis 095 o SiP manufacturers & key customers o SiP business model evolution o SiP business model is key to SiP success o Chapter conclusion System-in-Package Technology 2021| Sample | www.yole.fr | ©2021 TABLE OF CONTENTS (1/2) • Combined roadmaps: System-in-Package 108 o SiP roadmaps, by application 109 o SiP roadmaps, by players 116 • Flip-chip & wire-bond: System-in-Package 124 o Definition and process flow 125 o Market forecasts (units, revenue) 133 o Mobile & consumer market o Telecom & infrastructure market o Automotive & transportation market o Medical, industrial, defense & aerospace markets o Market trends 147 o What drives FC & WB SiP in the mobile & consumer market? o What drives FC & WB SiP in telecom & infrastructure market? o Key drivers for FC & WB SiP o Supply chain 151 o Geographical mapping o Supply chain analysis o New business-model evolution o Technology trends 157 o By application: mobile & consumer o By application: telecom & infrastructure o By application: automotive & transportation o Chapter conclusion 220 Combined: a combination of flip-chip, wire-bond, fan-out, and embedded die technologies are covered in this report.
  4. 4. 4 4 4 • Fan-Out packaging: System-in-Package 223 o Definition and focus 224 o Market forecasts 229 o Package units (Mu) o Wafer volume (kwspy) o Revenue ($M) o Market trends 237 o FO SiP drivers o Integration capabilities o Supply chain 242 o Fan-out packaging - timeline and evolution o Global map of fan-out System-in-Package players o Key players that commercialized FO SiP o FO SiP supply chain analysis o Market share 253 o 2019 FO SiP market share o Fo SiP market - player analysis o Technology trends 257 o FO SiP wafer-volume production - roadmap o Fan-out technology space o Commercialized fan-out SiP products o Adoption challenge 270 o Chapter conclusion 272 System-in-Package Technology 2021| Sample | www.yole.fr | ©2021 TABLE OF CONTENTS (2/2) • Embedded die: System-in-Package 276 o Definition and focus 277 o Introduction 283 o Market forecasts 287 o Revenue (value) o Package (units) o Market trends 291 o Roadmaps, market drivers, and technical requirements o Supply chain 298 o Players involved in an embedded die activity o Supply chain analysis - business model o Technology trends 306 o Segmentation (technology features and players’ activities) o Adoption rationale o Available commercial products, and future product launches o Chapter conclusion 327 • Conclusion 329 • Yole corporate presentation 331
  5. 5. 5 5 5 This report’s main objectives are to: • Describe technologies that can be classified as “System-in-Package” • Identify and detail the System-in-Package platform’s key process steps • Analyze the supply chain for System-in-Package technologies • For these steps, provide a market forecast for the coming years and a prediction of future trends System-in-Package is studied from the following perspectives: • Available technologies and their inherent challenges • Market size • Revenue and market valuation • Market share of players involved • Supply chain analysis REPORT SCOPE Are your needs beyond this report’s scope? Contact us for a custom analysis: System-in-Package Technology 2021| Sample | www.yole.fr | ©2021
  6. 6. 6 6 6 Advanced System-in-Package (SiP) 2021 is a new report that explores in detail the hottest trends in advanced semiconductor packaging.The report’s objectives are as follows: • A three-page summary providing an overview of this report’s main points • Provide a market forecast for System-in-Package revenue (2020 - 2026) • Focus on flip-chip, wire-bond, fan-out, and embedded die • Explanation of growth for end-markets and end-devices • Market trends • Key drivers, by technology • Drivers, by end-market • Market share • Breakdown, by manufacturer • Furnish a full supply-chain analysis of SiP players • SiP manufacturers & key customers • SiP business models - full analysis • Technology trends for SiP technologies • By end-market • Technical roadmaps System-in-Package Technology 2021| Sample | www.yole.fr | ©2021 REPORT OBJECTIVES
  7. 7. 7 7 System-in-Package Technology 2021| Sample | www.yole.fr | ©2021 METHODOLOGIES & DEFINITIONS Market Volume (in Munits) ASP (in $) Revenue (in $M) Yole’s market forecast model is based on the matching of several sources: Information Aggregation Preexisting information
