Congatec_Global Vendor for Innovative Embedded Solutions_Ankara

The preferred global vendor for
innovative embedded solutions

Computer-On-Modules
Intel Intelligent Systems Workshop
Ankara April 5th 2012

Moshe Ramon
Moshe.ramon@congatec.com

Vision

The preferred global vendor for
innovative embedded solutions
to enable competitive advantages
for our customers.

Page 2 January 2012 © congatec AG

Who is congatec?

 The driver for innovation
and technology leadership

 Focused on Computer-On-Module
(COM) Technology
 Accelerating time-to-market for
x86-based embedded computer designs

 Intel Embedded Alliance Associate Member
 Technology Provider Platinum
 Embedded Building Block Initiative


congatec Facts

 Founded Dec. 2004
 Revenue 48 M€ (2011 prel.)
 Employees 124 (Dec 2011)
 Headquarter Deggendorf
 Subsidiaries San Diego (USA)
Taipei (TW)
Plzen, Brno (CZ)
 Sales Offices London, Paris, Stockholm, Tel Aviv
 Sales Partners worldwide
 Registered capital 3.6 M€


Entities & Partners


Partnerships

 Intel® Technology Provider - Platinum
 Intel® Embedded Alliance
 PICMG - Executive member
 COM Express design guide - editor
 COM Express Rev. 2.0 & 2.1 - editor
 Qseven - Founding member
 Specification & design guide editor
 XTX - Founding member
 Specification & design guide editor
 Microsoft Embedded Partner
 AMD Embedded Partner
 SGET (Standardization Group for Embedded Technology)
 Founder and board member


Module Concept
 Concept
 CPU board with standard PC core
functions
 Baseboard with customer specific
functions and size
 Customer benefits
 Reduced development costs
 Faster time to market
 Fast reaction on market trends
 Scalable product range
 Investment security
by technology upgrade
 Engineering resources can be
focused on system functions
 Second source philosophy


Product Portfolio
Qseven ETX/XTX COM Express COM Express
Compact Basic

Qseven ETX XTX COM Express COM Express
Compact Basic
LX800 x x x
915GME x x
945GME x x
US15W x x
US15WPT x
EG20 x x
945 + Atom™ x x x
GS45/GM45 x x
HM55/QM57 x
QM67 Type 2&6
AMD Fusion x x x x


Product Portfolio based on Intel

Technology
Progress
Core i3/5/7
3rd Gen.

2nd Gen. Core i3/5/7
QM/HM67

Core i3/5/7
QM57/HM55

Core2Duo
GM/GS45
2nd Gen. Atom
NM10
CoreDuo
945GME E6xx
EG20

Z5xx
US15W

2008 2009 2010 2011 2012 Time


conga-QA6
 conga-QA6 embedded computer
module features Intel® Atom™ E6xx
processor series

 Perfect solution for ultra mobile
applications that require extremely
reduced power consumption

 Extended temperature
-40 °C to +85 °C

 Dramatically improved
3D graphics performance

 Supports all essential interfaces
(3x PCIe, CAN, SPI... )


January 2012 © congatec AG

Conga-TM77/TS77 - 3rd Generation Intel® Core™

 COM Express, Rev. 2.0, Basic Size, Type 6 Pinout
 Highest Performance Module COM Express Type 6
 3rd Generation Intel® Core™ processor-based platform
 COM Express module with PCI Express, SATA, USB, HDMI
 Better transcode HD-HD, HD Video Conferencing
 Improved Graphics Performance, DirectX 11


Flexibility with powerful tools
 congatec Utilities and Advanced Feature Set
 congatec Operating System API
 congatec Board Controller
 Embedded BIOS
 congatec System Utility
 Firmware concept
congatec Board Controller

 Embedded Hardware Equipment
Multistage
Watchdog
 Debug Card Platform I2C
Controller
EEPROM

 Smart Battery Management Serial No.
EAN code Boot-
HW/FW rev. counter
 Software and Drivers Manuf. date
Repair. date
......
Running-
 Documentation Support time
meter
User Data


Software and Driver Support
 For the most important OS
 congatec offers advanced Board-
Support Packages
 With latest tested drivers from silicon
vendors
 Specific drivers for accessing all of
our additional embedded module
features


Embedded Hardware Equipment
 Complete Starter kits provides the ability to
start evaluating modules immediately
 conga-ADD2DP, provides two Display Port
and two HDMI interfaces
 conga-LDVI, DVI Converter Module to
convert LVDS to DVI-D
 conga-FPA2, Universal Flat Panel Adapter
for EPI


COM Express / Qseven Mini Carrier Board

• GB Ethernet
• SATA II
• Audio
• 6x USB 2.0
• LVDS 2x24 bit
• PCI Express x1
• Mini PCIe
• CFAST
• SD Card
• HDMI/DVI
• Smart Battery
Managment
Capability


New Heatspreader Concept
 New innovative heatspreader solution from congatec
 Reliable solution for vertically mounted applications
 Optimized applied pressure to silicon dies
 Utilizes reduced seepage gap pad material from Bergquist
 Patented design


congatec Cooling Pipes – new cooling solution

 Cooling is even more important
 With integrated Heat Pipes
 For unbridled processor
performance
 Turbo Boost 2
 Direct affect to performance

 Heat Pipe Solutions
 Up to 15°C advantage
 Improves MTBF up to 8x
 Available Versions
 Heatspreader
 Passive Cooling Solution
 Active Cooling Solution

 Higher Reliability


Support Packages

 End of Life Products
 Application Notes and Tech Notes
 congatec Documentation Videos
 Product Documentation
 Manuals
 Data sheets

 Return Merchandise Authorization


DSC1 - Digital Signage Controller


DSC1 – Design & Security Features
 Mounting between screen and VESA mechanics
 Maximum anti- theft security
 VESA 100 and 200
 Flat housing (30mm)

 Lockable cable housing
 For vandal protection

 Fanless and closed design
 Keeps dust out
 Immediate alarm feature
 In case of modifications or power loss

 Embedded product
 Industrial design
 Long term availability
 Modular design (COM Express based)
 Reliable 24/7 operation


DSC1 interface options
 For real time streaming
 2x 1GB Ethernet (repeater for up to 500m possible)
 WiFi, UMTS, GSM etc. with 2x internal MiniPCIe card slots

 Offline
 Internal SATA (for hard disk up to 1TB or SSD up to 512GB
 4x USB (therein 2xUSB3.0)
 eSATAp connector


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