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FLEXIBLE ELECTRONICS
SEMINAR ON
Presented by:
YALAGOUDA PATIL
OUTLINE
 Introduction
 Materials for flexible electronics
 Technologies involved processing
 Degree of flexibility
 Applications
 Advantages and Limitations
 Conclusion
INTRODUCTION
Ever evolving advances in thin-film
materials and devices have fueled
many of the developments in the
field of flexible electronics.
MATERIALS FOR FLEXIBLE
ELECTRONICS
A generic large-area electronic structure
is composed of
 Substrate
 backplane electronics
 Frontplane
 encapsulation
SUBSTRATES
Flexible substrates that are to serve as drop-in
replacements for plate glass substrates must meet
many requirements:
 Optical properties
 Surface roughness
 Thermal and thermomechanical properties
 Chemical properties
 Mechanical properties
 Electrical and magnetic properties
BACKPLANE ELECTRONICS
Backplanes provide or collect power and signal to
or from frontplanes. Backplanes may be passive or
active.
 Silicon Thin-Film Transistors
 Organic Thin-Film Transistors
 Materials for Interconnects and Contacts
BACKPLANE ELECTRONICS
FRONT PLANE TECHNOLOGIES
Frontplanes carry the specific optoelectronic
application.
 Liquid Crystal Displays
 Electrophoretic Displays
 Organic Light-Emitting Displays
 Sensors
TECHNOLOGIES AND
INTEGRATION PROCESSES
Any manufacturable device has four essential
characteristics:
 Superior and pre-specified performance, with
reproducibility, uniformity, and reliability;
 High yield to acceptable tolerance;
 Simulations exist for both reverse engineering
during development and right-first-time design;
 Proven adequate in-service lifetime.
FABRICATION TECHNOLOGY FOR
FLEXIBLE ELECTRONICS
 Fabrication on sheets by Batch Processing..
 On a rigid carrier, facing up and loose;
 In a tensioning frame, facing up or down;
 In a frame, facing down and loose
 Fabrication On Web by roll-to-roll Processing
 Additive Printing
BATCH AND ROLL TO ROLL FABRICATION
DEGREE OF FLEXIBILITY
Flexibility can mean many different properties
to manufacturers and users.
 Degree of flexibility is given by ε = d/2r.
 bendable or rollable
 permanently shaped
 elastically stretchable
EXAMPLES…
APPLICATIONS
 Holistic system design
 Health Care
OTHER APPLICATIONS
 Automotive Industries
 Displays and Human- machine interaction
 Energy management and mobile devices
 Wireless systems
 Electronics Embedded in the living environment
 Electronics for hostile environment etc..,
ADVANTAGES AND LIMITATIONS
Advantages:
 Size and weight
 Increased circuitry density
 Boundries of design and packaging
 Shape or to flex during its use
Limitations:
 Lifetime
 Manufacturing
 Water
 Battery
CONCLUSION
Based on the current socioeconomic trends, we
outlined some of the more likely technological
future needs and discussed the potential exploits of
thin-film flexible electronics in various market
sectors.
Flexible Electronics Seminar Materials Technologies Applications
Flexible Electronics Seminar Materials Technologies Applications

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Flexible Electronics Seminar Materials Technologies Applications

  • 2. OUTLINE  Introduction  Materials for flexible electronics  Technologies involved processing  Degree of flexibility  Applications  Advantages and Limitations  Conclusion
  • 3. INTRODUCTION Ever evolving advances in thin-film materials and devices have fueled many of the developments in the field of flexible electronics.
  • 4. MATERIALS FOR FLEXIBLE ELECTRONICS A generic large-area electronic structure is composed of  Substrate  backplane electronics  Frontplane  encapsulation
  • 5. SUBSTRATES Flexible substrates that are to serve as drop-in replacements for plate glass substrates must meet many requirements:  Optical properties  Surface roughness  Thermal and thermomechanical properties  Chemical properties  Mechanical properties  Electrical and magnetic properties
  • 6. BACKPLANE ELECTRONICS Backplanes provide or collect power and signal to or from frontplanes. Backplanes may be passive or active.  Silicon Thin-Film Transistors  Organic Thin-Film Transistors  Materials for Interconnects and Contacts
  • 8. FRONT PLANE TECHNOLOGIES Frontplanes carry the specific optoelectronic application.  Liquid Crystal Displays  Electrophoretic Displays  Organic Light-Emitting Displays  Sensors
  • 9. TECHNOLOGIES AND INTEGRATION PROCESSES Any manufacturable device has four essential characteristics:  Superior and pre-specified performance, with reproducibility, uniformity, and reliability;  High yield to acceptable tolerance;  Simulations exist for both reverse engineering during development and right-first-time design;  Proven adequate in-service lifetime.
  • 10.
  • 11. FABRICATION TECHNOLOGY FOR FLEXIBLE ELECTRONICS  Fabrication on sheets by Batch Processing..  On a rigid carrier, facing up and loose;  In a tensioning frame, facing up or down;  In a frame, facing down and loose  Fabrication On Web by roll-to-roll Processing  Additive Printing
  • 12. BATCH AND ROLL TO ROLL FABRICATION
  • 13. DEGREE OF FLEXIBILITY Flexibility can mean many different properties to manufacturers and users.  Degree of flexibility is given by ε = d/2r.  bendable or rollable  permanently shaped  elastically stretchable
  • 17. OTHER APPLICATIONS  Automotive Industries  Displays and Human- machine interaction  Energy management and mobile devices  Wireless systems  Electronics Embedded in the living environment  Electronics for hostile environment etc..,
  • 18. ADVANTAGES AND LIMITATIONS Advantages:  Size and weight  Increased circuitry density  Boundries of design and packaging  Shape or to flex during its use Limitations:  Lifetime  Manufacturing  Water  Battery
  • 19. CONCLUSION Based on the current socioeconomic trends, we outlined some of the more likely technological future needs and discussed the potential exploits of thin-film flexible electronics in various market sectors.