  8. 8. 8 8 VAIBHAVTRIVEDI FAVIER SHOO Favier Shoo is a Team LeadTechnology and Market Analyst in the Semiconductor & Software division at Yole Développement (Yole), part ofYole Group of Companies. Based in Singapore, he is engaged in the development of reports as well as the production of custom consulting projects.With prior experience at Applied Materials and REC Solar, Favier has developed a deep understanding of the supply chain and core business values. Being knowledgeable in this field, Favier has conducted professional training for industry players and obtained two patents. He also co-founded a startup company. Favier holds a bachelor’s in Materials Engineering (Hons) and a minor in Entrepreneurship from Nanyang Technological University (NTU) (Singapore). favier.shoo@yole.fr System-in-Package Technology 2021| Sample | www.yole.fr | ©2021 Biographies & contact ABOUT THE AUTHORS Vaibhav Trivedi is a Sr.Technology and Market Analyst in the Semiconductor & Software division atYole Développement, part ofYole Group of Companies. Based in the US, he is a member of Yole’s advanced packaging team and contributes to analysis of ever-changing advanced packaging technologies. Vaibhav has 17+ years of field experience in semiconductor processing and semiconductor supply chain, specifically on memory and thermal component sourcing and advanced packaging such as SiP and WLP. Vaibhav has held multiple technical and commercial lead roles at various semiconductor corporations prior to joiningYole. vaibhav.trivedi@yole.fr
  9. 9. 9 9 9 Access,Amkor,Analog Devices,Apple,ARM,ASE,Avago,AT&S, Bosch, Broadcom, Carsem, ChinaWLCSP, Chipbond, ChipMOS, Cisco, Continental, Cyntec, Cypress Semiconductor, DecaTechnologies, Dyconex, Facebook, Fitbit, Flexceed, Flip Chip International, Formosa, Fraunhofer IZM, Freescale, Fujikura, Fujitsu, GaN Systems, General Electric, GlobalFoundries, Google, Hana Micron, Hella, Huawei, IMEC, Inari Berhad, Infineon, Intel, J-Devices, JCET, KingYuan, Lenovo, LinearTechnology, LB Semicon, MediaTek, Medtronic, Meiko, Microchip, Microsemi, Nanium, Nepes, Nvidia, NXP, Nokia, ON Semiconductor, Orient Semiconductor, PowertechTechnology Inc, Renesas, QDOS, Qorvo, Qualcomm, Rohm, Sarda Technologies, Samsung Electronics, SCC, Schweizer, SEMCO, SIMMTECH, SK Hynix, Shinko, ShunSin, SiPlus, Softbank, SONY, SPIL, Spreadtrum, STMicroelectronics, STATS ChipPAC, STS Semiconductor, TaiyoYuden,TDK,Teraprobe,Texas Instruments, Tianshui Huatian,Tongfu Microelectronics,Tong Hsing,Toshiba,TSMC, Unimicron, Unisem, USI, UTAC,Wurth Electronics, and many more.. System-in-Package Technology 2021| Sample | www.yole.fr | ©2021 COMPANIES CITED IN THIS REPORT Non-exhaustive list
  10. 10. 10 10 10 System-in-Package Technology 2021| Sample | www.yole.fr | ©2021 WHO SHOULD BE INTERESTED IN THIS REPORT? • Equipment and materials suppliers: • Understand the overall SiP business and technology trends • Identify SiP’s high-growth areas • Spot business opportunities and prospects • See the positioning and market share of various tool suppliers • Monitor and benchmark potential competitors • OSATs, IDMs, foundries: • Grasp technology trends related to SiP • Find new opportunities and define diversification strategies • Comprehend the overall SiP market • Monitor and benchmark potential competitors • Discern the supply chains involved in SiP • R&D players: • Obtain insight into the latest developments in SiP technologies • Grasp the market potential of different emerging technologies • Financial and strategic investors: • Distinguish the key players involved in SiP business • See which markets have the highest growth potential, and how the SiP supply chain involved in these segments will benefit • Explore M&A opportunities • OEMs and integrators: • Highlight technology trends in SiP • Confirm new opportunities and define diversification strategies • Realize the overall SiP market • Monitor and benchmark potential competitors
  11. 11. 11 COMPONENT INTEGRATION FOR SiP - VARIOUS AP PLATFORMS Various advanced packaging technologies support active and passive component integration for SiP. Component integration in SiP Active component Wafer level Substrate level Passive component Advanced Packaging Platform Wafer level Substrate level Fan-out WLP Embedded packaging platforms 2.5D/3D Embedded die In laminate (substrate) In PCB In flexible substrate System-in-Package Technology 2021| Sample | www.yole.fr | ©2021
  12. 12. 12 SYSTEM-IN-PACKAGE (SiP) SYNERGIES ACROSS OSAT & EMS MODELS Leverage IC assembly/ packaging & SMT technologies. EMS RDL Bumping Cu pillar TSV Wire-bond Flip-chip WLP Coreless substrate SMD Pick & place / chip shooters Passives Paste printing Molding System-in-Package Technology 2021| Sample | www.yole.fr | ©2021 Advanced L/S OSAT Increased Cost and higher capability Board assembly
  13. 13. 13 SiP TOOLBOX Various process modules used in SiP assembly. SiP assembly SMT Wire- bond Molding Shielding (Compartmental & Conformal) Inspection & test BGA/LGA System-in-Package Technology 2021| Sample | www.yole.fr | ©2021
  14. 14. 14 WHY SiP? SiP supports the semiconductor industry’s “MtM” heterogeneous integration roadmap. To mix & match IC technologies, optimize performance of each functional block, and reduce cost. Fully integrated SiP solutions enable designers to implement additional functionalities like Bluetooth or camera modules into a system, with minimal design effort. More flexibility for system designers Compared with SoC, different RF components are fabricated at different nodes in various fabs. Time to market reduced. Faster time to market By migrating signal routing complexity to the package substrate => Reduced layer count in motherboard, simplifies product design. Reduce motherboard complexity Various ICs & passives placed close together => shorter line length =>lower R,L,C losses => Higher signal integrity & reduced power consumption. Better performance Compared to discrete packages, optimized SiP solutions result in overall system cost reduction. Lower system cost Sub-system size reduced by integrating multiple dies & passives in single SiP. Small form-factor Better solder joint compared to the discrete components assembled on board/PCB because the SiPs are molded, which alleviates stress in the joints. Reliability System-in-Package Technology 2021| Sample | www.yole.fr | ©2021
  15. 15. 15 COMBINED SIP MARKET FORECAST - PACKAGING UNITS Breakdown, by end-market SiP’s biggest market is mobile & consumer. Primarily smartphones & 5G deployment with RF SiP are driving the volume as thinner, denser, and smaller remains the trend System-in-Package Technology 2021| Sample | www.yole.fr | ©2021 2020 2021 2022 2023 2024 2025 2026 CAGR (2020- 2026) Units (Mu) SiP units by end market (Mu)
  16. 16. 16 COMBINED SIP MARKET FORECAST - PACKAGING UNITS Breakdown, by technology Flip-chip and wire-bond SiP are the most prevalent SiP types, and the most used in the industry. FO & ED SiPs are still relatively new, used in fewer markets and less applications. System-in-Package Technology 2021| Sample | www.yole.fr | ©2021 2020 2021 2022 2023 2024 2025 2026 CAGR (2020- 2026) Units (Mu) SiP units by technology (Mu)
  17. 17. 17 COMBINED SIP MARKET FORECAST - PACKAGING REVENUE Breakdown, by end-market SiP packaging revenue will exceed $19B in 2026, with a CAGR2020-2026 of 5%. System-in-Package Technology 2021| Sample | www.yole.fr | ©2021 2020 2021 2022 2023 2024 2025 2026 CAGR (2020- 2026) Revenue ($M) SiP packaging revenue by end market ($M)
  18. 18. 18 COMBINED SIP MARKET FORECAST – PACKAGE REVENUE Breakdown, by technology More than 90% of SiP packaging revenue comes from FC/WB SiP packages. However, the highest SiP growth is attributed to ED, which is still a nascent technology entering different markets. System-in-Package Technology 2021| Sample | www.yole.fr | ©2021 2020 2021 2022 2023 2024 2025 2026 CAGR (2020- 2026) Revenue ($M) SiP packaging revenue by technology ($M)
  19. 19. 19 19 19 2026 SIP MOBILE & CONSUMER MARKET SPLIT BY END DEVICES ($M, %) 2020 SIP MOBILE & CONSUMER MARKET SPLIT BY END DEVICES ($M, %) • For the next five years, wearables, Wi-Fi routers, and IoT will enjoy significant growth in the SiP market space. The main drivers behind this growth are 5G and sensors. • Wearable remains a key growth driver at 14% CAGR from 2020-2026 as smartwatches and smartearbuds applications usage start to skyrocket and is becoming a main growth segment replacing smartphone in terms of growth contribution. • However, smartphones and RF SiP packages remain key contributor to SiP growth due to 5G deployment and new package design usage such as antenna in package using more “value add” services such as higher component count, double-sided mold, compartmental and conformal shielding. • PC remains on a slow growth trajectory but in short-terms its expected to enjoy higher than “usual” growth due to pandemic work from home models. System-in-Package Technology 2021| Sample | www.yole.fr | ©2021 MARKET TRENDS - EXPLANATION OF SIP GROWTH Mobile & consumer market - SiP growth analysis, by end-device End-Market End-Devices CAGR Mobile & Consumer TOTAL Mobile & Consumer Wearable Mobile & Consumer Wi-Fi Routers Mobile & Consumer IoT Mobile & Consumer Handset Mobile & Consumer Camera Mobile & Consumer PC Mobile & Consumer Game stations $15,626M $11,862M
  20. 20. 20 20 20 • Telecom & Infrastructure SiP includes markets such as datacenters, and base stations. These are high end complex high density substrate packages such as 2.5D solutions with Si Interposer and HBM stack. Intel also plans to introduce its hybrid packaging line-up of Co-EMIB starting 2023 with 7 nm Si solutions. • For automotive & transportation, ADAS and infotainment are the main drivers. Although camera is a very small portion, its growth is the highest, with expected SiP platforms adopted for ADAS mono, stereo, and triple. Also, computing power is needed for VPU and infotainment. The bulk of it isMEMS & sensors, which compromises applications like pressure, IMUs, optical MEMS, microbolometers, oscillators, and environmental sensors. • For other markets such as medical, industrial, and defense & aerospace, SiP’s size is significantly smaller - although growth is reasonably strong in robotics and IoT-related applications. System-in-Package Technology 2021| Sample | www.yole.fr | ©2021 MARKET TRENDS - EXPLANATION OF SIP GROWTH All other markets - SiP growth analysis, by end-device “Others” includes medical, industrial, and defense & aerospace End-Market End-Devices CAGR Telecom & Infrastructure Base stations Servers Automotive & Transportation Camera Computing MEMS&Sensors Medical Medical Robotics Industrial Industrial IoTs Defense & Aerospace Headset/Battlefield equipments TOTAL As listed above “Others” includes medical, industrial, and defense & aerospace Base stations Servers Camera Computing MEMS&Sensors Medical Robotics Industrial IoTs Headset/Battlefield equipments Telecom & Infrastructur e Automotive & Transportati on Others 2020 SIP ALL OTHER MARKETS SPLIT BY END DEVICES ($M, %) Base stations Servers Camera Computing MEMS&Sensors Medical Robotics Industrial IoTs Headset/Battlefield equipments Telecom & Infrastructur e Automotive & Transportati on Others 2026 SIP ALL OTHER MARKETS SPLIT BY END DEVICES ($M, %)
  21. 21. 21 21 21 System-in-Package Technology 2021| Sample | www.yole.fr | ©2021 SYSTEM-IN-PACKAGE - MARKET SHARE IN 2020 2020 total SiP market share: $13.8B Packaging revenue, split by SiP manufacturer* [%] *Estimated Market Share Breakdown *Data is generated by secondary research and revised through interviews *Others include UTAC, SK Hynix, Nepes, Chipbond etc. TSMC SONY SEMCO Intel ASE w/o SPIL & USI Amkor JCET Group SPIL Others
  22. 22. 22 22 22 System-in-Package Technology 2021| Sample | www.yole.fr | ©2021 SUPPLY CHAIN - SIP MANUFACTURERS & KEY CUSTOMERS *Substrate Manufacturers with Advanced Packaging Capabilities SiP Manufacterers TSMC Intel Skyworks SONY ASE Group Amkor Chipbond ChipMOS Huatian Inari Technolog y JCET Group PTI ShunSin SPIL Unisem UTAC SEMCO Shinko Key Customers Business Model Foundry IDM IDM IDM OSAT OSAT OSAT OSAT OSAT OSAT OSAT OSAT OSAT OSAT OSAT OSAT Substrate Manufacter ers* Substrate Manufacter ers* AMD Fabless   Apple Fabless     Broadcom Avago Fabless         HiSilicon Fabless     muRata Fabless MediaTek Fabless     Nvidia Fabless   Qorvo Fabless       Qualcomm Fabless       TDK EPCOS Fabless Infineon IDM  Intel IDM      Micron IDM   NXP IDM Renasas IDM  Samsung Eletronics IDM   SK Hynix IDM Skyworks IDM       SONY IDM  STM IDM  Non-exhaustive list of players
  23. 23. 23 23 System-in-Package Technology 2021| Sample | www.yole.fr | ©2021 SAMSUNG’S ADVANCED PACKAGING TECHNOLOGY ROADMAP High-end PackagingTechnology Evolution:Towards System-in-Package Source: Samsung Foundry
  24. 24. 24 24 System-in-Package Technology 2021| Sample | www.yole.fr | ©2021 FC & WB SIP SUPPLY CHAIN - KNOWN BUSINESS MODELS Substrate manufacturer Packaging house assembly / testing Design house fabless End-products System makers Non-Exhaustive List of Activities
  25. 25. 25 25 System-in-Package Technology 2021| Sample | www.yole.fr | ©2021 ANTENNA SYSTEM-IN-PACKAGE EVOLUTION IN SMARTPHONE From outside antenna to antenna “case”, or antenna-on-PCB to antenna-in-package Antenna outside phone body 2G (GSM) Antenna “on case” 3G (WCDMA) Antenna on flex 4G (LTE)/5G Sub 6GHz Antenna in package 5G (mmWave) 1992 1992 2007 2014 2019
  26. 26. 26 Contact our SalesTeam for more information 26 Contact our SalesTeam for more information 26 Contact our SalesTeam for more information 5G PackagingTrends for Smartphones 2021 Fan-OutWLP and PLP Applications and Technologies 2021 System-in-Package Technology 2021| Sample | www.yole.fr | ©2021 YOLE GROUP OF COMPANIES RELATED REPORTS Yole Développement Advanced Packaging Quarterly Market Monitor Status of the Advanced Packaging Industry 2020
  27. 27. 27 Contact our SalesTeam for more information 27 Contact our SalesTeam for more information 27 Contact our SalesTeam for more information HiSilicon Hi1382 Coherent Processor with ASE’s FOCoS Fan-Out Packaging Processes Comparison 2020 System-in-Package Technology 2021| Sample | www.yole.fr | ©2021 YOLE GROUP OF COMPANIES RELATED REPORTS System Plus Consulting NVIDIA A100 Ampere GPU Advanced System-in-Package Technology in Apple’s AirPods Pro
  28. 28. 28 Yole Group of Companies, including Yole Développement, System Plus Consulting and PISEO, are pleased to provide you a glimpse of our accumulated knowledge. We invite you to share our data with your own network, within your presentations, press releases, dedicated articles and more, but you first need approval from Yole Public Relations department. If you are interested, feel free to contact us right now! We will also be more than happy to give you updated data and appropriate formats. Your contact: Sandrine Leroy, Dir. Public Relations Email: leroy@yole.fr HOWTO USE OUR DATA? About Yole Développement | www.yole.fr | ©2021
  29. 29. 29 ©2019 | www.yole.fr | About Yole Développement YOLE DEVELOPPEMENT – FIELDS OF EXPERTISE WITHIN 3 MAIN DOMAINS Semiconductor & Software o Semiconductor Packaging and Substrates o Semiconductor Manufacturing o Memory o Computing and Software Power & Wireless o RF Devices & Technologies o Compound Semiconductors & Emerging Materials o Power Electronics o Batteries & Energy Management Photonics & Sensing o Photonics o Lighting o Imaging o Sensing & Actuating o Display About Yole Développement | www.yole.fr | ©2021
  30. 30. 30 About Yole Développement | www.yole.fr | ©2020 CONTACTS Western US & Canada Steve Laferriere - steve.laferriere@yole.fr + 1 310 600 8267 Eastern US & Canada ChrisYouman - chris.youman@yole.fr +1 919 607 9839 Europe and RoW Lizzie Levenez - lizzie.levenez@yole.fr +49 15 123 544 182 Benelux, UK & Spain Marine Wybranietz - marine.wybranietz@yole.fr +49 69 96 21 76 78 India and RoA Takashi Onozawa - takashi.onozawa@yole.fr +81 80 4371 4887 Greater China MavisWang - mavis.wang@yole.fr +886 979 336 809 +86 136 6156 6824 Korea Peter Ok - peter.ok@yole.fr +82 10 4089 0233 Japan Miho Ohtake - miho.ohtake@yole.fr +81 34 4059 204 Japan and Singapore Itsuyo Oshiba - itsuyo.oshiba@yole.fr +81 80 3577 3042 Japan Toru Hosaka – toru.hosaka@yole.fr +81 90 1775 3866 FINANCIAL SERVICES › Jean-Christophe Eloy - eloy@yole.fr +33 4 72 83 01 80 › Ivan Donaldson - ivan.donaldson@yole.fr +1 208 850 3914 CUSTOM PROJECT SERVICES › Jérome Azémar, Yole Développement - jerome.azemar@yole.fr - +33 6 27 68 69 33 › Julie Coulon, System Plus Consulting - jcoulon@systemplus.fr - +33 2 72 17 89 85 GENERAL › Sandrine Leroy, Public Relations sandrine.leroy@yole.fr - +33 4 72 83 01 89 › General inquiries: info@yole.fr - +33 4 72 83 01 80 Follow us on REPORTS, MONITORS &TRACKS About Yole Développement | www.yole.fr | ©2021

Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it. More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/

Views

Total views

295

On Slideshare

0

From embeds

0

Number of embeds

6

Actions

Downloads

21

Shares

0

Comments

0

Likes

0

×